 | | XC2797X200F100LABKXUMA1 | Infineon Technologies | IC MCU 16/32B 1.6MB FLSH 176LQFP | Microcontrollers | PG-LQFP-176-12 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: I2S, POR, PWM, WDT Program Memory Size: 1.6MB (1.6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 30x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-176-12 Package / Case: 176-LQFP Exposed Pad | 915 | |
 | | XC2S100-5FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 231 | |
 | | XC2S100-5FG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 347 | |
 | | XC2S100-5FG456C | Advanced Micro Devices | IC FPGA 196 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 1,156 | |
 | | XC2S100-5FG456I | Advanced Micro Devices | IC FPGA 196 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 1,293 | |
 | | XC2S100-5FGG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 628 | |
 | | XC2S100-5FGG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 2700 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 256-FBGA (17×17) | 628 | |
 | | XC2S100-5PQ208C | Advanced Micro Devices | IC FPGA 140 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 2700 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 208-PQFP (28×28) | 1,716 | |
 | | XC2S100-5PQ208I | Advanced Micro Devices | IC FPGA 140 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 711 | |
 | | XC2S100-5PQG208C | Advanced Micro Devices | IC FPGA 140 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 1,144 | |
 | | XC2S100-5PQG208I | Advanced Micro Devices | IC FPGA 140 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 2700 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 208-PQFP (28×28) | 620 | |
 | | XC2S100-5TQ144C | Advanced Micro Devices | IC FPGA 92 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 2700 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 144-TQFP (20×20) | 35 | |
 | | XC2S100-5TQ144I | Advanced Micro Devices | IC FPGA 92 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 498 | |
 | | XC2S100-5TQG144C | Advanced Micro Devices | IC FPGA 92 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 2700 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 144-TQFP (20×20) | 520 | |
 | | XC2S100-5TQG144I | Advanced Micro Devices | IC FPGA 92 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 330 | |
 | | XC2S100-6FG456C | Advanced Micro Devices | IC FPGA 196 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 699 | |
 | | XC2S100-6FGG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 424 | |
 | | XC2S100-6PQ208C | Advanced Micro Devices | IC FPGA 140 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 2700 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 208-PQFP (28×28) | 224 | |
 | | XC2S100-6PQG208C | Advanced Micro Devices | IC FPGA 140 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 2700 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 208-PQFP (28×28) | 791 | |
 | | XC2S100-6TQG144C | Advanced Micro Devices | IC FPGA 92 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 296 | |