UCD1A560MCL1GS

The UCD1A560MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface‑mount use. It delivers 56 µF capacitance at a 10 V rating in a compact φ6.3 × 5.8 mm SMD can optimized for high‑density PCBs and automated assembly.

Built to withstand extended thermal stress, this part supports operation from −55 °C to 105 °C and meets AEC‑Q200 qualification, making it suitable for demanding automotive and industrial electronics where reliability and compact power decoupling are required.

Key Features

• Capacitance & Voltage: 56 µF nominal capacitance at a 10 V rated voltage with ±20% tolerance for predictable decoupling performance.
• Low loss / Low impedance: tanδ = 0.19 measured at 20 °C, 120 Hz and specified impedance of 360 mΩ to support effective filtering and transient suppression.
• Ripple current capability: 120 mA at 120 Hz (low frequency) and 240 mA at 10 kHz (high frequency) to handle both bulk and high‑frequency ripple on power rails.
• Leakage current: Low leakage rated at 5.6 µA, supporting stable bias conditions in sensitive circuits.
• Temperature & Endurance: Operating range −55 °C to 105 °C with an endurance rating of 2000 hours at 105 °C for sustained high‑temperature performance.
• Compact SMD package: φ6.3 × 5.8 mm can in a surface‑mount radial style, with a recommended PCB land size of 6.6 × 6.6 mm for automated placement.
• Production‑ready packaging: Supplied in embossed carrier taping for compatibility with automatic mounting machines and high‑volume assembly.
• Standards & compliance: AEC‑Q200 qualification and RoHS compliance for regulated manufacturing and automotive programs.

Typical Applications

• Automotive electronics: Power decoupling and smoothing in control modules and infotainment systems where AEC‑Q200 qualification and −55 °C to 105 °C range are required.
• High‑density PCB power filtering: Local energy storage and ripple suppression on compact, multi‑layer boards thanks to the chip‑type SMD can and low impedance characteristics.
• Automated assembly environments: Designed for tape‑and‑reel workflows and placement by automatic mounting machines, enabling efficient high‑volume production.

Unique Advantages

• AEC‑Q200 qualified: Provides documented component reliability for automotive and similarly demanding applications.
• Low impedance with defined loss tangent: 360 mΩ impedance and tanδ = 0.19 at 20 °C/120 Hz help maintain stable voltage rails and reduce ripple‑related noise.
• Dual‑range ripple handling: Specified ripple current at both 120 Hz and 10 kHz supports mixed low‑ and high‑frequency power conditioning tasks.
• Compact SMD footprint: φ6.3 × 5.8 mm package fits tight layouts while providing 56 µF capacitance for board area‑constrained designs.
• High‑temperature endurance: Rated for 2000 hours at 105 °C, enabling long‑term operation under elevated ambient or board temperatures.
• Manufacturing friendly packaging: Embossed carrier taping streamlines integration into automated SMT lines for consistent placement and throughput.

Why Choose UCD1A560MCL1GS?

UCD1A560MCL1GS balances compact size, automotive‑grade reliability, and electrical performance for designers needing a robust surface‑mount electrolytic capacitor. Its combination of 56 µF at 10 V, low impedance, defined ripple current ratings, and AEC‑Q200 qualification makes it well suited to power decoupling and smoothing in demanding environments.

This part is ideal for engineers specifying components for automotive and industrial systems where space is limited, assembly is automated, and long‑term thermal endurance is required. Its RoHS compliance and production packaging support efficient manufacturing and regulatory needs.

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