STM32MP157AAC3

IC MPU STM32MP1 650MHZ 361TFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12)

Quantity 492 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP157
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package361-TFBGA (12x12)
Display & Interface ControllersHDMI-CEC, LCDECCN3A991A2Ethernet10/100Mbps, GbE
GradeAutomotiveGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case361-TFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package361-TFBGA (12×12)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP157AAC3 – IC MPU STM32MP1 650MHZ 361TFBGA

The STM32MP157AAC3 is a microprocessor IC from the STM32MP157 series by STMicroelectronics. It integrates an ARM® Cortex®-A7 dual-core 32-bit main processor and an ARM® Cortex®-M4 co-processor, delivering a combination of application processing and real-time control capabilities.

Designed for embedded systems that require integrated graphics, multimedia display interfaces and diverse connectivity, the device offers a compact 361‑TFBGA (12×12) package and broad memory interface support to simplify system design and integration.

Key Features

  • Core & Co-processor Dual ARM® Cortex®-A7 32‑bit main cores (2 cores) with a listed core speed of 209 MHz, plus an ARM® Cortex®-M4 co-processor for real-time tasks.
  • Memory Interfaces Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to support varied system memory architectures.
  • Display & Graphics Graphics acceleration with display interface controllers including HDMI‑CEC and LCD to support graphical user interfaces and display output.
  • Connectivity Ethernet support (10/100 Mbps and Gigabit Ethernet), multiple USB ports (USB 2.0 (2) and USB 2.0 OTG + PHY (3)) and additional CAN interface provide broad wired connectivity options.
  • Security Hardware security features including ARM TrustZone (ARM TZ) to enable platform-level security partitioning.
  • Package & Mounting 361‑TFBGA supplier device package (12×12) in a surface-mount form factor for compact system integration.
  • Operating Range Extended operating temperature range from -40 °C to 125 °C for deployment in thermally demanding environments.
  • Grade Specified grade: Automotive.

Typical Applications

  • HMI & Display Systems — Use the device’s graphics acceleration and LCD/HDMI‑CEC interfaces to drive graphical user interfaces and multimedia displays.
  • Networked Embedded Gateways — Leverage Ethernet and multiple USB interfaces for connectivity and peripheral integration in networking applications.
  • Real‑Time Control & Sensor Integration — Employ the Cortex‑M4 co-processor together with CAN to handle deterministic control tasks and sensor/actuator interfaces.

Unique Advantages

  • Heterogeneous processing — Combines dual Cortex‑A7 application cores with a Cortex‑M4 co-processor to separate high-level application workloads from real-time control.
  • Flexible memory support — Native controllers for DDR3/DDR3L and LPDDR2/LPDDR3 simplify memory selection across performance and power trade-offs.
  • Broad connectivity — Integrated Ethernet (10/100 and GbE), multiple USB ports and CAN reduce the need for external interface components.
  • Display-ready — Built-in display controllers and graphics acceleration enable compact HMI implementations with fewer external IP blocks.
  • Robust operating range — Rated for -40 °C to 125 °C operation to support deployment in challenging temperature environments.
  • Compact package — 361‑TFBGA (12×12) surface-mount package helps minimize board area for space-constrained designs.

Why Choose STM32MP157AAC3?

The STM32MP157AAC3 positions itself as an integrated solution for embedded designs that require a mix of application processing, real-time control and rich I/O. Its combination of dual Cortex‑A7 cores, a Cortex‑M4 co-processor, graphics acceleration and extensive connectivity supports consolidated system architectures with fewer external components.

As a member of the STM32MP157 series from STMicroelectronics, the device is suited to designers seeking a compact, connectivity-rich microprocessor platform with flexible memory options and an extended operating temperature range for demanding embedded use cases.

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