STM32MP157AAD3
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 257-TFBGA (10x10) |
|---|---|
| Quantity | 244 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP157 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 257-TFBGA (10x10) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | 3A991A2 | Ethernet | 10/100Mbps, GbE | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 257-TFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 650MHz | Supplier Device Package | 257-TFBGA (10×10) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP157AAD3 – IC MPU STM32MP1 650MHZ 257TFBGA
The STM32MP157AAD3 from STMicroelectronics is a microprocessor for embedded applications in the STM32MP157 series. It integrates a dual ARM® Cortex®-A7 core subsystem (2 cores, 32-bit) running at 209 MHz and an ARM® Cortex®-M4 coprocessor to support mixed application and real-time tasks.
Designed for compact embedded designs, the device provides on-chip support for multiple memory types, display interfaces, Ethernet, USB, CAN and hardware security (ARM TZ), alongside graphics acceleration and a wide operating temperature range for demanding environments.
Key Features
- Core and Coprocessor Dual ARM® Cortex®-A7 32-bit cores (2-core) at 209 MHz with an ARM® Cortex®-M4 coprocessor for combined application and real-time processing.
- Memory Controllers Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to match performance and power targets for different system designs.
- Display and Graphics Integrated display interface controllers including HDMI-CEC and LCD plus graphics acceleration for user interfaces and multimedia.
- Connectivity Ethernet options including 10/100 Mbps and GbE, multiple USB 2.0 ports and USB 2.0 OTG+PHY, and CAN for flexible I/O and networking.
- Security Hardware security support with ARM TrustZone (ARM TZ) for secure execution and trusted software domains.
- Package and Mounting Supplied in a 257-TFBGA (10×10) package with surface-mount mounting for compact board layouts.
- Operating Range and Compliance Wide operating temperature range from -40 °C to 125 °C and RoHS compliant.
Typical Applications
- Embedded Systems General embedded control and application processing that benefit from dual Cortex-A7 cores and an M4 coprocessor.
- Human–Machine Interfaces (HMI) Devices requiring LCD or HDMI-CEC display support and graphics acceleration for responsive user interfaces.
- Industrial Control Control systems leveraging CAN connectivity and wide operating temperature range for deployment in harsh environments.
- Networking and Gateways Networked appliances and gateways using built-in 10/100 Mbps and GbE Ethernet plus multiple USB interfaces.
Unique Advantages
- Integrated Heterogeneous Processing: Dual Cortex-A7 cores combined with a Cortex-M4 coprocessor allow separation of application and real-time tasks on a single device.
- Broad Memory Support: Native controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 provide design flexibility across performance and power targets.
- Comprehensive Connectivity: On-chip Ethernet (10/100 Mbps and GbE), multiple USB ports including OTG+PHY and CAN reduce external peripheral requirements.
- Secure Execution: ARM TrustZone (ARM TZ) enables hardware-isolated secure domains for trusted software and data.
- Rugged Operating Range: Rated for -40 °C to 125 °C operation to support deployment in temperature-challenging environments.
- Compact Packaging: 257-TFBGA (10×10) surface-mount package suitable for space-constrained PCB designs.
Why Choose STM32MP157AAD3?
The STM32MP157AAD3 delivers a balanced combination of application processing, real-time control and integrated peripherals suitable for a wide range of embedded designs. Its dual Cortex-A7 cores together with a Cortex-M4 coprocessor, flexible memory support and rich I/O set provide a compact, integrated platform for designers who need mixed-processing capability and multiple connectivity options.
Manufactured by STMicroelectronics and supported by available product documentation, the device is appropriate for projects that require secure execution, display capabilities and robust thermal performance, while minimizing external interface components.
Request a quote or submit a pricing inquiry today to evaluate the STM32MP157AAD3 for your next embedded design.

Date Founded: 1987
Headquarters: Plan-les-Ouates, Geneva, Switzerland
Employees: 50,000+
Revenue: $17.24 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO45001:2018, IATF16949:2016, ISO50001:2018