STM32MP157AAC3
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12) |
|---|---|
| Quantity | 492 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP157 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 361-TFBGA (12x12) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | 3A991A2 | Ethernet | 10/100Mbps, GbE | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 361-TFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 650MHz | Supplier Device Package | 361-TFBGA (12×12) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP157AAC3 – IC MPU STM32MP1 650MHZ 361TFBGA
The STM32MP157AAC3 is a microprocessor IC from the STM32MP157 series by STMicroelectronics. It integrates an ARM® Cortex®-A7 dual-core 32-bit main processor and an ARM® Cortex®-M4 co-processor, delivering a combination of application processing and real-time control capabilities.
Designed for embedded systems that require integrated graphics, multimedia display interfaces and diverse connectivity, the device offers a compact 361‑TFBGA (12×12) package and broad memory interface support to simplify system design and integration.
Key Features
- Core & Co-processor Dual ARM® Cortex®-A7 32‑bit main cores (2 cores) with a listed core speed of 209 MHz, plus an ARM® Cortex®-M4 co-processor for real-time tasks.
- Memory Interfaces Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to support varied system memory architectures.
- Display & Graphics Graphics acceleration with display interface controllers including HDMI‑CEC and LCD to support graphical user interfaces and display output.
- Connectivity Ethernet support (10/100 Mbps and Gigabit Ethernet), multiple USB ports (USB 2.0 (2) and USB 2.0 OTG + PHY (3)) and additional CAN interface provide broad wired connectivity options.
- Security Hardware security features including ARM TrustZone (ARM TZ) to enable platform-level security partitioning.
- Package & Mounting 361‑TFBGA supplier device package (12×12) in a surface-mount form factor for compact system integration.
- Operating Range Extended operating temperature range from -40 °C to 125 °C for deployment in thermally demanding environments.
- Grade Specified grade: Automotive.
Typical Applications
- HMI & Display Systems — Use the device’s graphics acceleration and LCD/HDMI‑CEC interfaces to drive graphical user interfaces and multimedia displays.
- Networked Embedded Gateways — Leverage Ethernet and multiple USB interfaces for connectivity and peripheral integration in networking applications.
- Real‑Time Control & Sensor Integration — Employ the Cortex‑M4 co-processor together with CAN to handle deterministic control tasks and sensor/actuator interfaces.
Unique Advantages
- Heterogeneous processing — Combines dual Cortex‑A7 application cores with a Cortex‑M4 co-processor to separate high-level application workloads from real-time control.
- Flexible memory support — Native controllers for DDR3/DDR3L and LPDDR2/LPDDR3 simplify memory selection across performance and power trade-offs.
- Broad connectivity — Integrated Ethernet (10/100 and GbE), multiple USB ports and CAN reduce the need for external interface components.
- Display-ready — Built-in display controllers and graphics acceleration enable compact HMI implementations with fewer external IP blocks.
- Robust operating range — Rated for -40 °C to 125 °C operation to support deployment in challenging temperature environments.
- Compact package — 361‑TFBGA (12×12) surface-mount package helps minimize board area for space-constrained designs.
Why Choose STM32MP157AAC3?
The STM32MP157AAC3 positions itself as an integrated solution for embedded designs that require a mix of application processing, real-time control and rich I/O. Its combination of dual Cortex‑A7 cores, a Cortex‑M4 co-processor, graphics acceleration and extensive connectivity supports consolidated system architectures with fewer external components.
As a member of the STM32MP157 series from STMicroelectronics, the device is suited to designers seeking a compact, connectivity-rich microprocessor platform with flexible memory options and an extended operating temperature range for demanding embedded use cases.
Request a quote or submit an inquiry to receive pricing and availability information for the STM32MP157AAC3.

Date Founded: 1987
Headquarters: Plan-les-Ouates, Geneva, Switzerland
Employees: 50,000+
Revenue: $17.24 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO45001:2018, IATF16949:2016, ISO50001:2018