STM32MP153FAC1
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 800MHz 361-TFBGA (12x12) |
|---|---|
| Quantity | 55 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP153 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 361-TFBGA (12x12) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Grade | Consumer | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 361-TFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 800MHz | Supplier Device Package | 361-TFBGA (12×12) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP153FAC1 – IC MPU STM32MP1 800MHZ 361TFBGA
The STM32MP153FAC1 is an STMicroelectronics STM32MP153-series microprocessor featuring an ARM® Cortex®-A7 dual-core 32‑bit architecture with a listed core speed of 209 MHz and an integrated ARM® Cortex®-M4 coprocessor. It targets consumer embedded designs that require integrated memory controllers, display interfaces, and multiple connectivity options while maintaining a compact 361-TFBGA (12×12) surface-mount package.
Key Features
- Core and Coprocessor Dual ARM® Cortex®-A7 32‑bit cores (209 MHz) together with an ARM® Cortex®-M4 coprocessor provide a split between application processing and real-time tasks.
- Memory Controllers Integrated controllers supporting DDR3, DDR3L, LPDDR2 and LPDDR3 simplify external memory interface design.
- Display and Graphics HDMI-CEC and LCD display interface controllers plus graphics acceleration support user-interface and multimedia functions.
- Connectivity On-chip 10/100 Mbps Ethernet (1), USB 2.0 ports (2) and USB 2.0 OTG with PHY (3), plus CAN, provide a variety of wired connectivity options.
- Security ARM TrustZone (ARM TZ) security feature provides hardware-based isolation for secure execution.
- Package and Mounting Supplied in a 361‑TFBGA (12×12) surface-mount package for compact board-level integration.
- Environmental and Grade Consumer-grade device with an operating temperature range of −20 °C to 105 °C and RoHS compliance.
Typical Applications
- Consumer Embedded Devices Devices that require integrated processing, multimedia and connectivity in a compact consumer-grade package.
- User Interfaces / Displays Systems using LCD or HDMI-CEC display controllers with graphics acceleration for responsive visual interfaces.
- Connected Peripherals USB 2.0, USB OTG and 10/100 Mbps Ethernet support networked peripherals and device connectivity.
- Control and Monitoring Dual-core application processing with a Cortex‑M4 coprocessor supports combined application and real-time control tasks, with CAN for additional system interfacing.
Unique Advantages
- Dual-core processing plus real-time coprocessor: Separates application-level workloads on the Cortex‑A7 cores from real-time tasks on the Cortex‑M4, improving task partitioning.
- Integrated memory support: Built-in DDR3/DDR3L/LPDDR2/LPDDR3 controllers reduce external memory interface complexity and BOM count.
- Broad connectivity suite: Ethernet, multiple USB ports including OTG with PHY, and CAN provide flexible wired connectivity options without external controllers.
- Display-ready integration: HDMI-CEC and LCD controllers with graphics acceleration enable compact implementation of visual user interfaces.
- Security capability: ARM TrustZone provides a hardware security mechanism for isolated secure execution.
- Compact, RoHS-compliant package: 361‑TFBGA surface-mount package supports dense board integration while meeting RoHS environmental requirements.
Why Choose STM32MP153FAC1?
The STM32MP153FAC1 combines dual ARM® Cortex®-A7 processing cores with a Cortex‑M4 coprocessor, integrated memory controllers and a broad set of I/O and display interfaces in a compact 361‑TFBGA package. This combination suits consumer-focused embedded designs that need on‑board connectivity, display capability and hardware security features.
Backed by STMicroelectronics and the STM32MP153 series architecture, the device offers a balanced integration of processing, peripherals and interfaces for designs that prioritize compact BOMs, connectivity and display support while operating across an extended consumer temperature range.
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