STM32MP157AAA3

IC MPU STM32MP1 650MHZ 448LFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 448-LFBGA (18x18)

Quantity 1,547 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP157
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package448-LFBGA (18x18)
Display & Interface ControllersHDMI-CEC, LCDECCN3A991A2Ethernet10/100Mbps, GbE
GradeAutomotiveGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case448-LFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package448-LFBGA (18×18)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP157AAA3 – IC MPU STM32MP1 650MHZ 448LFBGA

The STM32MP157AAA3 is an ARM® Cortex®-A7 microprocessor IC in the STM32MP157 series designed for embedded applications. It features a dual-core, 32-bit Cortex‑A7 configuration with a listed core speed of 209 MHz and an ARM® Cortex®-M4 coprocessor for real-time tasks.

This device integrates a wide range of memory and peripheral interfaces, graphics acceleration and security features, making it suitable for embedded designs that require on-chip integration of display, connectivity and real-time control functions while operating across a broad temperature range.

Key Features

  • Core architecture Dual ARM® Cortex®-A7 32-bit cores with an ARM® Cortex®-M4 coprocessor for offloading real-time/MCU tasks.
  • Performance Listed core speed: 209 MHz; designed to balance application processing with real-time control via the M4 coprocessor.
  • Memory controllers Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory interfaces for flexible system memory choices.
  • Display and graphics Integrated display interface controllers including HDMI‑CEC and LCD support plus graphics acceleration for GUI and multimedia tasks.
  • Connectivity Ethernet options (10/100 Mbps and GbE), multiple USB 2.0 ports (USB 2.0 (2), USB 2.0 OTG+ PHY (3)) and CAN for vehicle and industrial bus connectivity.
  • Security ARM TrustZone (ARM TZ) provides a hardware-based security foundation for trusted execution and secure services.
  • Package and mounting 448‑LFBGA package in an 18×18 mm footprint, surface-mount for high-density board designs.
  • Operating range Rated for operation from −40 °C to 125 °C, supporting designs that require extended temperature capability.
  • Grade Classified as Automotive grade in the product data.

Typical Applications

  • Embedded Systems General embedded platforms that combine application processing and real-time control using the dual Cortex‑A7 cores and integrated M4 coprocessor.
  • Human‑Machine Interfaces (HMIs) Systems requiring LCD or HDMI display support and graphics acceleration for responsive graphical user interfaces.
  • Networking and Connectivity Gateways Devices utilizing GbE/10/100 Ethernet, multiple USB ports and CAN for wired connectivity and peripheral integration.
  • Industrial Control Control units that benefit from real-time MCU functionality, broad memory support and extended operating temperature range.

Unique Advantages

  • Heterogeneous processing: Combines dual Cortex‑A7 application cores with a Cortex‑M4 coprocessor to separate high‑level OS tasks from deterministic control functions.
  • Flexible memory support: Native controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 enable system designers to select memory optimized for cost, power and performance.
  • Rich peripheral integration: On‑chip Ethernet, multiple USB interfaces, CAN and display controllers reduce external components and simplify board design.
  • Security foundation: ARM TrustZone provides hardware-assisted isolation for secure execution and system partitioning.
  • High‑density package: 448‑LFBGA (18×18) allows compact PCB layouts while accommodating extensive on‑chip functionality.
  • Extended temperature capability: Rated from −40 °C to 125 °C for use in thermal environments beyond standard commercial ranges.

Why Choose STM32MP157AAA3?

The STM32MP157AAA3 positions itself as an integrated microprocessor solution for embedded designs that require a mix of application processing, real-time control and rich I/O. Its dual Cortex‑A7 cores paired with a Cortex‑M4 coprocessor, broad memory support and extensive peripheral set make it suitable for compact, connectivity‑focused systems with display and security needs.

For engineers seeking scalability and integration in the STM32MP157 series footprint, this device offers a combination of processing partitions, interface options and extended temperature operation to support robust, long‑lifecycle embedded products.

Request a quote or submit an inquiry to receive pricing and availability for the STM32MP157AAA3.

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