STM32MP153CAD3T

IC MPU STM32MP1 650MHZ 257TFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 257-TFBGA (10x10)

Quantity 191 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP153
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package257-TFBGA (10x10)
Display & Interface ControllersHDMI-CEC, LCDECCN5A992CEthernet10/100Mbps (1)
GradeAutomotiveGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TA)Package / Case257-TFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package257-TFBGA (10×10)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP153CAD3T – IC MPU STM32MP1 650MHZ 257TFBGA

The STM32MP153CAD3T is an embedded microprocessor in the STM32MP153 series featuring ARM® Cortex®-A7 architecture and an ARM® Cortex®-M4 coprocessor. It combines a dual 32-bit Cortex-A7 configuration with a companion M4 core and a broad set of integrated interfaces for connected, display-capable embedded designs.

Designed for embedded systems, the device delivers on-system integration with multiple memory controller options, display controllers, and a range of connectivity interfaces while supporting an extended operating temperature range of -40 °C to 125 °C.

Key Features

  • Core and Co-processor – ARM® Cortex®-A7 main processor with 2 cores (32-bit) and ARM® Cortex®-M4 co-processor for real-time tasks; listed core speed value: 209 MHz.
  • Memory Support – Integrated controllers supporting DDR3, DDR3L, LPDDR2 and LPDDR3 memory types for flexible system memory choices.
  • Display and Graphics – Built-in LCD and HDMI-CEC display controllers plus graphics acceleration to support user interfaces and multimedia display functions.
  • Connectivity – Wired interfaces including 10/100 Mbps Ethernet (1), multiple USB 2.0 ports (2) plus USB 2.0 OTG with PHY (3), and CAN for robust peripheral and network connections.
  • Security – ARM TrustZone (ARM TZ) security feature for hardware-supported secure execution partitions.
  • Package and Mounting – 257-TFBGA supplier device package (10 × 10 mm) in a surface-mount format for compact board designs.
  • Operating Range and Compliance – Extended operating temperature range of -40 °C to 125 °C and RoHS compliant.

Typical Applications

  • Embedded HMI and Display Systems – Leverage the LCD and HDMI-CEC controllers with graphics acceleration to drive user interfaces and multimedia displays.
  • Networked Embedded Devices – Use integrated Ethernet and multiple USB interfaces for connected appliance and gateway designs requiring standard LAN and USB connectivity.
  • Real-Time Control and Sensor Hubs – Combine the Cortex-A7 application cores with the Cortex-M4 coprocessor and CAN interface for deterministic control and sensor integration.
  • Low- to Mid-Performance Multimedia – Employ the graphics acceleration and display controllers to implement compact multimedia endpoints and operator displays.

Unique Advantages

  • Dual-processor architecture: Separation of application-level processing (dual Cortex-A7) and real-time control (Cortex-M4) helps simplify task partitioning and firmware design.
  • Flexible memory options: Support for DDR3, DDR3L, LPDDR2 and LPDDR3 enables designers to match memory technology to performance, power and cost targets.
  • Integrated display and graphics: On-chip LCD and HDMI-CEC controllers plus graphics acceleration reduce external component count for HMI implementations.
  • Broad connectivity set: Ethernet, multiple USB ports including OTG with PHY, and CAN provide a wide range of interface choices for networked and industrial systems.
  • Extended temperature capability: Rated for operation from -40 °C to 125 °C, suitable for designs requiring wide thermal tolerance.
  • Compact BGA package: The 257-TFBGA (10×10) surface-mount package supports space-constrained board layouts while providing high pin density.

Why Choose STM32MP153CAD3T?

The STM32MP153CAD3T positions itself as a highly integrated embedded microprocessor solution that combines dual ARM® Cortex®-A7 cores with an ARM® Cortex®-M4 coprocessor, flexible memory support, multiple display controllers and a comprehensive set of connectivity interfaces. Its extended operating temperature range and compact 257-TFBGA package make it suitable for embedded designs that require integration, connectivity and display capability in a small footprint.

Backed by the STM32MP153 series, this device is appropriate for designers seeking a balance of application processing, real-time control, and peripheral integration while maintaining compliance with RoHS requirements.

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