STM32MP153CAC3T

IC MPU STM32MP1 650MHZ 361TFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12)

Quantity 1,525 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP153
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package361-TFBGA (12x12)
Display & Interface ControllersHDMI-CEC, LCDECCN5A992CEthernet10/100Mbps (1)
GradeAutomotiveGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TA)Package / Case361-TFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package361-TFBGA (12×12)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP153CAC3T – IC MPU STM32MP1 650MHZ 361TFBGA

The STM32MP153CAC3T is an STM32MP1-series microprocessor IC featuring an ARM® Cortex®-A7 application core architecture with dual 32-bit cores. The device pairs application processing with an ARM® Cortex®-M4 coprocessor and provides a broad set of memory controllers and interfaces for embedded system integration.

Designed for embedded applications that require integrated display, connectivity and security features, this package-level solution combines processing, graphics acceleration and multiple I/O options in a 361-TFBGA surface-mount package.

Key Features

  • Core — ARM® Cortex®-A7 dual 32-bit cores; listed core speed 209 MHz.
  • Co-processor — Integrated ARM® Cortex®-M4 to handle deterministic control tasks alongside application processing.
  • Memory Controllers — Support for DDR3, DDR3L, LPDDR2 and LPDDR3 memory interfaces to match a range of memory performance and power profiles.
  • Display & Graphics — LCD display controller and HDMI-CEC support with built-in graphics acceleration for user interfaces and visual output.
  • Connectivity — Integrated 10/100 Mbps Ethernet (1), multiple USB 2.0 ports and USB 2.0 OTG with PHY, plus CAN for vehicle and industrial bus connectivity.
  • Security — ARM TrustZone (ARM TZ) security features for hardware-assisted secure execution domains.
  • Package & Mounting — 361-TFBGA (12×12) supplier device package, surface-mount mounting type suitable for high-density PCB designs.
  • Operating Range — Specified operating temperature range of −40 °C to 125 °C for wide-environment deployment.
  • Compliance — RoHS compliant.

Typical Applications

  • Embedded control systems — Dual A7 cores with an M4 coprocessor provide a split between application processing and real-time control tasks.
  • Human–machine interfaces (HMIs) — Built-in graphics acceleration and LCD/HDMI-CEC interfaces support graphical displays and user interfaces.
  • Connectivity gateways — Ethernet, multiple USB ports including OTG with PHY, and CAN enable networked devices and protocol bridging.
  • Industrial instrumentation — Memory options and extended temperature range suit a variety of industrial embedded designs.

Unique Advantages

  • Application + Real-time pairing: The combination of ARM Cortex-A7 cores with an ARM Cortex-M4 coprocessor enables separation of high-level application tasks and deterministic control.
  • Flexible memory support: Native controllers for DDR3/DDR3L and LPDDR2/LPDDR3 simplify memory selection across performance and power targets.
  • Integrated multimedia interfaces: LCD and HDMI-CEC plus graphics acceleration reduce external component count for display-enabled designs.
  • Rich I/O set: Ethernet, multiple USB 2.0 ports with OTG+PHY, and CAN provide broad connectivity options from a single device.
  • Robust thermal range: Rated from −40 °C to 125 °C, enabling deployment across varied environmental conditions.
  • Compact surface-mount package: 361-TFBGA (12×12) supports high-density board layouts while keeping a standardized supplier package footprint.

Why Choose STM32MP153CAC3T?

The STM32MP153CAC3T positions itself as a highly integrated embedded microprocessor solution offering dual ARM® Cortex®-A7 cores alongside an ARM® Cortex®-M4 coprocessor, extensive memory interface support, integrated graphics and a broad set of connectivity options. This combination delivers a balanced platform for designs that need both application-level processing and deterministic control.

Its compact 361-TFBGA surface-mount package, wide operating temperature range and RoHS compliance make it suitable for embedded projects that demand integration, connectivity and thermal robustness while benefiting from a single-vendor device feature set.

Request a quote or submit an inquiry to receive pricing and availability details for the STM32MP153CAC3T. Our team can provide lead-time and ordering information to support your design and procurement process.

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