STM32MP157AAA3T

IC MPU STM32MP1 650MHZ 448LFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 448-LFBGA (18x18)

Quantity 1,339 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP157
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package448-LFBGA (18x18)
Display & Interface ControllersHDMI-CEC, LCDECCN3A991A2Ethernet10/100Mbps, GbE
GradeAutomotiveGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case448-LFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package448-LFBGA (18×18)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP157AAA3T – IC MPU STM32MP1 650MHZ 448LFBGA

The STM32MP157AAA3T is an embedded microprocessor IC built around ARM® Cortex®-A7 architecture. It provides a dual 32-bit core configuration with a listed core speed of 209 MHz and includes an ARM® Cortex®-M4 coprocessor for offloading real-time tasks.

Designed for embedded systems requiring integrated memory interfaces, display and graphics support, wired connectivity and hardware security, the device combines processing, connectivity and peripheral integration in a 448-LFBGA package with a wide operating temperature range.

Key Features

  • Processor  Dual ARM® Cortex®-A7 cores, 32-bit, with a listed speed of 209 MHz; includes an ARM® Cortex®-M4 co-processor for DSP/real-time tasks.
  • Memory controllers  Integrated support for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to match diverse system memory requirements.
  • Display and graphics  Display interface controllers including HDMI-CEC and LCD support, plus graphics acceleration for user-interface and display applications.
  • Connectivity  Multiple wired interfaces including 10/100 Mbps and Gigabit Ethernet, CAN, and USB connectivity (USB 2.0 ports and USB 2.0 OTG with PHY).
  • Security  ARM TZ security feature present for hardware-supported trusted execution.
  • Package and mounting  448-LFBGA (18×18) supplier device package, surface-mount mounting for compact board designs.
  • Operating temperature  Rated for operation from -40 °C to 125 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Embedded control systems  Dual A7 cores with an M4 co-processor and wide temperature range enable control-oriented embedded applications that require both application processing and deterministic tasks.
  • Human‑Machine Interfaces (HMI)  Integrated display controllers and graphics acceleration support LCD-based HMIs and display-driven user interfaces.
  • Networking and gateway devices  Gigabit and 10/100 Ethernet alongside USB and CAN interfaces make the device suitable for networking, gateway and communication functions.
  • Multimedia and display appliances  HDMI-CEC and graphics acceleration provide necessary building blocks for multimedia and display-centric devices.

Unique Advantages

  • Integrated heterogeneous processing: Combines dual ARM® Cortex®-A7 cores with an ARM® Cortex®-M4 co-processor to separate application and real-time workloads.
  • Flexible memory support: Native controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 simplify memory selection across performance and cost points.
  • Comprehensive I/O and connectivity: Built-in Ethernet (10/100 and GbE), USB 2.0 (including OTG+PHY) and CAN reduce external interface components.
  • Display-ready platform: HDMI-CEC and LCD interface controllers plus graphics acceleration enable robust display and UI implementations.
  • Wide operating temperature: Specified operation from -40 °C to 125 °C supports deployment across a broad range of environmental conditions.
  • Compact SMT package: 448-LFBGA (18×18) package supports high-density board integration.

Why Choose STM32MP157AAA3T?

The STM32MP157AAA3T positions itself as a balanced, integrated microprocessor solution for embedded designs that require a mix of application processing, real-time control and rich peripheral connectivity. Its dual ARM® Cortex®-A7 cores combined with an ARM® Cortex®-M4 co-processor and broad memory support enable designers to partition workloads and optimize system performance.

Packaged in a 448-LFBGA with a broad operating temperature range and built-in security features, the device is suited to embedded applications that need consolidated interfaces (Ethernet, USB, CAN) and display capabilities. As a product from STMicroelectronics, it provides a platform-level option for designs that require both processing flexibility and integrated connectivity.

Request a quote for the STM32MP157AAA3T to receive pricing and availability information for your next embedded design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1987


    Headquarters: Plan-les-Ouates, Geneva, Switzerland


    Employees: 50,000+


    Revenue: $17.24 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO45001:2018, IATF16949:2016, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up