 | | XC2785X104F80LAAKXUMA1 | Infineon Technologies | IC MCU 16/32B 832KB FLSH 144LQFP | Microcontrollers | PG-LQFP-144-4 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: I2S, POR, PWM, WDT Program Memory Size: 832KB (832K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 24x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-4 Package / Case: 144-LQFP Exposed Pad | 291 | |
 | | XC2785X104F80LRABKXUMA1 | Infineon Technologies | IC MCU 16/32B 832KB FLSH 144LQFP | Microcontrollers | PG-LQFP-144-4 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: I2S, POR, PWM, WDT Program Memory Size: 832KB (832K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 24x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-4 Package / Case: 144-LQFP Exposed Pad | 1,051 | |
 | N/A | XC2786X96F66LACKXUMA1 | Infineon Technologies | IC MCU 16/32B 768KB FLSH 144LQFP | Microcontrollers | PG-LQFP-144-4 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: I2S, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 24x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-4 Package / Case: 144-LQFP Exposed Pad | 237 | |
 | N/A | XC2787X200F100LABKXUMA1 | Infineon Technologies | IC MCU 16/32B 1.6MB FLSH 144LQFP | Microcontrollers | PG-LQFP-144-13 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: I2S, POR, PWM, WDT Program Memory Size: 1.6MB (1.6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 24x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-13 Package / Case: 144-LQFP Exposed Pad | 447 | |
 | N/A | XC2788X136F128LRAAKXUMA1 | Infineon Technologies | IC MCU 16/32BIT 1.06MB 144LQFP | Microcontrollers | PG-LQFP-144-13 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, FlexRay, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Program Memory Size: 1.06MB (1.06M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-13 Package / Case: 144-LQFP Exposed Pad | 1,844 | |
 | | XC2797X200F100LABKXUMA1 | Infineon Technologies | IC MCU 16/32B 1.6MB FLSH 176LQFP | Microcontrollers | PG-LQFP-176-12 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: I2S, POR, PWM, WDT Program Memory Size: 1.6MB (1.6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 30x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-176-12 Package / Case: 176-LQFP Exposed Pad | 208 | |
 | | XC2S100-5FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 482 | |
 | | XC2S100-5FG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 1,822 | |
 | | XC2S100-5FG456C | Advanced Micro Devices | IC FPGA 196 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 1,379 | |
 | | XC2S100-5FG456I | Advanced Micro Devices | IC FPGA 196 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 610 | |
 | | XC2S100-5FGG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 1,476 | |
 | | XC2S100-5FGG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 720 | |
 | | XC2S100-5PQ208C | Advanced Micro Devices | IC FPGA 140 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 594 | |
 | | XC2S100-5PQ208I | Advanced Micro Devices | IC FPGA 140 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 754 | |
 | | XC2S100-5PQG208C | Advanced Micro Devices | IC FPGA 140 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 187 | |
 | | XC2S100-5PQG208I | Advanced Micro Devices | IC FPGA 140 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 253 | |
 | | XC2S100-5TQ144C | Advanced Micro Devices | IC FPGA 92 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 194 | |
 | | XC2S100-5TQ144I | Advanced Micro Devices | IC FPGA 92 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 226 | |
 | | XC2S100-5TQG144C | Advanced Micro Devices | IC FPGA 92 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 1,018 | |
 | | XC2S100-5TQG144I | Advanced Micro Devices | IC FPGA 92 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 1,780 | |