UCD1A680MCL1GS

The UCD1A680MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor in a compact surface-mount can. It provides 68 µF capacitance at 10 V with a capacitance tolerance of -20% to +20% and a measured dissipation factor (tanδ) of 0.19 at 20°C, 120 Hz.

Targeted for high-density surface-mount applications and automotive electronics, the UCD1A680MCL1GS combines low impedance (360 mΩ), high-frequency ripple handling (240 mA at 10 kHz), an extended temperature range of -55°C to 105°C, and AEC-Q200 qualification for demanding environments. Parts are supplied in embossed carrier tape for automated placement.

Key Features

• Electrical Performance 68 µF capacitance at 10 V with an impedance of 360 mΩ and tanδ of 0.19 (20°C, 120 Hz), suitable for decoupling and smoothing duties in compact power circuits.
• Ripple Handling Low-frequency ripple current 120 mA (120 Hz) and high-frequency ripple current 240 mA (10 kHz) to support both bulk and high-frequency noise filtering.
• Leakage and Stability Specified leakage current of 6.8 µA and capacitance tolerance of -20% to +20% for predictable behavior in long-term designs.
• Reliability and Endurance Life rating of 2000 hours at 105°C and AEC-Q200 qualification, providing defined endurance for temperature-stressed applications.
• Thermal Range Operating temperature from -55°C to 105°C to cover a broad range of environmental conditions.
• Package and Mounting Chip-type SMD can, size φ6.3 × 5.8L (L: 5.8 mm × D: 6.3 mm), surface-mount land size 6.6 × 6.6 mm, and embossed carrier taping for automated assembly.
• Standards RoHS compliant and AEC-Q200 rated per the supplied product data.

Typical Applications

• Automotive Electronics — Used for power filtering and decoupling in control modules where AEC-Q200-qualified components and extended temperature performance are required.
• Power Supply Decoupling — Low impedance and specified ripple currents make it suitable for smoothing and transient suppression in DC-DC converters and regulator outputs.
• High-Density SMD Assemblies — Compact chip-type can (φ6.3 × 5.8L) and embossed carrier tape packaging support automated placement on space-constrained PCBs.
• Embedded Control Modules — Provides stable capacitance and leakage characteristics for controller boards operating across a wide temperature range.

Unique Advantages

• Compact, surface-mount form factor — Small φ6.3 × 5.8L package reduces board area while remaining compatible with automated assembly.
• Low impedance for better transient response — 360 mΩ impedance and low tanδ help maintain voltage stability during switching events.
• High-frequency ripple capability — 240 mA at 10 kHz supports high-frequency decoupling needs in switching power circuits.
• Automotive-grade qualification — AEC-Q200 rating provides a clear, manufacturer-specified level of reliability for automotive designs.
• Wide operating temperature — -55°C to 105°C rating allows deployment in a broad set of environmental conditions.
• Defined endurance — 2000 hours at 105°C gives a measurable lifetime parameter for long-term thermal stress planning.

Why Choose UCD1A680MCL1GS?

The UCD1A680MCL1GS positions itself as a compact, well-specified solution for designers needing low-impedance aluminum electrolytic capacitance in surface-mount assemblies. Its combination of 68 µF/10 V electrical characteristics, measurable ripple current capability, AEC-Q200 qualification, and extended temperature and endurance ratings make it suited to applications where performance and reliability must be balanced with board space and automated production.

This part is appropriate for engineers and procurement teams building power delivery and filtering subsystems for automotive and industrial embedded electronics who require verifiable specifications for endurance, leakage, and thermal operation.

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