STM32MP157CAC3

IC MPU STM32MP1 650MHZ 361TFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12)

Quantity 288 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP157
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package361-TFBGA (12x12)
Display & Interface ControllersHDMI-CEC, LCDECCN5A992CEthernet10/100Mbps, GbE
GradeAutomotiveGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TA)Package / Case361-TFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package361-TFBGA (12×12)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP157CAC3 – IC MPU STM32MP1 650MHZ 361TFBGA

The STM32MP157CAC3 from STMicroelectronics is an STM32MP1-series microprocessor integrating ARM® Cortex®-A7 processing cores with an ARM® Cortex®-M4 coprocessor. The device listing includes a core speed entry of 209 MHz and is presented in a 361-TFBGA (12×12) package.

Designed for embedded applications requiring integrated memory interfaces, display and networking peripherals, and hardware security features, the device consolidates multiple system functions to simplify board-level design and software partitioning.

Key Features

  • Core and Coprocessor  Dual ARM® Cortex®-A7 32-bit processing cores and an ARM® Cortex®-M4 coprocessor provide separated application and real-time processing domains.
  • Listed Core Speed  The product data lists a core speed of 209 MHz for the Cortex-A7 processing domain.
  • Memory Interfaces  Built-in memory controller support for DDR3, DDR3L, LPDDR2 and LPDDR3 simplifies high-bandwidth system memory integration.
  • Display and Graphics  Display interface controllers include HDMI-CEC and LCD support, and the device indicates graphics acceleration to handle GUI and display tasks.
  • Connectivity  Integrated Ethernet options include 10/100 Mbps and GbE, and USB connectivity comprises two USB 2.0 ports plus USB 2.0 OTG with PHY capability (three ports indicated).
  • Automotive-Grade Temperature Range  Qualified for operation from -40 °C to 125 °C, enabling use in temperature-demanding embedded environments.
  • Security  ARM TrustZone (ARM TZ) security feature is listed to support secure execution environments.
  • Additional Interfaces  On-chip CAN interface support and multiple peripheral options reduce external interface IC requirements.
  • Package and Mounting  Supplied in a 361-TFBGA (12×12) surface-mount package for compact board designs.

Typical Applications

  • Human–Machine Interfaces  Display controllers and graphics acceleration enable GUI panels and integrated display systems.
  • Networked Embedded Gateways  GbE and 10/100 Mbps Ethernet plus multiple USB ports support networking and peripheral connectivity for gateway and edge devices.
  • Industrial Control  CAN interface and wide operating temperature range make the device suitable for industrial control and monitoring systems.
  • Real-Time Co-Processing  The Cortex-M4 coprocessor provides a dedicated real-time domain for deterministic control tasks alongside application processing.

Unique Advantages

  • Heterogeneous Processing  Combined Cortex-A7 and Cortex-M4 cores allow separation of application and real-time workloads on a single chip.
  • Integrated Memory Support  Native DDR3/DDR3L/LPDDR2/LPDDR3 controller support reduces external memory interface engineering and BOM complexity.
  • Comprehensive I/O Set  Built-in Ethernet, multiple USB ports including OTG with PHY, and CAN reduce the need for discrete connectivity components.
  • Security Hardware  ARM TrustZone support provides a hardware foundation for partitioned secure execution and trusted applications.
  • Compact Surface-Mount Package  The 361-TFBGA (12×12) package enables high-density board layouts for space-constrained designs.
  • Extended Temperature Operation  Rated for -40 °C to 125 °C operation to meet thermal requirements of demanding embedded deployments.

Why Choose STM32MP157CAC3?

The STM32MP157CAC3 brings multi-domain processing, integrated memory controllers, rich connectivity and hardware security into a single 361-TFBGA package. It is positioned for embedded designs that need consolidated system functions—display, networking, peripheral I/O and real-time control—while keeping board-level integration straightforward.

This device is suited to engineers seeking a compact, feature-rich MPU with on-chip graphics support, multiple memory options and a broad set of interfaces. Its combination of processing domains and integrated peripherals supports scalable designs that separate application and control tasks while minimizing external components.

Request a quote or submit an inquiry to receive pricing, availability and technical purchasing support for the STM32MP157CAC3.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1987


    Headquarters: Plan-les-Ouates, Geneva, Switzerland


    Employees: 50,000+


    Revenue: $17.24 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO45001:2018, IATF16949:2016, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up