STM32MP153CAA3

IC MPU STM32MP1 650MHZ 448LFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 448-LFBGA (18x18)

Quantity 304 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP153
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package448-LFBGA (18x18)
Display & Interface ControllersHDMI-CEC, LCDECCN5A992CEthernet10/100Mbps (1)
GradeAutomotiveGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TA)Package / Case448-LFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package448-LFBGA (18×18)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP153CAA3 – IC MPU STM32MP1 650MHZ 448LFBGA

The STM32MP153CAA3 is a high-integration microprocessor IC in the STM32MP153 series built around ARM® Cortex®-A7 application cores with an ARM® Cortex®-M4 coprocessor. It combines dual 32-bit application cores with on-chip real-time processing, multiple memory controllers and a broad set of display and connectivity interfaces for embedded system designs.

Designed for embedded applications that require display control, multimedia handling and diverse I/O, the device provides a compact 448-LFBGA package and an extended operating range for deployment in demanding environments.

Key Features

  • Core and Coprocessor Dual ARM® Cortex®-A7 32-bit cores plus an ARM® Cortex®-M4 coprocessor provide separate application and real-time processing domains.
  • Processing Speed Listed device speed: 209 MHz.
  • Memory Controllers Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types enable flexible DRAM choices for performance and power trade-offs.
  • Display and Graphics Includes LCD and HDMI-CEC display interface controllers and on-chip graphics acceleration for user-interface and multimedia tasks.
  • Connectivity and I/O On-chip Ethernet 10/100 Mbps, multiple USB 2.0 ports (including USB 2.0 OTG + PHY), and CAN support a range of wired networking and peripheral options.
  • Security ARM TrustZone (ARM TZ) security feature provides hardware-assisted isolation for secure execution domains.
  • Package and Mounting 448-LFBGA (18×18 mm) surface-mount package supports compact, high-density board designs.
  • Operating Range Rated for operation from -40 °C to 125 °C to support deployment across a wide thermal envelope.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Embedded Control Systems Dual A7 cores with an M4 coprocessor and multiple memory interfaces suit general embedded control and application-processing tasks.
  • Human‑Machine Interfaces (HMI) LCD and HDMI-CEC display controllers plus graphics acceleration enable responsive user interfaces and basic multimedia display functions.
  • Connected Devices Integrated Ethernet, USB and CAN support wired connectivity and peripheral integration for connected embedded products.
  • Industrial Electronics Extended -40 °C to 125 °C operating range and surface-mount LFBGA package are appropriate for compact, temperature-challenging deployments.

Unique Advantages

  • Heterogeneous processing Separate application (Cortex-A7) and real-time (Cortex-M4) cores allow task separation for deterministic control alongside application workloads.
  • Flexible memory options Support for DDR3, DDR3L, LPDDR2 and LPDDR3 simplifies board-level memory selection to match performance and power needs.
  • Integrated display and graphics Built-in display controllers and graphics acceleration reduce the need for external display engines, shrinking BOM and board area.
  • Broad connectivity Ethernet, multiple USB ports (including OTG + PHY) and CAN provide a wide I/O set for networking and peripheral integration without extra host controllers.
  • Extended thermal capability Operation from -40 °C to 125 °C supports use in thermally demanding environments.
  • Compact packaging 448-LFBGA (18×18) enables high-density designs while retaining a robust pin count for peripheral routing.

Why Choose STM32MP153CAA3?

The STM32MP153CAA3 offers a balanced combination of application processing and real-time control through its dual ARM® Cortex®-A7 cores and ARM® Cortex®-M4 coprocessor, along with flexible memory support and a comprehensive set of display and connectivity interfaces. Its integrated graphics capability, security feature (ARM TrustZone) and compact 448-LFBGA package make it suitable for embedded designs that require integrated multimedia, connectivity and deterministic control in a single device.

For engineers seeking a microprocessor platform within the STM32MP153 series, this device provides an integrated starting point for designs that demand diverse I/O, memory flexibility and extended temperature operation.

Request a quote or contact sales to check pricing and availability for the STM32MP153CAA3 and to discuss lead times for your design needs.

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