UCD1A471MCL6GS

The UCD1A471MCL6GS is a chip-type, low-impedance aluminum electrolytic capacitor in a surface-mount can designed for high-density PCBs and automated assembly. It delivers 470 µF capacitance at a 10 V rating with a compact φ10 × 7.7 mm package and embossed carrier taping for pick-and-place integration.

Engineered for robust operation across −55 °C to 105 °C and qualified to AEC-Q200, this part targets demanding power filtering and decoupling roles where high capacitance, low impedance, and elevated temperature endurance are required.

Key Features

• Capacitance & Voltage 470 µF nominal capacitance with a 10 V rated voltage and ±20% tolerance at 120 Hz, 20 °C.
• Low Impedance Performance Rated impedance of 180 mΩ and tan δ of 0.19 (measured at 20 °C, 120 Hz) to support improved transient response and filtering.
• Ripple Handling Specified ripple current of 300 mA at 120 Hz and 600 mA at 10 kHz for both low- and high-frequency filtering applications.
• Leakage & Reliability Low leakage current of 47 µA and endurance rated at 2000 hours at 105 °C with defined capacitance, tan δ, and leakage limits after endurance testing.
• Temperature Range & Endurance Wide operating temperature from −55 °C to 105 °C and specified 2000 h life at 105 °C for sustained high-temperature operation.
• Compact SMD Package Chip-type radial can SMD in φ10 × 7.7 mm (L: 7.7 mm, D: 10 mm) with recommended land size L: 10.3 mm × W: 10.3 mm for surface mounting.
• Assembly & Compliance Supplied in embossed carrier taping for automated placement; RoHS compliant and AEC-Q200 qualified for demanding applications.

Typical Applications

• Automotive power rail decoupling — AEC-Q200 qualification and −55 °C to 105 °C rating make this capacitor suitable for stabilizing low-voltage rails in automotive modules.
• DC–DC converter output filtering — High capacitance with low impedance and specified ripple current supports smoothing and transient suppression at converter outputs.
• High-density SMD power assemblies — Chip-type can and embossed carrier taping enable automated placement on compact PCBs for power management circuits.
• Embedded control and infotainment electronics — Long-life endurance at elevated temperature and low leakage current help maintain stable supply performance in electronics operating over extended periods.

Unique Advantages

• High capacitance in a compact SMD can 470 µF in a φ10 × 7.7 mm package reduces board footprint while delivering bulk energy storage for local decoupling.
• Low-impedance electrical behavior 180 mΩ impedance and a measured tan δ of 0.19 improve transient response and reduce voltage ripple on regulated rails.
• Designed for elevated-temperature duty Rated for operation to 105 °C with a 2000 h endurance specification at that temperature for applications that require sustained thermal performance.
• Automotive-grade qualification AEC-Q200 qualification provides an added level of design assurance for automotive and other demanding environments.
• Manufacturing-ready packaging Embossed carrier taping supports automated pick-and-place assembly for high-volume production.
• Low leakage and defined ripple capability 47 µA leakage current and explicit low-/high-frequency ripple ratings simplify power-budgeting and thermal planning.

Why Choose UCD1A471MCL6GS?

The UCD1A471MCL6GS offers a balanced combination of high capacitance, low impedance, and compact SMD packaging tailored for applications that demand reliable power filtering in elevated temperature environments. With AEC-Q200 qualification, embossed carrier taping, and a 2000‑hour endurance at 105 °C, it is well suited for designers specifying components for robust, long-life systems.

This part is ideal for engineers and procurement teams building power delivery networks for automotive modules, DC–DC converters, and high-density electronic assemblies where space, thermal resilience, and automated manufacturing readiness are priorities.

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