STM32MP153AAC3T

IC MPU STM32MP1 650MHZ 361TFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12)

Quantity 524 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP153
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package361-TFBGA (12x12)
Display & Interface ControllersHDMI-CEC, LCDECCNPENDING ECCNEthernet10/100Mbps (1)
GradeAutomotiveGraphics AccelerationYesHTS Code0000.00.0000
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TA)Package / Case361-TFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package361-TFBGA (12×12)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP153AAC3T – IC MPU STM32MP1 650MHZ 361TFBGA

The STM32MP153AAC3T is a microprocessor IC from the STM32MP153 series featuring ARM® Cortex®‑A7 application cores and an ARM® Cortex®‑M4 coprocessor. It is targeted at embedded microprocessor designs that require a combination of application processing, real‑time coprocessing and rich peripheral integration.

Built as a dual‑core, 32‑bit solution with a listed core frequency of 209 MHz and extensive memory and interface support, the device delivers system integration for embedded HMI, connectivity and industrial applications while supporting extended operating temperatures.

Key Features

  • Processor Core  ARM® Cortex®‑A7 architecture with 2 cores, 32‑bit processing. Listed core speed: 209 MHz. Includes an ARM® Cortex®‑M4 coprocessor for real‑time tasks.
  • Memory Interfaces  Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory to support a range of system memory configurations.
  • Display and Graphics  Display interface controllers include HDMI‑CEC and LCD support; on‑chip graphics acceleration is indicated.
  • Connectivity  Integrated Ethernet 10/100 Mbps (1), multiple USB 2.0 ports (2) plus USB 2.0 OTG with PHY (3), and CAN for vehicle or industrial communications.
  • Security  Supports ARM TrustZone (ARM TZ) security features.
  • Package and Mounting  361‑TFBGA package (12 × 12 mm) in a surface‑mount form factor for compact board designs.
  • Operating Range and Compliance  Operating temperature range −40 °C to 125 °C. RoHS compliant.
  • Grade  Grade: Automotive.

Typical Applications

  • Embedded Systems  Dual‑core application processing with an M4 coprocessor provides separation of application and real‑time tasks in embedded platforms.
  • Human‑Machine Interfaces (HMI)  Display controller and graphics acceleration options enable responsive LCD and HDMI‑based interfaces.
  • Industrial Control  Extended temperature range and CAN connectivity suit industrial control and automation environments requiring robust communications.
  • Networked Devices  Onboard Ethernet and multiple USB interfaces support gateway and connected‑device designs.

Unique Advantages

  • Dual‑core application plus real‑time coprocessor: Combines ARM Cortex‑A7 cores with an ARM Cortex‑M4 to separate high‑level processing from deterministic control tasks.
  • Flexible memory support: Native controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 simplify memory selection across performance and power profiles.
  • Integrated display and graphics: HDMI‑CEC, LCD controller support and graphics acceleration reduce the need for external display processors.
  • Broad connectivity set: Ethernet, multiple USB 2.0 ports, OTG with PHY and CAN provide a wide set of I/O for networking and device integration.
  • Extended thermal range and RoHS compliance: −40 °C to 125 °C operating range and RoHS compliance support deployment in temperature‑challenging environments while meeting environmental requirements.
  • Compact BGA package: 361‑TFBGA (12 × 12) surface‑mount package enables dense, space‑efficient board designs.

Why Choose STM32MP153AAC3T?

The STM32MP153AAC3T positions itself as an integrated microprocessor solution for embedded designs that need both application processing and real‑time control. Its combination of dual ARM® Cortex®‑A7 cores, an ARM® Cortex®‑M4 coprocessor, multiple memory controller options and a comprehensive set of connectivity and display interfaces helps reduce BOM complexity and streamline system integration.

This device is suitable for designers seeking a compact BGA package with extended operating temperature capability and a broad peripheral set to address HMI, industrial, and networked embedded applications where board‑level integration and interface diversity are key requirements.

Request a quote or submit an inquiry to receive pricing and availability for the STM32MP153AAC3T and to discuss how it fits your design requirements.

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