UCD1C102MNL1GS

The UCD1C102MNL1GS is a Nichicon UCD series aluminum electrolytic capacitor in a chip-type, surface-mount can. It delivers 1000 µF at 16 V with a low-impedance construction optimized for high-density PCB placement and automated assembly.

Designed for demanding thermal and reliability requirements, this part supports an operating temperature range of −55°C to 105°C, AEC‑Q200 qualification, and a rated endurance of 5000 hours at 105°C, making it suitable for automotive and other robust electronics applications.

Key Features

• Capacitance & Voltage — 1000 µF nominal capacitance at a rated voltage of 16 V provides substantial bulk energy storage in a compact SMD can (φ10 × 13.5 mm).
• Low Impedance Performance — Typical impedance of 80 mΩ and tanδ (DF) at 0.16 (measured at 20°C, 120 Hz) for low-loss operation.
• Ripple Current Capability — Low-frequency ripple current 475 mA (120 Hz) and high-frequency ripple current 950 mA (10 kHz) for effective AC ripple absorption across a range of frequencies.
• Reliability & Endurance — Rated life of 5000 hours at 105°C with specified limits for capacitance change, tanδ, and leakage current after endurance testing.
• Automotive-Grade Qualification — AEC‑Q200 qualified and specified for automotive applications, supporting designs that require automotive-grade components.
• Surface-Mount, Tape-Packaged — Chip type, surface-mount can supplied in embossed carrier taping for compatibility with automatic placement equipment and high-density boards.
• Wide Temperature Range — Operational from −55°C to 105°C for use across harsh thermal environments.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Automotive Electronics — Suitable for automotive electronic modules where AEC‑Q200 qualification and −55°C to 105°C operation are required.
• High‑Density SMD Assemblies — Designed for surface mounting on high-density PCBs and compatible with automatic carrier-tape placement.
• Power Supply Filtering — 1000 µF capacitance combined with specified low- and high-frequency ripple current ratings supports smoothing and ripple control in power stages.
• Industrial Embedded Modules — Provides robust bulk capacitance and endurance for industrial electronics operating at elevated temperatures.

Unique Advantages

• High Capacitance in Compact SMD Can: 1000 µF in a φ10 × 13.5 mm package saves board area while delivering required energy storage.
• Low-Impedance Design: 80 mΩ impedance and a tanδ of 0.16 at 16 V reduce AC loss and improve voltage stability under load.
• Dual-Frequency Ripple Handling: Rated for 475 mA at 120 Hz and 950 mA at 10 kHz to address both low- and high-frequency ripple demands.
• Automotive-Grade Reliability: AEC‑Q200 qualification and 5000-hour endurance at 105°C provide confidence for automotive and high-reliability programs.
• Assembly-Ready Packaging: Embossed carrier taping enables automated placement and efficient production flow for high-volume manufacturing.
• Wide Operating Temperature: −55°C to 105°C specification supports use across harsh environmental conditions.

Why Choose UCD1C102MNL1GS?

The UCD1C102MNL1GS combines substantial bulk capacitance with low impedance and robust thermal endurance in a surface-mount, tape-packaged chip can. Its AEC‑Q200 qualification and 5000-hour life at 105°C position it for applications that require automotive-grade reliability and long-term stability under elevated temperature stress.

Engineers designing compact power systems, automotive modules, or high-density SMD assemblies will find this Nichicon UCD part valuable for reducing board area while meeting ripple, leakage, and lifetime requirements—backed by RoHS compliance and packaging suited for automated assembly.

Request a quote or contact sales to discuss pricing, availability, and sample requests for UCD1C102MNL1GS.