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Total Products: 5,357
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
STM32MP157CAB3
STM32MP157CAB3STMicroelectronicsIC MPU STM32MP1 650MHZ 354LFBGAMicroprocessors354-LFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
354-LFBGA
Supplier Device Package:
354-LFBGA (16×16)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
1,228
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STM32MP157CAB3T
STM32MP157CAB3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 354LFBGAMicroprocessors354-LFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
354-LFBGA
Supplier Device Package:
354-LFBGA (16×16)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
279
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STM32MP157CAC3
STM32MP157CAC3STMicroelectronicsIC MPU STM32MP1 650MHZ 361TFBGAMicroprocessors361-TFBGA (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
361-TFBGA
Supplier Device Package:
361-TFBGA (12×12)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
421
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QUOTE
STM32MP157CAC3T
STM32MP157CAC3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 361TFBGAMicroprocessors361-TFBGA (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
361-TFBGA
Supplier Device Package:
361-TFBGA (12×12)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
259
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QUOTE
STM32MP157CAD3
STM32MP157CAD3STMicroelectronicsIC MPU STM32MP1 650MHZ 257TFBGAMicroprocessors257-TFBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
257-TFBGA
Supplier Device Package:
257-TFBGA (10×10)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
498
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QUOTE
STM32MP157CAD3T
STM32MP157CAD3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 257TFBGAMicroprocessors257-TFBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
257-TFBGA
Supplier Device Package:
257-TFBGA (10×10)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
1,042
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QUOTE
STM32MP157DAA1
STM32MP157DAA1STMicroelectronicsIC MPU STM32MP1 800MHZ 448LFBGAMicroprocessors448-LFBGA (18x18)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
448-LFBGA
Supplier Device Package:
448-LFBGA (18×18)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
960
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QUOTE
STM32MP157DAB1
STM32MP157DAB1STMicroelectronicsIC MPU STM32MP1 800MHZ 354LFBGAMicroprocessors354-LFBGA (16x16)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
354-LFBGA
Supplier Device Package:
354-LFBGA (16×16)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
766
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QUOTE
STM32MP157DAC1
STM32MP157DAC1STMicroelectronicsIC MPU STM32MP1 800MHZ 361TFBGAMicroprocessors361-TFBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
361-TFBGA
Supplier Device Package:
361-TFBGA (12×12)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
440
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QUOTE
STM32MP157DAD1
STM32MP157DAD1STMicroelectronicsIC MPU STM32MP1 800MHZ 257TFBGAMicroprocessors257-TFBGA (10x10)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
257-TFBGA
Supplier Device Package:
257-TFBGA (10×10)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
124
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QUOTE
STM32MP157FAA1
STM32MP157FAA1STMicroelectronicsIC MPU STM32MP1 800MHZ 448LFBGAMicroprocessors448-LFBGA (18x18)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
448-LFBGA
Supplier Device Package:
448-LFBGA (18×18)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
721
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QUOTE
STM32MP157FAB1
STM32MP157FAB1STMicroelectronicsIC MPU STM32MP1 800MHZ 354LFBGAMicroprocessors354-LFBGA (16x16)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
354-LFBGA
Supplier Device Package:
354-LFBGA (16×16)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
683
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QUOTE
STM32MP157FAC1
STM32MP157FAC1STMicroelectronicsIC MPU STM32MP1 800MHZ 361TFBGAMicroprocessors361-TFBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
361-TFBGA
Supplier Device Package:
361-TFBGA (12×12)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
949
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QUOTE
STM32MP157FAD1
STM32MP157FAD1STMicroelectronicsIC MPU STM32MP1 800MHZ 257TFBGAMicroprocessors257-TFBGA (10x10)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
257-TFBGA
Supplier Device Package:
257-TFBGA (10×10)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
1,138
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QUOTE
SVF311R3K1CKU2
SVF311R3K1CKU2NXP SemiconductorsIC MPU VYBRID 266MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
146
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QUOTE
SVF311R3K2CKU2
SVF311R3K2CKU2NXP SemiconductorsIC MPU VYBRID 266MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,085
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QUOTE
SVF312R3K1CKU2N/ASVF312R3K1CKU2NXP SemiconductorsIC MPU VYBRID 266MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
880
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QUOTE
SVF312R3K2CKU2
SVF312R3K2CKU2NXP SemiconductorsIC MPU VYBRID 266MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,290
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QUOTE
SVF321R3K1CKU2N/ASVF321R3K1CKU2NXP SemiconductorsIC MPU VYBRID 133MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
266MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
303
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QUOTE
SVF321R3K2CKU2
SVF321R3K2CKU2NXP SemiconductorsIC MPU VYBRID 133MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
266MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
717
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QUOTE

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