STM32MP153CAC3

IC MPU STM32MP1 650MHZ 361TFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12)

Quantity 1,940 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP153
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package361-TFBGA (12x12)
Display & Interface ControllersHDMI-CEC, LCDECCN5A992CEthernet10/100Mbps (1)
GradeAutomotiveGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TA)Package / Case361-TFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package361-TFBGA (12×12)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP153CAC3 – IC MPU STM32MP1 650MHZ 361TFBGA

The STM32MP153CAC3 is an embedded microprocessor IC based on ARM® Cortex®-A7 architecture with a dual-core, 32-bit configuration and an on-chip ARM® Cortex®-M4 coprocessor. Packaged in a 361-TFBGA (12×12) package, the device integrates diverse memory controller support, multiple high-speed interfaces, graphics acceleration and hardware security features for embedded applications.

Designed for use in embedded systems requiring heterogeneous processing, graphics and connectivity, this device delivers a balance of compute and integration for systems-level designs.

Key Features

  • Core and Coprocessor  Dual ARM® Cortex®-A7 32-bit cores (209 MHz listed) paired with an ARM® Cortex®-M4 coprocessor for offloading real-time tasks.
  • Memory Support  Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to accommodate a range of system memory architectures.
  • Display and Graphics  Display interface support including HDMI-CEC and LCD plus built-in graphics acceleration for user interfaces and visualization tasks.
  • Connectivity  On-chip Ethernet 10/100 Mbps, multiple USB 2.0 ports and USB 2.0 OTG with PHY, plus CAN interface for broad peripheral and network options.
  • Security  ARM TrustZone (ARM TZ) security features for hardware-enforced isolation of trusted execution environments.
  • Package and Mounting  Compact 361-TFBGA (12×12) surface-mount package suitable for space-constrained board designs.
  • Operating Range  Rated for operation from −40 °C to 125 °C, supporting deployment in environments with wide temperature variation.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial HMI  Graphics acceleration and LCD/HDMI-CEC display interfaces enable responsive human-machine interfaces and embedded visualization.
  • Embedded Gateways  Ethernet, USB and CAN connectivity make the device suitable for protocol bridging and local network gateway functions.
  • IoT and Edge Controllers  Dual-core application processing with an M4 coprocessor supports mixed real-time control and higher-level service tasks in edge devices.

Unique Advantages

  • Heterogeneous Processing: Dual Cortex-A7 cores plus a Cortex-M4 coprocessor provide a split between application-level processing and real-time control, simplifying system partitioning.
  • Flexible Memory Options: Support for DDR3, DDR3L, LPDDR2 and LPDDR3 enables designers to choose the memory type that best fits performance and power targets.
  • Broad Connectivity: Integrated Ethernet, multiple USB ports including OTG with PHY, and CAN reduce external interface components and BOM complexity.
  • Hardware Security: ARM TrustZone support facilitates implementation of secure execution environments and trusted services.
  • Robust Operating Range: Specified operation from −40 °C to 125 °C provides suitability for systems exposed to wide temperature variations.
  • Compact Packaging: The 361-TFBGA (12×12) package helps minimize board footprint while retaining extensive on-chip functionality.

Why Choose STM32MP153CAC3?

STM32MP153CAC3 combines dual ARM® Cortex®-A7 application cores with a Cortex®-M4 coprocessor to deliver a flexible, integrated platform for embedded designs that require both application-level processing and real-time control. With a wide range of memory controller support, rich display and connectivity interfaces, hardware security and a compact 361-TFBGA package, it targets engineers building systems where integration, connectivity and thermal robustness matter.

The device is well suited to teams developing embedded HMIs, gateways and edge controllers who need a combination of heterogeneous compute, on-chip interfaces and a broad operating temperature range backed by RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for the STM32MP153CAC3 and to discuss how it fits your next embedded design.

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