UCD1A681MNS1GS

The UCD1A681MNS1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor in a surface‑mount can package designed for high‑density PCB assembly. It delivers 680 µF capacitance at 10 V with engineered low loss and elevated ripple capability for demanding power management on compact boards.

Targeted for applications that require automotive‑grade reliability and automated placement, this part combines AEC‑Q200 qualification, wide operating temperature range (‑55 °C to 105 °C), and embossed carrier taping for machine feeding and high‑volume production.

Key Features

• Core Capacitance — 680 µF nominal capacitance with ±20% tolerance at 120 Hz, 20 °C, suitable where bulk capacitance is required in a compact SMD package.
• Rated Voltage — 10 V working voltage, providing defined performance at low DC voltage rails.
• Low Impedance & Loss — Designed as a low‑impedance chip type; tan δ = 0.19 (measured at 20 °C, 120 Hz, 10 V) for reduced AC loss in filtering and decoupling roles.
• High Ripple Current Capability — Handles 425 mA at 120 Hz and 850 mA at 10 kHz, enabling effective ripple handling across low and high frequency ranges.
• Reliability & Endurance — Rated life of 5000 hours at 105 °C with capacitance change and leakage current limits specified for long‑term operation.
• Automotive Grade & Compliance — AEC‑Q200 qualified and RoHS compliant for regulated production environments.
• Compact SMD Can Package — ϕ10 × 10 mm size with surface mount land size 10.3 × 10.3 mm and embossed carrier taping for automatic placement.
• Wide Temperature Range — Operates from ‑55 °C to 105 °C, supporting thermal margins in harsh operating conditions.

Typical Applications

• Automotive Electronics — Suitable for modules where AEC‑Q200 qualification is required and long endurance at elevated temperature is essential.
• High‑Density SMD Power Supplies — Compact chip form factor and low impedance make it suitable for bulk filtering and decoupling on space‑constrained PCBs.
• Automated Assembly Lines — Embossed carrier taping enables efficient machine feeding and placement in high‑volume manufacturing.

Unique Advantages

• High Capacitance in a Small Footprint: 680 µF in a ϕ10 × 10 mm SMD can reduces board area while providing necessary bulk energy storage.
• Engineered for Low Loss: Specified tan δ of 0.19 at 10 V (120 Hz, 20 °C) limits AC loss for better efficiency in filtering applications.
• Broad Ripple Handling: Dual ripple ratings (425 mA at 120 Hz and 850 mA at 10 kHz) address both low‑ and high‑frequency ripple demands.
• Automotive‑Grade Reliability: AEC‑Q200 qualification and a 5000‑hour endurance rating at 105 °C support demanding lifecycle requirements.
• Production‑Ready Packaging: Embossed carrier taping simplifies integration into automated pick‑and‑place workflows.
• Wide Operating Temperature: ‑55 °C to 105 °C operation supports use across a broad range of environmental conditions.

Why Choose UCD1A681MNS1GS?

The UCD1A681MNS1GS is positioned for designers who need compact, high‑capacitance SMD electrolytic solutions with low impedance and proven endurance at elevated temperatures. Its combination of 680 µF capacitance, defined loss characteristics, and robust ripple handling makes it suitable for power filtering and decoupling tasks on space‑constrained, high‑density PCBs.

With AEC‑Q200 qualification, RoHS compliance, and embossed carrier taping for automated assembly, this part delivers a practical balance of performance, reliability, and manufacturability for volume production in regulated environments.

Request a quote or submit specifications to our sales team to evaluate UCD1A681MNS1GS for your next design and production run.