UCD1A681MNL1GS

The UCD1A681MNL1GS is a chip-type, low-impedance aluminum electrolytic capacitor in a surface-mount radial can package. It delivers 680 µF at 10 V in a compact φ10 × 10L (1.0 × 1.0 cm) footprint and is supplied in embossed carrier taping for automated assembly.

Designed for high-density SMD boards and applications requiring elevated temperature endurance, the part offers a broad operating range from −55 °C to +105 °C and is AEC-Q200 qualified for automotive use.

Key Features

• Capacitance & Voltage — 680 µF rated capacitance at 10 V with ±20% tolerance.
• Low Impedance Design — Chip-type, low-impedance construction for SMD mounting; tangent of loss angle (tan δ) specified as 0.19 at 10 V, 20 °C, 120 Hz.
• Ripple Current Performance — Low-frequency ripple current of 425 mA (120 Hz) and high-frequency ripple current of 850 mA (10 kHz) to support decoupling and smoothing duties in power circuits.
• Leakage Current — Specified leakage current of 68 µA.
• Temperature & Endurance — Operating temperature −55 °C to +105 °C with rated life of 5000 hours at 105 °C.
• Package & Mounting — Surface-mount radial can (φ10 × 10L / 1.0 × 1.0 cm) supplied on embossed carrier tape for automatic placement.
• Compliance & Qualification — RoHS compliant and AEC-Q200 qualified for automotive electronics.
• Polarized — Polarized aluminum electrolytic construction for DC applications.

Typical Applications

• Automotive Electronics — Suited for automotive electronic modules where AEC-Q200 qualification and high-temperature endurance are required.
• High-Density SMD Boards — Compact chip-type form factor fits densely populated PCBs and surface-mount assemblies.
• Automated Assembly Lines — Embossed carrier taping enables placement by automated mounting equipment for volume production.

Unique Advantages

• Compact, high-capacitance SMD option: 680 µF in a φ10 × 10L can (1.0 × 1.0 cm) reduces board area for high-density designs.
• High-temperature endurance: 5000 hours at 105 °C supports long-term reliability in elevated temperature environments.
• Automotive-ready qualification: AEC-Q200 qualification provides specification-level confidence for automotive system integration.
• Measurable low-loss behavior: Specified tan δ (0.19 at 10 V, 20 °C, 120 Hz) helps predict AC performance under operating conditions.
• Robust ripple handling: Dual ripple current ratings (425 mA at 120 Hz, 850 mA at 10 kHz) accommodate both low- and high-frequency ripple in power circuits.
• Production-friendly packaging: Embossed carrier tape simplifies automated pick-and-place and volume manufacturing workflows.

Why Choose UCD1A681MNL1GS?

UCD1A681MNL1GS combines a compact chip-type aluminum electrolytic construction with low impedance characteristics and defined AC performance, making it a practical choice for designers targeting high-density, high-temperature applications. Its AEC-Q200 qualification and 5000-hour endurance at 105 °C position it for demanding electronics where validated reliability matters.

This part is suited to teams building automotive modules or other production designs that require a surface-mount, high-capacitance electrolytic capacitor supplied for automated assembly. The combination of ripple capability, leakage specification, and carrier-tape packaging supports both prototype evaluation and volume manufacturing.

Request a quote or submit an RFQ for UCD1A681MNL1GS to obtain pricing, availability, and lead-time information for your project requirements.