STM32MP157AAD3T
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 257-TFBGA (10x10) |
|---|---|
| Quantity | 1,056 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP157 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 257-TFBGA (10x10) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | 3A991A2 | Ethernet | 10/100Mbps, GbE | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 257-TFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 650MHz | Supplier Device Package | 257-TFBGA (10×10) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP157AAD3T – IC MPU STM32MP1 2‑Core ARM® Cortex®‑A7
The STM32MP157AAD3T is a microprocessor IC from the STM32MP1 family featuring dual ARM® Cortex®‑A7 32‑bit cores running at 209 MHz. It combines application‑class processing with an ARM® Cortex®‑M4 co‑processor for mixed‑workload embedded systems.
Targeted at embedded designs that require integrated memory interfaces, rich peripheral connectivity and graphics/display support, the device provides a compact 257‑TFBGA (10×10) package and a wide operating temperature range of ‑40 °C to 125 °C.
Key Features
- Core and Co‑processor Dual ARM® Cortex®‑A7 32‑bit cores with an ARM® Cortex®‑M4 co‑processor, delivering separate application and real‑time processing domains.
- Clock Speed Cores specified at 209 MHz according to device data.
- Memory Support Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to accommodate varying system memory requirements.
- Display and Graphics Display interface controllers include HDMI‑CEC and LCD support, with graphics acceleration reported for UI and multimedia tasks.
- Connectivity and I/O Ethernet options include 10/100 Mbps and GbE; USB interfaces include two USB 2.0 ports and USB 2.0 OTG with PHY (three); additional CAN interface available.
- Security ARM TrustZone (ARM TZ) security feature is provided for hardware‑assisted secure execution.
- Package and Mounting Supplied in a 257‑TFBGA (10×10) package with surface‑mount mounting type for compact board integration.
- Operating Range Specifies an operating temperature range of ‑40 °C to 125 °C for deployment in thermally demanding environments.
- Environmental Compliance RoHS status: Compliant.
Typical Applications
- Embedded Control Systems — Dual A‑7 cores with an M4 co‑processor enable separation of application and real‑time control tasks in embedded controllers.
- Human‑Machine Interfaces (HMI) — Display controllers, graphics acceleration and LCD/HDMI‑CEC support make the device suitable for rich user interfaces.
- Networked Devices — Integrated 10/100 Mbps and GbE Ethernet plus multiple USB ports provide connectivity for gateways, routers and edge devices.
- Industrial Instrumentation — Wide operating temperature range and CAN interface support use in industrial monitoring and control equipment.
Unique Advantages
- Integrated Heterogeneous Processing: Combines dual ARM® Cortex®‑A7 application cores with an ARM® Cortex®‑M4 co‑processor to separate high‑level and real‑time workloads.
- Flexible Memory Options: Support for DDR3, DDR3L, LPDDR2 and LPDDR3 enables designers to choose the memory technology that fits performance and power targets.
- Comprehensive Connectivity: On‑chip Ethernet (10/100 Mbps and GbE), multiple USB ports including OTG with PHY, and CAN offer broad I/O for connected systems.
- Display and Graphics Capability: HDMI‑CEC and LCD controllers plus graphics acceleration support modern HMIs and multimedia use cases.
- Robust Operating Range: Specified from ‑40 °C to 125 °C to address applications in thermally challenging environments.
- Standards Compliance: RoHS compliance simplifies environmental and regulatory planning.
Why Choose STM32MP157AAD3T?
The STM32MP157AAD3T positions itself as a compact, integrated microprocessor solution for embedded designs that require separated application and real‑time processing, multiple memory options, and broad peripheral support. Its combination of dual ARM® Cortex®‑A7 cores, an ARM® Cortex®‑M4 co‑processor, extensive connectivity and display features makes it suitable for systems that need both compute capability and rich I/O in a small package.
With a 257‑TFBGA package, multiple memory controller options, hardware security features and a wide operating temperature range, the STM32MP157AAD3T offers a practical platform for developers building industrial, HMI, networking and multimedia embedded products.
Request a quote or submit an inquiry to receive pricing and availability for the STM32MP157AAD3T and to discuss your design requirements.

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