STM32MP157CAC3
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12) |
|---|---|
| Quantity | 288 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP157 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 361-TFBGA (12x12) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps, GbE | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TA) | Package / Case | 361-TFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 650MHz | Supplier Device Package | 361-TFBGA (12×12) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP157CAC3 – IC MPU STM32MP1 650MHZ 361TFBGA
The STM32MP157CAC3 from STMicroelectronics is an STM32MP1-series microprocessor integrating ARM® Cortex®-A7 processing cores with an ARM® Cortex®-M4 coprocessor. The device listing includes a core speed entry of 209 MHz and is presented in a 361-TFBGA (12×12) package.
Designed for embedded applications requiring integrated memory interfaces, display and networking peripherals, and hardware security features, the device consolidates multiple system functions to simplify board-level design and software partitioning.
Key Features
- Core and Coprocessor Dual ARM® Cortex®-A7 32-bit processing cores and an ARM® Cortex®-M4 coprocessor provide separated application and real-time processing domains.
- Listed Core Speed The product data lists a core speed of 209 MHz for the Cortex-A7 processing domain.
- Memory Interfaces Built-in memory controller support for DDR3, DDR3L, LPDDR2 and LPDDR3 simplifies high-bandwidth system memory integration.
- Display and Graphics Display interface controllers include HDMI-CEC and LCD support, and the device indicates graphics acceleration to handle GUI and display tasks.
- Connectivity Integrated Ethernet options include 10/100 Mbps and GbE, and USB connectivity comprises two USB 2.0 ports plus USB 2.0 OTG with PHY capability (three ports indicated).
- Automotive-Grade Temperature Range Qualified for operation from -40 °C to 125 °C, enabling use in temperature-demanding embedded environments.
- Security ARM TrustZone (ARM TZ) security feature is listed to support secure execution environments.
- Additional Interfaces On-chip CAN interface support and multiple peripheral options reduce external interface IC requirements.
- Package and Mounting Supplied in a 361-TFBGA (12×12) surface-mount package for compact board designs.
Typical Applications
- Human–Machine Interfaces Display controllers and graphics acceleration enable GUI panels and integrated display systems.
- Networked Embedded Gateways GbE and 10/100 Mbps Ethernet plus multiple USB ports support networking and peripheral connectivity for gateway and edge devices.
- Industrial Control CAN interface and wide operating temperature range make the device suitable for industrial control and monitoring systems.
- Real-Time Co-Processing The Cortex-M4 coprocessor provides a dedicated real-time domain for deterministic control tasks alongside application processing.
Unique Advantages
- Heterogeneous Processing Combined Cortex-A7 and Cortex-M4 cores allow separation of application and real-time workloads on a single chip.
- Integrated Memory Support Native DDR3/DDR3L/LPDDR2/LPDDR3 controller support reduces external memory interface engineering and BOM complexity.
- Comprehensive I/O Set Built-in Ethernet, multiple USB ports including OTG with PHY, and CAN reduce the need for discrete connectivity components.
- Security Hardware ARM TrustZone support provides a hardware foundation for partitioned secure execution and trusted applications.
- Compact Surface-Mount Package The 361-TFBGA (12×12) package enables high-density board layouts for space-constrained designs.
- Extended Temperature Operation Rated for -40 °C to 125 °C operation to meet thermal requirements of demanding embedded deployments.
Why Choose STM32MP157CAC3?
The STM32MP157CAC3 brings multi-domain processing, integrated memory controllers, rich connectivity and hardware security into a single 361-TFBGA package. It is positioned for embedded designs that need consolidated system functions—display, networking, peripheral I/O and real-time control—while keeping board-level integration straightforward.
This device is suited to engineers seeking a compact, feature-rich MPU with on-chip graphics support, multiple memory options and a broad set of interfaces. Its combination of processing domains and integrated peripherals supports scalable designs that separate application and control tasks while minimizing external components.
Request a quote or submit an inquiry to receive pricing, availability and technical purchasing support for the STM32MP157CAC3.

Date Founded: 1987
Headquarters: Plan-les-Ouates, Geneva, Switzerland
Employees: 50,000+
Revenue: $17.24 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO45001:2018, IATF16949:2016, ISO50001:2018