UCD1A331MNS1GS

The UCD1A331MNS1GS is a chip-type, low-impedance aluminum electrolytic capacitor in a compact surface-mount can, designed for high-density PCBs and automated assembly. It delivers 330 µF capacitance at a 10 V rating with electrical and mechanical characteristics tailored for demanding temperature and vibration environments.

Built to industry reliability expectations, this Nichicon UCD series part supports applications that require AEC-Q200 qualification, wide operating temperature range, and extended endurance at elevated temperature.

Key Features

• Electrical Performance — 330 µF capacitance at 10 V with ±20% tolerance, providing bulk energy storage for decoupling and smoothing tasks.
• Low Loss / Low Impedance — Tangent of loss angle (tanδ) of 0.19 measured at 20°C, 120 Hz, indicating controlled dissipation for the rated voltage.
• Ripple Current Capability — Low-frequency ripple current 300 mA (120 Hz) and high-frequency ripple current 600 mA (10 kHz) to support both mains- and switching-derived noise filtering.
• Leakage Current — Specified leakage current of 33 µA, suitable for circuits sensitive to standby or bias current.
• High Temperature Endurance — Rated for operation from −55°C to +105°C with a rated endurance of 5000 hours at 105°C.
• Surface-Mount Package — φ8 × 10L radial can in an SMD package with recommended land size 8.3 × 8.3 mm; compatible with automatic mounting machines and supplied in embossed carrier taping.
• Mechanical Robustness — Vibration resistant construction for reliable SMD assembly performance in mechanically demanding environments.
• Qualification & Compliance — AEC-Q200 qualified and RoHS compliant for regulated-environment use.

Typical Applications

• Automotive Electronics — AEC-Q200 qualification and −55°C to +105°C operating range make this capacitor suitable for electronic control units and other in-vehicle modules.
• High-Density Surface-Mount PCBs — Chip-type SMD can and embossed carrier taping support automated placement on tightly packed boards.
• Vibration-Challenged Assemblies — Vibration resistant design helps maintain reliability in environments subject to mechanical stress.

Unique Advantages

• Proven Endurance: 5000 hours at 105°C provides long-term performance stability in high-temperature applications.
• Dual-Band Ripple Handling: Specified ripple currents at both 120 Hz and 10 kHz address low- and high-frequency noise suppression needs.
• Compact SMD Form Factor: φ8 × 10L can and standardized land pattern enable space-efficient board layouts and automated assembly.
• Low Dissipation: tanδ of 0.19 at 20°C, 120 Hz reduces internal heating and energy loss in cyclic operating conditions.
• Automotive-Grade Qualification: AEC-Q200 rating supports use in regulated and reliability-focused designs.
• Manufacturing-Friendly Packaging: Embossed carrier tape format facilitates pick-and-place mounting and high-volume assembly flows.

Why Choose UCD1A331MNS1GS?

UCD1A331MNS1GS combines the electrical performance of a 330 µF, 10 V low-impedance electrolytic with mechanical features needed for surface-mount, automated production. Its quantified ripple current ratings, controlled tanδ, tight leakage specification, and extended 105°C endurance make it a practical choice for designers targeting reliable power decoupling and energy storage in temperature- and vibration-sensitive environments.

Manufactured by Nichicon as part of the UCD series and carrying AEC-Q200 qualification and RoHS compliance, this part is positioned for engineers and procurement teams seeking a robust, assembly-ready SMD aluminum electrolytic capacitor for automotive and other demanding applications.

Request a quote or contact sales to discuss availability, lead times, and how UCD1A331MNS1GS fits your next design.