STM32MP153CAC3T
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12) |
|---|---|
| Quantity | 1,525 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP153 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 361-TFBGA (12x12) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TA) | Package / Case | 361-TFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 650MHz | Supplier Device Package | 361-TFBGA (12×12) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP153CAC3T – IC MPU STM32MP1 650MHZ 361TFBGA
The STM32MP153CAC3T is an STM32MP1-series microprocessor IC featuring an ARM® Cortex®-A7 application core architecture with dual 32-bit cores. The device pairs application processing with an ARM® Cortex®-M4 coprocessor and provides a broad set of memory controllers and interfaces for embedded system integration.
Designed for embedded applications that require integrated display, connectivity and security features, this package-level solution combines processing, graphics acceleration and multiple I/O options in a 361-TFBGA surface-mount package.
Key Features
- Core — ARM® Cortex®-A7 dual 32-bit cores; listed core speed 209 MHz.
- Co-processor — Integrated ARM® Cortex®-M4 to handle deterministic control tasks alongside application processing.
- Memory Controllers — Support for DDR3, DDR3L, LPDDR2 and LPDDR3 memory interfaces to match a range of memory performance and power profiles.
- Display & Graphics — LCD display controller and HDMI-CEC support with built-in graphics acceleration for user interfaces and visual output.
- Connectivity — Integrated 10/100 Mbps Ethernet (1), multiple USB 2.0 ports and USB 2.0 OTG with PHY, plus CAN for vehicle and industrial bus connectivity.
- Security — ARM TrustZone (ARM TZ) security features for hardware-assisted secure execution domains.
- Package & Mounting — 361-TFBGA (12×12) supplier device package, surface-mount mounting type suitable for high-density PCB designs.
- Operating Range — Specified operating temperature range of −40 °C to 125 °C for wide-environment deployment.
- Compliance — RoHS compliant.
Typical Applications
- Embedded control systems — Dual A7 cores with an M4 coprocessor provide a split between application processing and real-time control tasks.
- Human–machine interfaces (HMIs) — Built-in graphics acceleration and LCD/HDMI-CEC interfaces support graphical displays and user interfaces.
- Connectivity gateways — Ethernet, multiple USB ports including OTG with PHY, and CAN enable networked devices and protocol bridging.
- Industrial instrumentation — Memory options and extended temperature range suit a variety of industrial embedded designs.
Unique Advantages
- Application + Real-time pairing: The combination of ARM Cortex-A7 cores with an ARM Cortex-M4 coprocessor enables separation of high-level application tasks and deterministic control.
- Flexible memory support: Native controllers for DDR3/DDR3L and LPDDR2/LPDDR3 simplify memory selection across performance and power targets.
- Integrated multimedia interfaces: LCD and HDMI-CEC plus graphics acceleration reduce external component count for display-enabled designs.
- Rich I/O set: Ethernet, multiple USB 2.0 ports with OTG+PHY, and CAN provide broad connectivity options from a single device.
- Robust thermal range: Rated from −40 °C to 125 °C, enabling deployment across varied environmental conditions.
- Compact surface-mount package: 361-TFBGA (12×12) supports high-density board layouts while keeping a standardized supplier package footprint.
Why Choose STM32MP153CAC3T?
The STM32MP153CAC3T positions itself as a highly integrated embedded microprocessor solution offering dual ARM® Cortex®-A7 cores alongside an ARM® Cortex®-M4 coprocessor, extensive memory interface support, integrated graphics and a broad set of connectivity options. This combination delivers a balanced platform for designs that need both application-level processing and deterministic control.
Its compact 361-TFBGA surface-mount package, wide operating temperature range and RoHS compliance make it suitable for embedded projects that demand integration, connectivity and thermal robustness while benefiting from a single-vendor device feature set.
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