STM32MP157CAA3T
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 448-LFBGA (18x18) |
|---|---|
| Quantity | 601 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP157 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 448-LFBGA (18x18) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps, GbE | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TA) | Package / Case | 448-LFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 650MHz | Supplier Device Package | 448-LFBGA (18×18) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP157CAA3T – IC MPU STM32MP1 650MHZ 448LFBGA
The STM32MP157CAA3T is a microprocessor IC from the STM32MP1 family featuring ARM® Cortex®-A7 processing and an ARM® Cortex®-M4 co-processor. Product data for this part lists dual 32‑bit cores and includes speed values of 209 MHz and 650 MHz.
Designed for embedded systems, the device integrates multiple memory controller options, a range of high-speed and vehicle-style interfaces, security features, and graphics/display support to simplify system design and integration.
Key Features
- Core & Architecture ARM® Cortex®-A7 main processor cores (2 Core, 32‑Bit) with an ARM® Cortex®-M4 co‑processor for offloading real-time tasks.
- Core Speeds Product data lists core frequency values of 209 MHz and 650 MHz.
- Memory Interfaces Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to match a variety of system memory configurations.
- Display & Graphics Includes LCD and HDMI-CEC display interface controllers and graphics acceleration support for visual user interfaces.
- Connectivity Ethernet options (10/100Mbps and GbE), USB 2.0 ports (including OTG+PHY), and CAN interface support provide broad I/O flexibility.
- Security ARM TrustZone (ARM TZ) security feature is included to support system-level security partitioning.
- Package & Mounting Supplied in a 448‑LFBGA (18×18) surface-mount package for compact board integration.
- Operating Temperature Rated for operation from −40 °C to 125 °C to accommodate wide-temperature embedded environments.
- Environmental Compliance RoHS compliant.
Typical Applications
- Heterogeneous embedded processing Dual ARM® Cortex®-A7 cores with an ARM® Cortex®-M4 co-processor enable separation of application and real-time tasks within a single device.
- Graphical user interfaces LCD and HDMI-CEC controllers together with graphics acceleration support development of visual displays and human-machine interfaces.
- Networked and connected devices Built-in Ethernet, multiple USB 2.0 ports (including OTG+PHY) and CAN provide flexible connectivity for networked embedded systems.
Unique Advantages
- Heterogeneous compute model: Combines dual ARM® Cortex®-A7 cores with an ARM® Cortex®-M4 co-processor for workload partitioning and efficient real-time processing.
- Flexible memory support: On-chip controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 allow tailoring memory choices to performance and power targets.
- Integrated multimedia interfaces: Native LCD and HDMI-CEC controllers plus graphics acceleration reduce external component count for display-centric designs.
- Broad connectivity: Multiple USB ports (including OTG+PHY), 10/100Mbps and Gigabit Ethernet, and CAN support diverse I/O requirements without extensive external bridges.
- Security foundation: ARM TrustZone (ARM TZ) provides a hardware security feature set to help segment secure and non-secure software domains.
- Wide temperature capability: −40 °C to 125 °C operating range supports deployment in thermally demanding embedded environments.
Why Choose STM32MP157CAA3T?
The STM32MP157CAA3T combines dual ARM® Cortex®-A7 processing with an ARM® Cortex®-M4 co-processor and a comprehensive set of memory, display, and connectivity interfaces to deliver a compact, integrated platform for embedded applications. Its set of features supports designs that require mixed application and real-time processing, display capability, and multiple network interfaces.
This part is suitable for engineers seeking a highly integrated microprocessor solution with hardware security features, flexible memory options, and a compact 448‑LFBGA package, backed by RoHS compliance and wide operating temperature support.
Request a quote or submit an inquiry to receive pricing and availability for the STM32MP157CAA3T.

Date Founded: 1987
Headquarters: Plan-les-Ouates, Geneva, Switzerland
Employees: 50,000+
Revenue: $17.24 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO45001:2018, IATF16949:2016, ISO50001:2018