STM32MP157AAD3T

IC MPU STM32MP1 650MHZ 257TFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 257-TFBGA (10x10)

Quantity 1,056 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP157
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package257-TFBGA (10x10)
Display & Interface ControllersHDMI-CEC, LCDECCN3A991A2Ethernet10/100Mbps, GbE
GradeAutomotiveGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case257-TFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package257-TFBGA (10×10)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP157AAD3T – IC MPU STM32MP1 2‑Core ARM® Cortex®‑A7

The STM32MP157AAD3T is a microprocessor IC from the STM32MP1 family featuring dual ARM® Cortex®‑A7 32‑bit cores running at 209 MHz. It combines application‑class processing with an ARM® Cortex®‑M4 co‑processor for mixed‑workload embedded systems.

Targeted at embedded designs that require integrated memory interfaces, rich peripheral connectivity and graphics/display support, the device provides a compact 257‑TFBGA (10×10) package and a wide operating temperature range of ‑40 °C to 125 °C.

Key Features

  • Core and Co‑processor Dual ARM® Cortex®‑A7 32‑bit cores with an ARM® Cortex®‑M4 co‑processor, delivering separate application and real‑time processing domains.
  • Clock Speed Cores specified at 209 MHz according to device data.
  • Memory Support Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to accommodate varying system memory requirements.
  • Display and Graphics Display interface controllers include HDMI‑CEC and LCD support, with graphics acceleration reported for UI and multimedia tasks.
  • Connectivity and I/O Ethernet options include 10/100 Mbps and GbE; USB interfaces include two USB 2.0 ports and USB 2.0 OTG with PHY (three); additional CAN interface available.
  • Security ARM TrustZone (ARM TZ) security feature is provided for hardware‑assisted secure execution.
  • Package and Mounting Supplied in a 257‑TFBGA (10×10) package with surface‑mount mounting type for compact board integration.
  • Operating Range Specifies an operating temperature range of ‑40 °C to 125 °C for deployment in thermally demanding environments.
  • Environmental Compliance RoHS status: Compliant.

Typical Applications

  • Embedded Control Systems — Dual A‑7 cores with an M4 co‑processor enable separation of application and real‑time control tasks in embedded controllers.
  • Human‑Machine Interfaces (HMI) — Display controllers, graphics acceleration and LCD/HDMI‑CEC support make the device suitable for rich user interfaces.
  • Networked Devices — Integrated 10/100 Mbps and GbE Ethernet plus multiple USB ports provide connectivity for gateways, routers and edge devices.
  • Industrial Instrumentation — Wide operating temperature range and CAN interface support use in industrial monitoring and control equipment.

Unique Advantages

  • Integrated Heterogeneous Processing: Combines dual ARM® Cortex®‑A7 application cores with an ARM® Cortex®‑M4 co‑processor to separate high‑level and real‑time workloads.
  • Flexible Memory Options: Support for DDR3, DDR3L, LPDDR2 and LPDDR3 enables designers to choose the memory technology that fits performance and power targets.
  • Comprehensive Connectivity: On‑chip Ethernet (10/100 Mbps and GbE), multiple USB ports including OTG with PHY, and CAN offer broad I/O for connected systems.
  • Display and Graphics Capability: HDMI‑CEC and LCD controllers plus graphics acceleration support modern HMIs and multimedia use cases.
  • Robust Operating Range: Specified from ‑40 °C to 125 °C to address applications in thermally challenging environments.
  • Standards Compliance: RoHS compliance simplifies environmental and regulatory planning.

Why Choose STM32MP157AAD3T?

The STM32MP157AAD3T positions itself as a compact, integrated microprocessor solution for embedded designs that require separated application and real‑time processing, multiple memory options, and broad peripheral support. Its combination of dual ARM® Cortex®‑A7 cores, an ARM® Cortex®‑M4 co‑processor, extensive connectivity and display features makes it suitable for systems that need both compute capability and rich I/O in a small package.

With a 257‑TFBGA package, multiple memory controller options, hardware security features and a wide operating temperature range, the STM32MP157AAD3T offers a practical platform for developers building industrial, HMI, networking and multimedia embedded products.

Request a quote or submit an inquiry to receive pricing and availability for the STM32MP157AAD3T and to discuss your design requirements.

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