STM32MP153DAD1

IC MPU STM32MP1 800MHZ 257TFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 800MHz 257-TFBGA (10x10)

Quantity 76 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP153
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package257-TFBGA (10x10)
Display & Interface ControllersHDMI-CEC, LCDECCN3A991A2Ethernet10/100Mbps (1)
GradeConsumerGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-20°C ~ 105°C (TJ)Package / Case257-TFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 800MHzSupplier Device Package257-TFBGA (10×10)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP153DAD1 – IC MPU STM32MP1 800MHZ 257TFBGA

The STM32MP153DAD1 from STMicroelectronics is a dual-core ARM® Cortex®-A7 microprocessor IC in the STM32MP153 series, offered in a 257-TFBGA (10×10) surface-mount package. It combines a 2-core 32‑bit Cortex‑A7 main processor with an ARM® Cortex®-M4 coprocessor and a broad set of integrated interfaces.

Designed for embedded applications, the device provides integrated memory controllers, display interfaces, wired and USB connectivity, and hardware security features—delivering a compact, connected platform for designs that require on-chip integration and peripheral support.

Key Features

  • Core & Performance  Dual ARM® Cortex®-A7 32‑bit processing cores with a listed speed of 209 MHz, providing a multicore application processor foundation.
  • Coprocessor & Acceleration  Integrated ARM® Cortex®-M4 coprocessor for offloading real-time control tasks and supporting signal-processing workloads.
  • Memory Support  On-chip controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to accommodate a range of performance and power profiles.
  • Display & Graphics  Display interface controllers including HDMI‑CEC and LCD support plus graphics acceleration to enable visual and UI applications.
  • Connectivity & I/O  Integrated 10/100 Mbps Ethernet (1), multiple USB 2.0 ports and USB 2.0 OTG with PHY, plus CAN and other peripheral interfaces for wired and peripheral connectivity.
  • Security  ARM TrustZone (ARM TZ) security feature to support hardware-assisted trusted execution and secure partitioning.
  • Package & Mounting  257‑TFBGA (10×10) supplier device package in a surface mount format for compact board-level integration.
  • Operating Range & Grade  Consumer grade device with an operating temperature range of −20°C to 105°C.
  • Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Embedded Human–Machine Interfaces  Use the LCD and HDMI‑CEC display controllers and graphics acceleration to drive user interfaces and visual displays.
  • Connected Embedded Devices  Built-in Ethernet, USB 2.0 (including OTG+PHY) and CAN support connectivity and peripheral expansion for networked products.
  • Real-Time Control with Application Processing  Leverage the ARM® Cortex®-M4 coprocessor alongside the dual Cortex‑A7 cores to separate real-time control from high-level application tasks.

Unique Advantages

  • Integrated Multicore Architecture: Dual Cortex‑A7 cores plus a Cortex‑M4 coprocessor provide a single-chip platform for both application and real-time workloads, reducing BOM and board complexity.
  • Flexible Memory Options: Support for DDR3, DDR3L, LPDDR2 and LPDDR3 memory controllers enables designers to choose memory types that match performance and power targets.
  • Rich Display and Graphics Support: HDMI‑CEC, LCD controllers and graphics acceleration simplify deployment of GUIs and multimedia features without large external subsystems.
  • Comprehensive Connectivity: Integrated Ethernet, multiple USB 2.0 ports (including OTG+PHY) and CAN provide a broad set of interfaces for networked and peripheral-rich designs.
  • Hardware Security Support: ARM TrustZone adds a hardware-backed security capability for trusted execution and separation of secure and non-secure software domains.
  • Compact, Surface-Mount Package: 257‑TFBGA (10×10) packaging enables high-density board layouts for space-constrained embedded products.

Why Choose STM32MP153DAD1?

The STM32MP153DAD1 positions itself as a highly integrated embedded processor solution combining multicore application processing, a real-time coprocessor, broad memory support and extensive I/O in a compact 257‑TFBGA package. Its combination of display capabilities, wired and USB connectivity, and hardware security features make it suitable for embedded designs that require integration of application processing, control tasks and user interfaces.

This device is well suited to designers and product teams building consumer and embedded systems that need a compact, connected processing platform with a clear upgrade path for memory and peripheral requirements while maintaining RoHS compliance and a defined operating temperature window.

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