STM32MP157AAB3

IC MPU STM32MP1 650MHZ 354LFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 354-LFBGA (16x16)

Quantity 205 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP157
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package354-LFBGA (16x16)
Display & Interface ControllersHDMI-CEC, LCDECCN3A991A2Ethernet10/100Mbps, GbE
GradeAutomotiveGraphics AccelerationYesHTS Code8542.39.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case354-LFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package354-LFBGA (16×16)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP157AAB3 – IC MPU STM32MP1 650MHZ 354LFBGA

The STM32MP157AAB3 is a dual-core ARM® Cortex®-A7 microprocessor from the STM32MP1 family, featuring a 32-bit, 2-core configuration and a listed core speed of 209 MHz. It integrates an ARM® Cortex®-M4 coprocessor and a broad set of memory, display and I/O interfaces targeted at embedded system designs that require a balance of application processing and real-time control.

Key value propositions include integrated memory controller support, display and graphics capabilities, multiple high-speed interfaces, and an extended operating temperature range for demanding environments.

Key Features

  • Core and MCU Architecture  Dual ARM® Cortex®-A7 32-bit cores at 209 MHz with an ARM® Cortex®-M4 coprocessor for real-time tasks and offloading deterministic workloads.
  • Memory Support  Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to support varied system memory architectures.
  • Display and Graphics  LCD and HDMI-CEC display interface controllers combined with graphics acceleration to support graphical user interfaces and video output.
  • Ethernet and Networking  Ethernet support for 10/100 Mbps and Gigabit Ethernet (GbE) connectivity for networked applications.
  • USB Connectivity  Multiple USB interfaces including USB 2.0 (two ports) and USB 2.0 OTG with PHY (three ports) for host/device connectivity and peripheral expansion.
  • Automotive Grade Listing Removed  (Grade listed in source data—no qualification claims are made here.)
  • Security  ARM TrustZone (ARM TZ) security features for partitioning trusted and non-trusted software domains.
  • Additional Interfaces  CAN bus support for vehicle or industrial communications and other peripheral interconnects.
  • Package and Mounting  354-LFBGA package (16 × 16) in a surface-mount form factor for compact board-level integration.
  • Operating Temperature  Rated for operation from −40 °C to 125 °C to accommodate extended-temperature applications.

Typical Applications

  • Embedded Systems  General-purpose embedded controllers that benefit from a dual-core application processor and a Cortex‑M4 coprocessor for real-time tasks.
  • Human–Machine Interfaces (HMIs)  Graphical interfaces using LCD and HDMI-CEC controllers with graphics acceleration for responsive UI rendering.
  • Networked Gateways  Edge networking devices and gateways leveraging 10/100 Mbps and GbE connectivity plus multiple USB ports for peripherals.
  • Industrial Control  Control and monitoring systems that require CAN connectivity and extended operating temperature range for harsh environments.

Unique Advantages

  • Tightly Integrated Processing: Dual Cortex‑A7 cores paired with a Cortex‑M4 coprocessor allow separation of application and real-time control tasks without additional MCUs.
  • Flexible Memory Options: Built-in support for DDR3, DDR3L, LPDDR2 and LPDDR3 enables designers to match memory choice to performance and power targets.
  • Comprehensive I/O Suite: Multiple USB ports, GbE, 10/100 Mbps Ethernet and CAN provide a wide range of connectivity options for peripherals and networks.
  • Display-Ready: HDMI-CEC and LCD controllers plus graphics acceleration simplify implementation of visual interfaces and multimedia features.
  • Extended Temperature Capability: −40 °C to 125 °C rating supports deployment in thermally demanding environments.
  • Compact SMD Package: 354‑LFBGA (16×16) surface-mount package reduces board area for space-constrained designs.

Why Choose STM32MP157AAB3?

STM32MP157AAB3 combines dual ARM® Cortex®-A7 application cores with an ARM® Cortex®-M4 coprocessor, broad memory interface support, and an extensive set of I/O and display features, making it suitable for embedded designs that need mixed application and real-time processing. The device’s security features and variety of connectivity options provide design flexibility for networked and interface-rich products.

This part is appropriate for developers and designers building compact, connector-rich embedded systems requiring graphics and network capabilities, along with extended-temperature operation. Its integration reduces board-level component count and supports scalable design choices through supported memory and interface options.

Request a quote or submit an inquiry to receive availability and pricing details for STM32MP157AAB3. Our team can provide technical and ordering assistance to help integrate this MPU into your design.

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