UCD1C100MCL1GS

The UCD1C100MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mounting on high‑density PC boards. With a 10 µF capacitance at 16 V, compact φ4 × 5.8 mm package and embossed carrier taping, it is intended for automated assembly and applications requiring stable performance across a wide temperature range.

Key value comes from a combination of low leakage, measurable high‑frequency ripple capability and AEC‑Q200 qualification, supporting reliability needs in demanding environments.

Key Features

• Capacitance & Voltage — 10 µF nominal capacitance rated at 16 V for board‑level energy storage and decoupling.
• Low Impedance — Specified impedance of 1.35 Ω and a low dissipation factor (tan δ = 0.16 at 20 °C, 120 Hz) to reduce losses in AC conditions.
• Ripple Current Handling — Low‑frequency ripple current 45 mA (120 Hz) and high‑frequency ripple current 90 mA (100 kHz) for both bulk and higher‑frequency smoothing tasks.
• Low Leakage — Leakage current specified at 3 µA for stable bias behavior over time.
• Temperature & Endurance — Operates from −55 °C to +105 °C with an endurance rating of 2000 hours at 105 °C.
• Package & Mounting — Compact chip form factor φ4 × 5.8 mm (D × L), surface‑mount radial can (SMD) with embossed carrier taping suitable for automatic placement.
• Automotive Reliability — AEC‑Q200 listed to support qualification requirements for automotive applications.
• Compliance — RoHS compliant.

Typical Applications

• Automotive Electronics — AEC‑Q200 listing and broad temperature range make this capacitor suitable for control modules and electronic subsystems requiring automotive‑grade components.
• High‑density PCBs — Chip‑type surface mount package and embossed carrier taping are intended for automated assembly in compact board layouts.
• Power Filtering and Smoothing — Low impedance and specified ripple current ratings support smoothing and local energy buffering in power rails and supply circuits.

Unique Advantages

• Automotive‑capable qualification: AEC‑Q200 listing provides a documented qualification status for designers targeting automotive use cases.
• Compact SMD form factor: φ4 × 5.8 mm chip package minimizes board area while supporting automated placement through embossed carrier taping.
• Measured ripple performance: Separate ripple current ratings for low (45 mA at 120 Hz) and high frequency (90 mA at 100 kHz) help engineers size components for both bulk and high‑frequency demands.
• Stable across temperature: Rated for −55 °C to +105 °C with a 2000‑hour endurance at 105 °C for predictable lifetime behavior in demanding thermal environments.
• Low leakage and loss: 3 µA leakage current and tan δ = 0.16 (20 °C, 120 Hz) contribute to efficient energy retention and reduced heat generation.
• Assembly‑friendly packaging: Embossed carrier taping enables efficient pick‑and‑place processing for volume production.

Why Choose UCD1C100MCL1GS?

The UCD1C100MCL1GS balances compact SMD packaging with low‑impedance electrical characteristics and automotive‑focused qualification. It is well suited for designers who need a reliable surface‑mount aluminum electrolytic capacitor with clear ripple and leakage specifications and a proven endurance at elevated temperature.

Backed by Nichicon’s UCD series design, this part targets applications where board space, automated assembly and sustained performance over temperature and time matter, delivering a clear specification set for engineering and procurement decision making.

Request a quote or contact sales to discuss availability, pricing and sample quantities for UCD1C100MCL1GS.