STM32MP153CAC3
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12) |
|---|---|
| Quantity | 1,940 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP153 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 361-TFBGA (12x12) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TA) | Package / Case | 361-TFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 650MHz | Supplier Device Package | 361-TFBGA (12×12) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP153CAC3 – IC MPU STM32MP1 650MHZ 361TFBGA
The STM32MP153CAC3 is an embedded microprocessor IC based on ARM® Cortex®-A7 architecture with a dual-core, 32-bit configuration and an on-chip ARM® Cortex®-M4 coprocessor. Packaged in a 361-TFBGA (12×12) package, the device integrates diverse memory controller support, multiple high-speed interfaces, graphics acceleration and hardware security features for embedded applications.
Designed for use in embedded systems requiring heterogeneous processing, graphics and connectivity, this device delivers a balance of compute and integration for systems-level designs.
Key Features
- Core and Coprocessor Dual ARM® Cortex®-A7 32-bit cores (209 MHz listed) paired with an ARM® Cortex®-M4 coprocessor for offloading real-time tasks.
- Memory Support Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to accommodate a range of system memory architectures.
- Display and Graphics Display interface support including HDMI-CEC and LCD plus built-in graphics acceleration for user interfaces and visualization tasks.
- Connectivity On-chip Ethernet 10/100 Mbps, multiple USB 2.0 ports and USB 2.0 OTG with PHY, plus CAN interface for broad peripheral and network options.
- Security ARM TrustZone (ARM TZ) security features for hardware-enforced isolation of trusted execution environments.
- Package and Mounting Compact 361-TFBGA (12×12) surface-mount package suitable for space-constrained board designs.
- Operating Range Rated for operation from −40 °C to 125 °C, supporting deployment in environments with wide temperature variation.
- Compliance RoHS compliant.
Typical Applications
- Industrial HMI Graphics acceleration and LCD/HDMI-CEC display interfaces enable responsive human-machine interfaces and embedded visualization.
- Embedded Gateways Ethernet, USB and CAN connectivity make the device suitable for protocol bridging and local network gateway functions.
- IoT and Edge Controllers Dual-core application processing with an M4 coprocessor supports mixed real-time control and higher-level service tasks in edge devices.
Unique Advantages
- Heterogeneous Processing: Dual Cortex-A7 cores plus a Cortex-M4 coprocessor provide a split between application-level processing and real-time control, simplifying system partitioning.
- Flexible Memory Options: Support for DDR3, DDR3L, LPDDR2 and LPDDR3 enables designers to choose the memory type that best fits performance and power targets.
- Broad Connectivity: Integrated Ethernet, multiple USB ports including OTG with PHY, and CAN reduce external interface components and BOM complexity.
- Hardware Security: ARM TrustZone support facilitates implementation of secure execution environments and trusted services.
- Robust Operating Range: Specified operation from −40 °C to 125 °C provides suitability for systems exposed to wide temperature variations.
- Compact Packaging: The 361-TFBGA (12×12) package helps minimize board footprint while retaining extensive on-chip functionality.
Why Choose STM32MP153CAC3?
STM32MP153CAC3 combines dual ARM® Cortex®-A7 application cores with a Cortex®-M4 coprocessor to deliver a flexible, integrated platform for embedded designs that require both application-level processing and real-time control. With a wide range of memory controller support, rich display and connectivity interfaces, hardware security and a compact 361-TFBGA package, it targets engineers building systems where integration, connectivity and thermal robustness matter.
The device is well suited to teams developing embedded HMIs, gateways and edge controllers who need a combination of heterogeneous compute, on-chip interfaces and a broad operating temperature range backed by RoHS compliance.
Request a quote or submit an inquiry to receive pricing and availability for the STM32MP153CAC3 and to discuss how it fits your next embedded design.

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