STM32MP157CAB3T

The STM32MP157CAB3T is an ARM® Cortex®-A7 microprocessor IC from the STM32MP1 series featuring a dual-core 32-bit application processor and an ARM® Cortex®-M4 coprocessor. The device is specified with a core speed of 209 MHz and is provided in a 354-LFBGA (16×16) surface-mount package for compact embedded system designs.

Designed for embedded applications, the part combines application processing, real-time coprocessing, multiple high-speed interfaces and display capabilities to address systems requiring integrated connectivity, multimedia and secure execution.

Key Features

• Core Architecture  ARM® Cortex®-A7 dual-core 32-bit application processor with an ARM® Cortex®-M4 coprocessor for real-time tasks.
• Performance  Device speed listed as 209 MHz in specifications; part name also references 650 MHz.
• Memory Support  Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory technologies for flexible system memory choices.
• Display & Graphics  LCD and HDMI-CEC display controllers plus graphics acceleration for user interfaces and multimedia displays.
• Connectivity  Ethernet (10/100 Mbps and Gigabit Ethernet), multiple USB 2.0 ports including OTG+PHY, and CAN for robust wired I/O and networking.
• Security  ARM TrustZone (ARM TZ) security feature to support trusted execution environments.
• Package & Mounting  354-LFBGA (16×16) package, surface mount, for compact board-level integration.
• Operating Range  Rated for operation from -40 °C to 125 °C.
• Grade  Listed grade: Automotive.
• Compliance  RoHS compliant.

Typical Applications

• Embedded Processing  Dual Cortex-A7 cores plus a Cortex-M4 coprocessor enable separation of application-level processing and real-time control tasks in embedded systems.
• Human-Machine Interfaces (HMI)  LCD and HDMI-CEC display controllers combined with graphics acceleration support responsive visual interfaces and multimedia displays.
• Networked Devices  Integrated 10/100 Mbps and Gigabit Ethernet along with multiple USB ports and CAN support networked and IoT gateway applications requiring wired connectivity.
• Industrial Control  Wide operating temperature range and real-time coprocessing capability suit designs that require deterministic control and extended environmental range.

Unique Advantages

• Integrated heterogeneous processing: Dual Cortex-A7 application cores plus a Cortex-M4 coprocessor let designers partition workloads between application and real-time domains.
• Broad memory flexibility: Support for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types enables optimization for cost, power and performance.
• Comprehensive I/O set: Ethernet (10/100 and GbE), USB 2.0 (including OTG+PHY), CAN and display controllers reduce external interface components and simplify system design.
• Built-in security capability: ARM TrustZone support facilitates implementation of trusted execution environments for secure applications.
• Compact, production-ready package: 354-LFBGA (16×16) surface-mount package offers a small footprint for space-constrained boards.
• Wide temperature operation: -40 °C to 125 °C rating supports deployment across a broad range of environmental conditions.

Why Choose STM32MP157CAB3T?

The STM32MP157CAB3T positions multi-domain processing, graphics and connectivity in a single, compact package. With dual ARM® Cortex®-A7 cores, an ARM® Cortex®-M4 coprocessor, extensive memory support and a broad set of wired interfaces, it is suited for embedded designs that require integrated display, networking and secure execution capabilities.

Its combination of integration, interface flexibility and wide operating temperature range helps simplify BOM, saves board space and supports deployment in applications where reliable, connected embedded processing is required.

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