STM32MP153FAD1

IC MPU STM32MP1 800MHZ 257TFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 800MHz 257-TFBGA (10x10)

Quantity 1,057 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP153
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package257-TFBGA (10x10)
Display & Interface ControllersHDMI-CEC, LCDECCN5A992CEthernet10/100Mbps (1)
GradeConsumerGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-20°C ~ 105°C (TJ)Package / Case257-TFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 800MHzSupplier Device Package257-TFBGA (10×10)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP153FAD1 – IC MPU STM32MP1 800MHZ 257TFBGA

The STM32MP153FAD1 is an embedded microprocessor IC from STMicroelectronics featuring an ARM® Cortex®-A7 dual-core 32-bit architecture and an ARM® Cortex®-M4 coprocessor. The part is provided in a 257-TFBGA (10×10) surface-mount package and is presented with an 800MHz identifier in the product name while the specifications list a core speed of 209 MHz.

Designed for consumer-grade embedded applications, this device integrates processing, graphics acceleration, multimedia display interfaces, and multiple connectivity options to simplify system design and reduce BOM complexity.

Key Features

  • Core Architecture  Dual ARM® Cortex®-A7 32-bit processor cores, with a Cortex®-M4 coprocessor for heterogeneous processing and offloading control tasks.
  • Performance Specification  Core speed listed in specifications as 209 MHz; product name carries an 800 MHz designation.
  • Memory Support  Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to support flexible system memory choices.
  • Display & Graphics  HDMI-CEC and LCD display interface controllers plus graphics acceleration to support display-driven user interfaces.
  • Connectivity & USB  Single 10/100 Mbps Ethernet interface and USB connectivity including two USB 2.0 ports plus USB 2.0 OTG with PHY.
  • Vehicle/Field Interfaces  CAN interface available for serial control and networking in embedded systems.
  • Security  ARM TrustZone (ARM TZ) security feature for hardware-assisted secure execution domains.
  • Package & Mounting  257-TFBGA (10×10) supplier device package; surface-mount mounting for compact PCB implementations.
  • Operating Range  Rated for an operating temperature range of −20 °C to 105 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Embedded Systems  General embedded designs leveraging dual Cortex‑A7 cores with an M4 coprocessor for mixed compute and control tasks.
  • Human‑Machine Interfaces (HMIs)  Display-driven interfaces using the LCD and HDMI-CEC controllers together with onboard graphics acceleration.
  • Connected Devices  Networked consumer devices that require 10/100 Mbps Ethernet, USB 2.0 connectivity, and CAN for system communication.
  • Consumer Electronics  Consumer-grade products that benefit from multi‑memory support (DDR3/DDR3L/LPDDR2/LPDDR3) and integrated multimedia I/O.

Unique Advantages

  • Heterogeneous Processing  Dual Cortex‑A7 cores paired with a Cortex‑M4 coprocessor enable separation of high-level application tasks and real‑time control.
  • Flexible Memory Options  Support for DDR3, DDR3L, LPDDR2 and LPDDR3 allows designers to choose memory types that match cost and power targets.
  • Integrated Display Subsystem  HDMI‑CEC and LCD controllers plus graphics acceleration reduce the need for external display controllers.
  • Multiple Connectivity Interfaces  Built‑in Ethernet, multiple USB 2.0 ports including OTG with PHY, and CAN simplify board-level integration for networked devices.
  • Security Support  ARM TrustZone provides a hardware-assisted foundation for implementing secure execution and protected resources.
  • Compact, Surface‑Mount Package  The 257‑TFBGA (10×10) package supports compact PCB layouts for space-constrained applications.

Why Choose STM32MP153FAD1?

The STM32MP153FAD1 positions itself as an integrated microprocessor solution for consumer embedded designs that require heterogeneous processing, multimedia display support, and a broad set of connectivity options. Its combination of dual ARM® Cortex®‑A7 cores, an ARM® Cortex®‑M4 coprocessor, versatile memory controller support, and onboard security features helps streamline system architecture and reduce external component count.

Engineers and procurement teams targeting compact, surface‑mount implementations will value the 257‑TFBGA package, RoHS compliance, and the −20 °C to 105 °C operating range. The device is suitable for designs that prioritize integration, flexible memory choices, and a range of peripheral interfaces backed by STMicroelectronics' product offering.

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