UCD1A330MCL6GS

The UCD1A330MCL6GS from Nichicon is a chip-type, low-impedance aluminum electrolytic capacitor engineered for surface-mount assembly on high-density PC boards. It delivers a compact 33 µF capacitance at a 10 V rating in a φ4 × 5.8 mm package designed for automated placement via embossed carrier taping.

With an operating temperature range of −55 °C to +105 °C, AEC-Q200 qualification and targeted automotive applications, this part provides reliable decoupling and smoothing performance where compact size, low impedance and elevated temperature endurance are required.

Key Features

• Core Type Chip-type aluminum electrolytic capacitor optimized for surface-mount, high-density PCB use.
• Electrical Performance 33 µF capacitance at 10 V with capacitance tolerance ±20% (120 Hz, 20 °C), low-frequency ripple current 45 mA (120 Hz) and high-frequency ripple current 90 mA (10 kHz).
• Low Loss / Low Impedance Specified tan δ of 0.19 (measured at 20 °C, 120 Hz) and an impedance of 1.35 Ω to support effective filtering and decoupling.
• Leakage Current Low leakage current of 3.3 µA supports low-standby and precision applications.
• Thermal / Endurance Rated for operation from −55 °C to +105 °C with life endurance of 2000 hours at 105 °C.
• Automotive-Grade Reliability AEC-Q200 qualified and listed for automotive applications in the product data.
• Surface-Mount Packaging Radial can SMD package (φ4 × 5.8L) with recommended land pattern 4.3 × 4.3 mm and supplied in embossed carrier taping for automated pick-and-place.
• Regulatory Compliance RoHS compliant per the product data.

Typical Applications

• Automotive control modules Decoupling and smoothing for compact power rails in automotive electronic control units, leveraging AEC-Q200 qualification and high-temperature endurance.
• DC–DC converter outputs Output filtering and ripple suppression in space-constrained SMD power stages requiring low impedance at both low and high frequencies.
• On-board power supply decoupling Local bulk capacitance and transient suppression on densely populated PCBs where a small footprint and automated placement are needed.

Unique Advantages

• Compact footprint with high capacitance density 33 µF in a φ4 × 5.8 mm chip enables significant decoupling in tight board area.
• Low-impedance, low-loss performance 1.35 Ω impedance and tan δ 0.19 at 120 Hz reduce voltage ripple and improve power-supply stability.
• Designed for automated assembly Supplied in embossed carrier taping and packaged for surface-mount placement to streamline manufacturing.
• High-temperature endurance Rated to +105 °C with 2000-hour endurance at that temperature for robust operation in elevated thermal environments.
• Automotive-capable qualification AEC-Q200 qualification supports use in automotive electronic applications where that qualification is required.
• Low leakage 3.3 µA leakage current aids in low-power and precision circuits where minimal bleed is important.

Why Choose UCD1A330MCL6GS?

UCD1A330MCL6GS positions itself as a compact, surface-mount aluminum electrolytic capacitor that combines low impedance, low leakage and high-temperature endurance in a package designed for automated assembly. Its AEC-Q200 qualification and RoHS compliance make it well suited for demanding, space-constrained power-filtering and decoupling tasks in automotive and industrial designs.

This capacitor is an appropriate choice for engineers and procurement teams seeking a reliable SMD electrolytic solution for DC–DC outputs, local power rails and other applications that require small size, controlled loss characteristics and proven thermal endurance over time.

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