UCD1C151MCL1GS

The UCD1C151MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount use on high-density PC boards. It delivers 150 µF at 16 V in a compact φ6.3 × 7.7 mm can, offering stable performance across a wide temperature range and automated assembly compatibility.

Targeted for demanding electronics including automotive systems, this SMD capacitor provides measurable ripple-handling capability, tight thermal endurance, and RoHS-compliant construction for integrated power decoupling and filtering in compact designs.

Key Features

• Capacitance & Voltage: 150 µF rated at 16 V with ±20% tolerance, suitable for bulk decoupling and energy storage in compact SMD layouts.
• Low Loss / Low Impedance: tanδ = 0.16 (measured at 20°C, 120 Hz) for reduced AC losses in filtering and smoothing applications.
• Ripple Performance: Specified ripple capability of 145 mA at 120 Hz (low-frequency) and 290 mA at 10 kHz (high-frequency) to support dynamic power loads.
• Leakage Current: Low leakage current specified at 24 µA, aiding in low-standby-power designs and stable bias conditions.
• Temperature & Endurance: Rated operation from −55°C to +105°C with a 2000-hour endurance rating at 105°C for sustained high-temperature reliability.
• Automotive-Grade Qualification: AEC-Q200 rating, supporting use in designs requiring automotive-level component qualification.
• SMD Package & Assembly: Chip-type radial can SMD, size φ6.3 × 7.7 mm (L: 7.7 × D: 6.3 mm) with embossed carrier taping for automatic placement.
• Regulatory Compliance: RoHS compliant construction.

Typical Applications

• Automotive Electronic Modules: AEC-Q200 qualification and wide temperature range make this capacitor suitable for control modules and in-vehicle electronics where SMD packaging is required.
• High-Density PCB Power Rails: Compact chip form factor and specified ripple ratings support local decoupling and smoothing on space-constrained boards.
• Automated Assembly Lines: Embossed carrier taping and SMD can package enable efficient automatic placement in high-volume manufacturing.

Unique Advantages

• Compact SMD Can: φ6.3 × 7.7 mm chip form delivers 150 µF capacitance in a small footprint for dense board layouts.
• Measured Ripple Capability: Separate low- and high-frequency ripple current specifications (145 mA @ 120 Hz, 290 mA @ 10 kHz) let designers quantify AC handling for both mains-frequency and switching noise.
• Temperature-Rated Endurance: 2000 hours at 105°C supports long-term operation in elevated-temperature environments.
• Automotive-Grade Reliability: AEC-Q200 rating provides an added level of qualification for safety- and reliability-focused designs.
• Assembly-Ready Packaging: Embossed carrier taping simplifies pick-and-place integration for high-volume automated manufacturing.
• Low Leakage: Specified 24 µA leakage current aids in maintaining stable bias and low quiescent currents.

Why Choose UCD1C151MCL1GS?

The UCD1C151MCL1GS pairs a compact chip-type SMD can with low-impedance characteristics, measurable ripple performance, and automotive-level qualification to meet the needs of modern, space-constrained power designs. Its combination of 150 µF capacitance, 16 V rating, and tested endurance at 105°C makes it appropriate for engineers specifying reliable decoupling and smoothing components for harsh environments and automated production.

This part suits designers who need proven performance parameters—capacitance, ripple current, leakage, temperature range, and endurance—packaged for surface-mount assembly and backed by RoHS compliance and AEC-Q200 qualification.

For pricing, availability, or to request a quote for UCD1C151MCL1GS, submit a quotation request or contact our sales team to discuss your design requirements and projected volumes.