UCD1C151MCS1GS

The UCD1C151MCS1GS is a chip-type, low-impedance aluminum electrolytic capacitor engineered for surface-mount assembly on high-density PC boards. It delivers 150 µF capacitance at a 16 V rating in a compact φ6.3 × 7.7 mm SMD can.

Designed with automotive-grade qualification and robust environmental ratings, this capacitor targets automotive and other demanding applications that require temperature stability, vibration resistance, and surface-mount compatibility with embossed carrier taping.

Key Features

• Core / Type Chip-type, low impedance aluminum electrolytic capacitor optimized for surface-mount placement on high-density PCBs.
• Capacitance & Tolerance 150 µF nominal capacitance with a tolerance of −20% to +20% (measured at 120 Hz, 20°C).
• Rated Voltage 16 V rated voltage for general power decoupling and filtering functions.
• Loss Factor (tan δ) tanδ = 0.16 (measurement condition: 20°C, 120 Hz) indicating the specified dissipation factor at the rated voltage.
• Ripple Current Low-frequency ripple current 145 mA at 120 Hz and high-frequency ripple current 290 mA at 10 kHz.
• Leakage Current Specified leakage current of 24 µA under rated conditions.
• Temperature & Endurance Operating temperature range −55°C to +105°C with endurance specified as 2000 hours at 105°C.
• Package & Mounting Surface-mount radial can (SMD) in size φ6.3 × 7.7 mm, supplied in embossed carrier taping for automatic placement.
• Reliability & Compliance AEC‑Q200 qualified and RoHS compliant; vibration resistant construction for mechanically demanding environments.

Typical Applications

• Automotive electronics — Suited for use in automotive electronic modules where AEC‑Q200 qualification and −55°C to +105°C operation are required.
• Surface-mount high-density PCBs — Designed for automatic mounting with embossed carrier taping and compact φ6.3 × 7.7 mm package dimensions.
• Vibration-prone assemblies — Vibration resistant construction supports use in mechanically active environments.

Unique Advantages

• Compact SMD can — φ6.3 × 7.7 mm package minimizes board area while supporting surface-mount automated placement.
• Low-impedance design — Chip-type construction with a specified tanδ of 0.16 at 20°C, 120 Hz, helping maintain performance under typical AC conditions.
• Dual-frequency ripple capability — Rated ripple currents of 145 mA (120 Hz) and 290 mA (10 kHz) provide specification across both low and high frequency domains.
• High-temperature endurance — 2000 hours at 105°C offers predictable life performance in elevated-temperature applications.
• Automotive-grade qualification — AEC‑Q200 rating supports deployment in automotive systems that require industry-recognized component qualification.
• Supply-chain friendly packaging — Embossed carrier taping enables compatibility with automated pick-and-place equipment for high-volume production.

Why Choose UCD1C151MCS1GS?

The UCD1C151MCS1GS combines a compact SMD package with low-impedance, vibration-resistant aluminum electrolytic technology and automotive-grade qualification. Its balance of capacitance, rated voltage, and ripple-current capability makes it suitable for designs that demand consistent electrical performance across wide temperatures and mechanical stress.

This part is well suited to engineers and procurement teams specifying components for automotive electronics and other applications requiring RoHS compliance, AEC‑Q200 qualification, and surface-mount compatibility with embossed carrier taping for automated assembly.

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