STM32MP157CAB3

IC MPU STM32MP1 650MHZ 354LFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 354-LFBGA (16x16)

Quantity 606 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP157
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package354-LFBGA (16x16)
Display & Interface ControllersHDMI-CEC, LCDECCNPENDING ECCNEthernet10/100Mbps, GbE
GradeAutomotiveGraphics AccelerationYesHTS Code0000.00.0000
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TA)Package / Case354-LFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package354-LFBGA (16×16)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP157CAB3 – IC MPU STM32MP1 650MHZ 354LFBGA

The STM32MP157CAB3 is an ARM® Cortex®-A7 microprocessor IC configured with two 32-bit cores. Specifications list a core speed of 209 MHz while the product name references 650 MHz; consult project requirements for the appropriate performance target.

Designed for embedded applications, this device combines dual-core Cortex-A7 processing with an ARM® Cortex®-M4 coprocessor, on-chip display controllers and multiple connectivity options to support integrated multimedia, connectivity and secure embedded designs.

Key Features

  • Core  Dual ARM® Cortex®-A7 cores with 32-bit bus width; includes an ARM® Cortex®-M4 coprocessor for offloaded real-time tasks.
  • Memory support  Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory controllers for flexible system memory configurations.
  • Display and graphics  Integrated display interface controllers including HDMI-CEC and LCD plus graphics acceleration to support visual user interfaces.
  • Connectivity  Ethernet options listed as 10/100 Mbps and GbE, plus multiple USB interfaces (USB 2.0 (2) and USB 2.0 OTG+PHY (3)) and CAN for robust peripheral connectivity.
  • Security  ARM TrustZone (ARM TZ) listed as a security feature to enable system-level isolation and trusted execution partitions.
  • Package and mounting  354-LFBGA package (16 × 16 mm) with surface-mount mounting type for compact PCB integration.
  • Operating range  Rated operating temperature from −40 °C to 125 °C for use in thermally demanding embedded environments.
  • Graphics acceleration  Graphics acceleration is included to assist in rendering and UI tasks.

Typical Applications

  • Embedded multimedia systems  Use the integrated display controllers and graphics acceleration to drive LCD or HDMI-based user interfaces and media playback.
  • Industrial control  Combine dual-core processing, the Cortex-M4 coprocessor and CAN connectivity for deterministic control and fieldbus interfacing.
  • Networked devices  Leverage GbE and 10/100 Mbps Ethernet together with multiple USB ports for gateways, routers or connected appliances.
  • Secure embedded platforms  Employ ARM TrustZone to partition secure and non-secure software domains in systems requiring isolation and protected execution.

Unique Advantages

  • Balanced compute and real-time offload: Dual Cortex‑A7 application cores with an integrated Cortex‑M4 coprocessor enable separation of high-level processing and real-time tasks.
  • Flexible memory options: Support for DDR3, DDR3L, LPDDR2 and LPDDR3 memory controllers simplifies BOM choices across performance and power targets.
  • Rich connectivity suite: Ethernet (10/100 and GbE), multiple USB ports and CAN provide broad peripheral and network interfacing without external bridges.
  • Integrated display capability: HDMI‑CEC and LCD controllers plus graphics acceleration reduce the need for discrete display controllers.
  • Wide operating temperature: −40 °C to 125 °C operating range supports deployment in thermally challenging embedded environments.
  • Compact package: 354‑LFBGA (16×16 mm) surface-mount package enables dense board layouts for space-constrained designs.

Why Choose STM32MP157CAB3?

The STM32MP157CAB3 positions itself as an integrated embedded microprocessor solution combining dual ARM® Cortex®-A7 cores, an ARM® Cortex®-M4 coprocessor, broad memory support and multiple display and connectivity interfaces. Its feature set supports designs that require on-chip graphics and display control, secure execution domains and a flexible I/O mix.

This part is suited to engineers building embedded systems that need a compact package, extended temperature range and a variety of connectivity and memory options. The combination of processing, graphics and security features provides a scalable platform for long-term projects that benefit from a consolidated hardware footprint.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the STM32MP157CAB3.

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