STM32MP153CAB3T

IC MPU STM32MP1 650MHZ 354LFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 354-LFBGA (16x16)

Quantity 716 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP153
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package354-LFBGA (16x16)
Display & Interface ControllersHDMI-CEC, LCDECCN5A992CEthernet10/100Mbps (1)
GradeAutomotiveGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TA)Package / Case354-LFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 650MHzSupplier Device Package354-LFBGA (16×16)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP153CAB3T – IC MPU STM32MP1 650MHZ 354LFBGA

The STM32MP153CAB3T is a microprocessor IC in the STM32MP153 series designed for embedded applications. It features an ARM® Cortex®-A7 core architecture with a dual-core 32-bit configuration and an ARM® Cortex®-M4 co-processor for real-time tasks.

Built with a broad set of on-chip memory controllers, display and connectivity interfaces, and hardware security, this device targets embedded systems that require integrated processing, multiple I/O options, and operation across an extended temperature range.

Key Features

  • Core & Coprocessor  ARM® Cortex®-A7 main processor with a 2‑core, 32‑bit configuration; includes an ARM® Cortex®-M4 coprocessor for dedicated real-time processing.
  • Performance  Device speed listed as 209 MHz, providing deterministic processing for embedded tasks.
  • Memory Controllers  Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to support a range of system memory options.
  • Display Subsystem  Includes HDMI-CEC and LCD display interface controllers for graphical user interfaces and video output.
  • Connectivity & I/O  Ethernet 10/100 Mbps (1), dual USB 2.0 ports plus USB 2.0 OTG with PHY (3), and CAN interface support for diverse connectivity requirements.
  • Graphics & Security  Graphics acceleration is included and security is supported via ARM TrustZone (ARM TZ) for hardware-assisted isolation.
  • Package & Mounting  Supplied in a 354‑LFBGA (16×16) package, intended for surface-mount assembly.
  • Operating Temperature  Rated for operation from −40°C to 125°C for use in temperature-challenging environments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Embedded controllers  Dual-core A7 plus M4 enables partitioning of high-level application processing and real-time control within embedded systems.
  • Human–Machine Interfaces (HMIs)  On-chip display controllers (HDMI-CEC, LCD) and graphics acceleration support graphical user interfaces and display-driven products.
  • Connectivity gateways  Integrated Ethernet, USB and CAN interfaces make the device suitable for networked gateways and communication modules.
  • Industrial systems  Extended −40°C to 125°C operating range and multiple memory options suit industrial control and instrumentation applications.

Unique Advantages

  • Integrated heterogeneous processing  Combines dual ARM® Cortex®-A7 cores with an ARM® Cortex®-M4 coprocessor to separate application and real-time workloads on a single device.
  • Flexible memory support  Support for DDR3, DDR3L, LPDDR2 and LPDDR3 lets designers choose memory technology that fits performance, power and cost targets.
  • Comprehensive I/O set  Built-in Ethernet, multiple USB ports including OTG with PHY, and CAN support a wide range of connectivity and peripheral needs without extra controllers.
  • Display and graphics capabilities  On-chip display controllers and graphics acceleration enable compact HMI and multimedia-capable designs.
  • Hardware security  ARM TrustZone (ARM TZ) support provides hardware-level isolation for secure execution domains.
  • Extended thermal range  Rated operation from −40°C to 125°C for deployments in thermally demanding environments.

Why Choose STM32MP153CAB3T?

The STM32MP153CAB3T positions itself as an integrated processing platform for embedded designs that require a combination of application-level compute, real-time control, multimedia interfaces, and diverse connectivity. Its combination of dual ARM® Cortex®-A7 cores, an ARM® Cortex®-M4 coprocessor, flexible memory support and multiple I/O options makes it a practical choice for systems where consolidated functionality and environmental robustness matter.

Designs that need on-chip display support, Ethernet/USB/CAN connectivity, hardware security and operation across a wide temperature window will find the device’s feature set aligned with those requirements, helping simplify board-level integration while supporting a range of embedded use cases.

Request a quote or submit an inquiry to obtain pricing and availability for the STM32MP153CAB3T and to discuss how it fits your next embedded design.

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