STM32MP153CAD3T
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 257-TFBGA (10x10) |
|---|---|
| Quantity | 191 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP153 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 257-TFBGA (10x10) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TA) | Package / Case | 257-TFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 650MHz | Supplier Device Package | 257-TFBGA (10×10) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP153CAD3T – IC MPU STM32MP1 650MHZ 257TFBGA
The STM32MP153CAD3T is an embedded microprocessor in the STM32MP153 series featuring ARM® Cortex®-A7 architecture and an ARM® Cortex®-M4 coprocessor. It combines a dual 32-bit Cortex-A7 configuration with a companion M4 core and a broad set of integrated interfaces for connected, display-capable embedded designs.
Designed for embedded systems, the device delivers on-system integration with multiple memory controller options, display controllers, and a range of connectivity interfaces while supporting an extended operating temperature range of -40 °C to 125 °C.
Key Features
- Core and Co-processor – ARM® Cortex®-A7 main processor with 2 cores (32-bit) and ARM® Cortex®-M4 co-processor for real-time tasks; listed core speed value: 209 MHz.
- Memory Support – Integrated controllers supporting DDR3, DDR3L, LPDDR2 and LPDDR3 memory types for flexible system memory choices.
- Display and Graphics – Built-in LCD and HDMI-CEC display controllers plus graphics acceleration to support user interfaces and multimedia display functions.
- Connectivity – Wired interfaces including 10/100 Mbps Ethernet (1), multiple USB 2.0 ports (2) plus USB 2.0 OTG with PHY (3), and CAN for robust peripheral and network connections.
- Security – ARM TrustZone (ARM TZ) security feature for hardware-supported secure execution partitions.
- Package and Mounting – 257-TFBGA supplier device package (10 × 10 mm) in a surface-mount format for compact board designs.
- Operating Range and Compliance – Extended operating temperature range of -40 °C to 125 °C and RoHS compliant.
Typical Applications
- Embedded HMI and Display Systems – Leverage the LCD and HDMI-CEC controllers with graphics acceleration to drive user interfaces and multimedia displays.
- Networked Embedded Devices – Use integrated Ethernet and multiple USB interfaces for connected appliance and gateway designs requiring standard LAN and USB connectivity.
- Real-Time Control and Sensor Hubs – Combine the Cortex-A7 application cores with the Cortex-M4 coprocessor and CAN interface for deterministic control and sensor integration.
- Low- to Mid-Performance Multimedia – Employ the graphics acceleration and display controllers to implement compact multimedia endpoints and operator displays.
Unique Advantages
- Dual-processor architecture: Separation of application-level processing (dual Cortex-A7) and real-time control (Cortex-M4) helps simplify task partitioning and firmware design.
- Flexible memory options: Support for DDR3, DDR3L, LPDDR2 and LPDDR3 enables designers to match memory technology to performance, power and cost targets.
- Integrated display and graphics: On-chip LCD and HDMI-CEC controllers plus graphics acceleration reduce external component count for HMI implementations.
- Broad connectivity set: Ethernet, multiple USB ports including OTG with PHY, and CAN provide a wide range of interface choices for networked and industrial systems.
- Extended temperature capability: Rated for operation from -40 °C to 125 °C, suitable for designs requiring wide thermal tolerance.
- Compact BGA package: The 257-TFBGA (10×10) surface-mount package supports space-constrained board layouts while providing high pin density.
Why Choose STM32MP153CAD3T?
The STM32MP153CAD3T positions itself as a highly integrated embedded microprocessor solution that combines dual ARM® Cortex®-A7 cores with an ARM® Cortex®-M4 coprocessor, flexible memory support, multiple display controllers and a comprehensive set of connectivity interfaces. Its extended operating temperature range and compact 257-TFBGA package make it suitable for embedded designs that require integration, connectivity and display capability in a small footprint.
Backed by the STM32MP153 series, this device is appropriate for designers seeking a balance of application processing, real-time control, and peripheral integration while maintaining compliance with RoHS requirements.
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