STM32MP157AAC3T

IC MPU STM32MP1 650MHZ 361TFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12)

Quantity 642 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP157
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package361-TFBGA (12x12)
Display & Interface ControllersHDMI-CEC, LCDECCN3A991A2Ethernet10/100Mbps, GbE
GradeAutomotiveGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case361-TFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package361-TFBGA (12×12)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP157AAC3T – IC MPU STM32MP1 650MHZ 361TFBGA

The STM32MP157AAC3T is a microprocessor in the STM32MP157 series from STMicroelectronics. It integrates an ARM® Cortex®-A7 2-core, 32-bit processor architecture with an ARM® Cortex®-M4 co-processor to address mixed application workloads.

Designed for embedded applications, the device combines on-chip graphics acceleration, multiple memory controller options, and a broad set of peripheral interfaces to support display, connectivity and real-time processing requirements.

Key Features

  • Core and Co-processor  Dual ARM® Cortex®-A7 2-core, 32-bit processing and an integrated ARM® Cortex®-M4 co-processor for offloading real-time or DSP tasks.
  • Performance  Listed device speed: 209 MHz. (See product documentation for full performance details.)
  • Memory Controllers  Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory types for flexible system memory design.
  • Display and Graphics  Integrated display interface controllers including HDMI-CEC and LCD support plus graphics acceleration for display-centric applications.
  • Connectivity Interfaces  Ethernet options include 10/100Mbps and GbE; USB connectivity includes USB 2.0 ports and USB 2.0 OTG+PHY; additional interfaces include CAN.
  • Security  Security features include ARM TrustZone (ARM TZ) for trusted execution and secure partitioning.
  • Package and Mounting  361-TFBGA package (12×12) supplied in a surface-mount form factor suitable for high-density board layouts.
  • Operating Temperature  Rated for operation from -40°C to 125°C.
  • Environment  RoHS compliant.

Typical Applications

  • Embedded Systems  Dual-core processing with an M4 co-processor and flexible memory interfaces make this device suitable for general embedded applications that require both application processing and real-time control.
  • Display and HMI  HDMI-CEC and LCD interface controllers plus graphics acceleration support display-driven human-machine interfaces and multimedia front-ends.
  • Connectivity Gateways  Integrated Ethernet (10/100 and GbE), multiple USB ports and CAN enable use in networked gateways and communication devices.
  • Real-time Control and DSP Offload  The ARM® Cortex®-M4 co-processor can be used to handle deterministic tasks or DSP workloads alongside the Cortex®-A7 application cores.

Unique Advantages

  • Integrated Application and Real-time Processing: Dual ARM® Cortex®-A7 cores combined with an ARM® Cortex®-M4 co-processor allow separation of application and real-time tasks on a single device.
  • Flexible Memory Support: Native support for DDR3, DDR3L, LPDDR2 and LPDDR3 provides designers options to optimize performance and cost.
  • Rich Peripheral Set: On-chip Ethernet, USB, CAN and display interfaces reduce external components and simplify system integration.
  • Security Foundation: ARM TrustZone enables hardware-backed isolation for secure execution domains.
  • Industrial Temperature Range: Rated from -40°C to 125°C for use in temperature-demanding environments.
  • Compact, Surface-Mount Package: 361-TFBGA (12×12) package supports high-density PCB designs while providing robust mechanical mounting.

Why Choose STM32MP157AAC3T?

The STM32MP157AAC3T positions itself as a versatile microprocessor for embedded designs that need a combination of application processing, graphics/display capability, and real-time control. Its dual-core ARM® Cortex®-A7 architecture together with an ARM® Cortex®-M4 co-processor delivers architectural separation between application-level and deterministic tasks while providing flexible memory and rich connectivity.

This part is suited for engineers and system designers building compact, connected embedded products that require integrated display and networking interfaces, secure execution support, and a wide operating temperature range. The device is backed by manufacturer documentation and datasheet resources for design integration and qualification.

Request a quote or submit an inquiry to purchase the STM32MP157AAC3T—provide your required quantity and delivery timeframe to receive pricing and availability details.

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