STM32MP157AAA3T
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 448-LFBGA (18x18) |
|---|---|
| Quantity | 1,339 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP157 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 448-LFBGA (18x18) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | 3A991A2 | Ethernet | 10/100Mbps, GbE | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 448-LFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 650MHz | Supplier Device Package | 448-LFBGA (18×18) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP157AAA3T – IC MPU STM32MP1 650MHZ 448LFBGA
The STM32MP157AAA3T is an embedded microprocessor IC built around ARM® Cortex®-A7 architecture. It provides a dual 32-bit core configuration with a listed core speed of 209 MHz and includes an ARM® Cortex®-M4 coprocessor for offloading real-time tasks.
Designed for embedded systems requiring integrated memory interfaces, display and graphics support, wired connectivity and hardware security, the device combines processing, connectivity and peripheral integration in a 448-LFBGA package with a wide operating temperature range.
Key Features
- Processor Dual ARM® Cortex®-A7 cores, 32-bit, with a listed speed of 209 MHz; includes an ARM® Cortex®-M4 co-processor for DSP/real-time tasks.
- Memory controllers Integrated support for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to match diverse system memory requirements.
- Display and graphics Display interface controllers including HDMI-CEC and LCD support, plus graphics acceleration for user-interface and display applications.
- Connectivity Multiple wired interfaces including 10/100 Mbps and Gigabit Ethernet, CAN, and USB connectivity (USB 2.0 ports and USB 2.0 OTG with PHY).
- Security ARM TZ security feature present for hardware-supported trusted execution.
- Package and mounting 448-LFBGA (18×18) supplier device package, surface-mount mounting for compact board designs.
- Operating temperature Rated for operation from -40 °C to 125 °C.
- Compliance RoHS compliant.
Typical Applications
- Embedded control systems Dual A7 cores with an M4 co-processor and wide temperature range enable control-oriented embedded applications that require both application processing and deterministic tasks.
- Human‑Machine Interfaces (HMI) Integrated display controllers and graphics acceleration support LCD-based HMIs and display-driven user interfaces.
- Networking and gateway devices Gigabit and 10/100 Ethernet alongside USB and CAN interfaces make the device suitable for networking, gateway and communication functions.
- Multimedia and display appliances HDMI-CEC and graphics acceleration provide necessary building blocks for multimedia and display-centric devices.
Unique Advantages
- Integrated heterogeneous processing: Combines dual ARM® Cortex®-A7 cores with an ARM® Cortex®-M4 co-processor to separate application and real-time workloads.
- Flexible memory support: Native controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 simplify memory selection across performance and cost points.
- Comprehensive I/O and connectivity: Built-in Ethernet (10/100 and GbE), USB 2.0 (including OTG+PHY) and CAN reduce external interface components.
- Display-ready platform: HDMI-CEC and LCD interface controllers plus graphics acceleration enable robust display and UI implementations.
- Wide operating temperature: Specified operation from -40 °C to 125 °C supports deployment across a broad range of environmental conditions.
- Compact SMT package: 448-LFBGA (18×18) package supports high-density board integration.
Why Choose STM32MP157AAA3T?
The STM32MP157AAA3T positions itself as a balanced, integrated microprocessor solution for embedded designs that require a mix of application processing, real-time control and rich peripheral connectivity. Its dual ARM® Cortex®-A7 cores combined with an ARM® Cortex®-M4 co-processor and broad memory support enable designers to partition workloads and optimize system performance.
Packaged in a 448-LFBGA with a broad operating temperature range and built-in security features, the device is suited to embedded applications that need consolidated interfaces (Ethernet, USB, CAN) and display capabilities. As a product from STMicroelectronics, it provides a platform-level option for designs that require both processing flexibility and integrated connectivity.
Request a quote for the STM32MP157AAA3T to receive pricing and availability information for your next embedded design.

Date Founded: 1987
Headquarters: Plan-les-Ouates, Geneva, Switzerland
Employees: 50,000+
Revenue: $17.24 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO45001:2018, IATF16949:2016, ISO50001:2018