STM32MP157CAA3T

IC MPU STM32MP1 650MHZ 448LFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 448-LFBGA (18x18)

Quantity 601 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP157
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package448-LFBGA (18x18)
Display & Interface ControllersHDMI-CEC, LCDECCN5A992CEthernet10/100Mbps, GbE
GradeAutomotiveGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TA)Package / Case448-LFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package448-LFBGA (18×18)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP157CAA3T – IC MPU STM32MP1 650MHZ 448LFBGA

The STM32MP157CAA3T is a microprocessor IC from the STM32MP1 family featuring ARM® Cortex®-A7 processing and an ARM® Cortex®-M4 co-processor. Product data for this part lists dual 32‑bit cores and includes speed values of 209 MHz and 650 MHz.

Designed for embedded systems, the device integrates multiple memory controller options, a range of high-speed and vehicle-style interfaces, security features, and graphics/display support to simplify system design and integration.

Key Features

  • Core & Architecture  ARM® Cortex®-A7 main processor cores (2 Core, 32‑Bit) with an ARM® Cortex®-M4 co‑processor for offloading real-time tasks.
  • Core Speeds  Product data lists core frequency values of 209 MHz and 650 MHz.
  • Memory Interfaces  Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to match a variety of system memory configurations.
  • Display & Graphics  Includes LCD and HDMI-CEC display interface controllers and graphics acceleration support for visual user interfaces.
  • Connectivity  Ethernet options (10/100Mbps and GbE), USB 2.0 ports (including OTG+PHY), and CAN interface support provide broad I/O flexibility.
  • Security  ARM TrustZone (ARM TZ) security feature is included to support system-level security partitioning.
  • Package & Mounting  Supplied in a 448‑LFBGA (18×18) surface-mount package for compact board integration.
  • Operating Temperature  Rated for operation from −40 °C to 125 °C to accommodate wide-temperature embedded environments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Heterogeneous embedded processing  Dual ARM® Cortex®-A7 cores with an ARM® Cortex®-M4 co-processor enable separation of application and real-time tasks within a single device.
  • Graphical user interfaces  LCD and HDMI-CEC controllers together with graphics acceleration support development of visual displays and human-machine interfaces.
  • Networked and connected devices  Built-in Ethernet, multiple USB 2.0 ports (including OTG+PHY) and CAN provide flexible connectivity for networked embedded systems.

Unique Advantages

  • Heterogeneous compute model: Combines dual ARM® Cortex®-A7 cores with an ARM® Cortex®-M4 co-processor for workload partitioning and efficient real-time processing.
  • Flexible memory support: On-chip controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 allow tailoring memory choices to performance and power targets.
  • Integrated multimedia interfaces: Native LCD and HDMI-CEC controllers plus graphics acceleration reduce external component count for display-centric designs.
  • Broad connectivity: Multiple USB ports (including OTG+PHY), 10/100Mbps and Gigabit Ethernet, and CAN support diverse I/O requirements without extensive external bridges.
  • Security foundation: ARM TrustZone (ARM TZ) provides a hardware security feature set to help segment secure and non-secure software domains.
  • Wide temperature capability: −40 °C to 125 °C operating range supports deployment in thermally demanding embedded environments.

Why Choose STM32MP157CAA3T?

The STM32MP157CAA3T combines dual ARM® Cortex®-A7 processing with an ARM® Cortex®-M4 co-processor and a comprehensive set of memory, display, and connectivity interfaces to deliver a compact, integrated platform for embedded applications. Its set of features supports designs that require mixed application and real-time processing, display capability, and multiple network interfaces.

This part is suitable for engineers seeking a highly integrated microprocessor solution with hardware security features, flexible memory options, and a compact 448‑LFBGA package, backed by RoHS compliance and wide operating temperature support.

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