STM32MP157CAB3
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 354-LFBGA (16x16) |
|---|---|
| Quantity | 606 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP157 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 354-LFBGA (16x16) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | PENDING ECCN | Ethernet | 10/100Mbps, GbE | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | 0000.00.0000 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TA) | Package / Case | 354-LFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 650MHz | Supplier Device Package | 354-LFBGA (16×16) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP157CAB3 – IC MPU STM32MP1 650MHZ 354LFBGA
The STM32MP157CAB3 is an ARM® Cortex®-A7 microprocessor IC configured with two 32-bit cores. Specifications list a core speed of 209 MHz while the product name references 650 MHz; consult project requirements for the appropriate performance target.
Designed for embedded applications, this device combines dual-core Cortex-A7 processing with an ARM® Cortex®-M4 coprocessor, on-chip display controllers and multiple connectivity options to support integrated multimedia, connectivity and secure embedded designs.
Key Features
- Core Dual ARM® Cortex®-A7 cores with 32-bit bus width; includes an ARM® Cortex®-M4 coprocessor for offloaded real-time tasks.
- Memory support Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory controllers for flexible system memory configurations.
- Display and graphics Integrated display interface controllers including HDMI-CEC and LCD plus graphics acceleration to support visual user interfaces.
- Connectivity Ethernet options listed as 10/100 Mbps and GbE, plus multiple USB interfaces (USB 2.0 (2) and USB 2.0 OTG+PHY (3)) and CAN for robust peripheral connectivity.
- Security ARM TrustZone (ARM TZ) listed as a security feature to enable system-level isolation and trusted execution partitions.
- Package and mounting 354-LFBGA package (16 × 16 mm) with surface-mount mounting type for compact PCB integration.
- Operating range Rated operating temperature from −40 °C to 125 °C for use in thermally demanding embedded environments.
- Graphics acceleration Graphics acceleration is included to assist in rendering and UI tasks.
Typical Applications
- Embedded multimedia systems Use the integrated display controllers and graphics acceleration to drive LCD or HDMI-based user interfaces and media playback.
- Industrial control Combine dual-core processing, the Cortex-M4 coprocessor and CAN connectivity for deterministic control and fieldbus interfacing.
- Networked devices Leverage GbE and 10/100 Mbps Ethernet together with multiple USB ports for gateways, routers or connected appliances.
- Secure embedded platforms Employ ARM TrustZone to partition secure and non-secure software domains in systems requiring isolation and protected execution.
Unique Advantages
- Balanced compute and real-time offload: Dual Cortex‑A7 application cores with an integrated Cortex‑M4 coprocessor enable separation of high-level processing and real-time tasks.
- Flexible memory options: Support for DDR3, DDR3L, LPDDR2 and LPDDR3 memory controllers simplifies BOM choices across performance and power targets.
- Rich connectivity suite: Ethernet (10/100 and GbE), multiple USB ports and CAN provide broad peripheral and network interfacing without external bridges.
- Integrated display capability: HDMI‑CEC and LCD controllers plus graphics acceleration reduce the need for discrete display controllers.
- Wide operating temperature: −40 °C to 125 °C operating range supports deployment in thermally challenging embedded environments.
- Compact package: 354‑LFBGA (16×16 mm) surface-mount package enables dense board layouts for space-constrained designs.
Why Choose STM32MP157CAB3?
The STM32MP157CAB3 positions itself as an integrated embedded microprocessor solution combining dual ARM® Cortex®-A7 cores, an ARM® Cortex®-M4 coprocessor, broad memory support and multiple display and connectivity interfaces. Its feature set supports designs that require on-chip graphics and display control, secure execution domains and a flexible I/O mix.
This part is suited to engineers building embedded systems that need a compact package, extended temperature range and a variety of connectivity and memory options. The combination of processing, graphics and security features provides a scalable platform for long-term projects that benefit from a consolidated hardware footprint.
Request a quote or submit a pricing inquiry to receive availability and ordering information for the STM32MP157CAB3.

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