UCD1A471MNL1GS

The UCD1A471MNL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor in a surface‑mount can package. Designed for automated placement from embossed carrier tape, it targets high‑density PCB assemblies where elevated temperature endurance, stable capacitance, and high ripple handling are required.

Key attributes include 470 µF capacitance at 10 V, low dissipation (tan δ = 0.19 at 20°C/120 Hz), AEC‑Q200 qualification, RoHS compliance, and rated operation from −55°C to 105°C with 5,000 hours endurance at 105°C.

Key Features

• Capacitance & Voltage — 470 µF nominal capacitance with ±20% tolerance, rated for 10 V operation.
• Low Impedance Performance — Chip‑type low impedance construction with tan δ of 0.19 (measured at 20°C, 120 Hz) for effective AC ripple attenuation.
• Ripple Current Capability — Supports 300 mA at 120 Hz (low frequency) and 600 mA at 10 kHz (high frequency), enabling robust performance in power filtering and decoupling tasks.
• Leakage Current — Specified leakage current of 47 µA, consistent with stable long‑term operation after voltage application.
• Extended Temperature & Lifetime — Operating range −55°C to 105°C with an endurance rating of 5,000 hours at 105°C, suitable for demanding thermal environments.
• Surface‑Mount Package — Radial can SMD (φ8 × 10L) suitable for automated assembly; supplied in embossed carrier taping for pick‑and‑place machines.
• Automotive Qualification & Compliance — AEC‑Q200 qualified and RoHS compliant, supporting designs with automotive reliability requirements.

Typical Applications

• Automotive Electronic Modules — AEC‑Q200 qualification and 105°C endurance make the part suitable for control modules and in‑vehicle electronics requiring robust capacitive filtering.
• Power Supply Decoupling — 470 µF at 10 V combined with low impedance and high ripple current suits bulk decoupling in DC‑DC converters and power rails.
• High‑Density PCB Designs — Chip‑type SMD format and embossed carrier taping enable automated placement on compact, densely populated boards.

Unique Advantages

• High Capacitance in a Compact SMD Can: 470 µF in a φ8 × 10L package provides substantial bulk capacitance while conserving board area.
• Validated Automotive Reliability: AEC‑Q200 qualification supports use in safety‑critical and rugged environments where component qualification matters.
• Thermal Endurance: Rated for −55°C to 105°C and 5,000 hours at 105°C, delivering predictable lifetime performance in elevated temperature applications.
• Strong Ripple Handling: Combined low and high frequency ripple current ratings (300 mA @120 Hz, 600 mA @10 kHz) reduce heating and extend service life under AC stress.
• Assembly‑Friendly Packaging: Embossed carrier taping designed for automatic mounting simplifies high‑volume production and improves throughput.
• Regulatory Compliance: RoHS compliance ensures conformity with common environmental regulations for electronic assemblies.

Why Choose UCD1A471MNL1GS?

The UCD1A471MNL1GS balances high capacitance, low impedance, and automotive‑grade reliability in a compact, surface‑mount can. Its combination of ripple current capability, low tan δ, and extended temperature/lifetime ratings make it a practical choice for power filtering and decoupling in demanding electronic systems.

This part is well suited to designers and manufacturers needing a compact electrolytic solution for automotive and industrial applications where AEC‑Q200 qualification, RoHS compliance, and automated assembly readiness matter for long‑term robustness and production efficiency.

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