UCD1A270MCL1GS

The UCD1A270MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor in a surface-mount can package. It delivers 27 µF capacitance at 10 V in a compact φ5 × 5.8 mm package designed for high-density PCB assembly.

Engineered for robust operation across a wide temperature range (−55 °C to 105 °C) and AEC‑Q200 qualification, this part addresses demanding environments where compact size, low loss and controlled leakage are required. It is supplied in embossed carrier taping for automated placement.

Key Features

• Core Type: Chip-type, low impedance construction for reduced ESR and improved AC performance.
• Electrical Performance: 27 µF nominal capacitance at 10 V with capacitance tolerance −20%~20% and measured tan δ 0.19 (120 Hz, 20 °C, 10 V).
• Ripple Handling: Low-frequency ripple current 80 mA (120 Hz) and high-frequency ripple current 160 mA (10 kHz) for AC stress capability in compact circuits.
• Leakage: Low leakage current rated at 3 µA after two minutes at rated voltage and 20 °C.
• Reliability & Endurance: Rated for 2000 hours at 105 °C with specified endurance performance.
• Package & Mounting: Surface-mount radial can (chip-style) in an embossed carrier tape format compatible with automatic mounting machines.
• Environmental Compliance: RoHS compliant and AEC‑Q200 qualified.
• Mechanical / Footprint: Compact dimensions φ5 × 5.8 L mm with recommended land size 5.3 × 5.3 mm.

Typical Applications

• Automotive electronic modules — AEC‑Q200 qualification makes this capacitor suitable for automotive control and power modules requiring SMD electrolytic parts.
• High-density PCBs — Chip-type surface-mount design is intended for assembly on high-density printed circuit boards.
• Automated assembly environments — Supplied in embossed carrier taping compatible with automatic mounting machines for high-volume production.

Unique Advantages

• Compact, low-impedance form factor: φ5 × 5.8 mm chip-type can delivers 27 µF with measured low-loss characteristics (tan δ 0.19 at 10 V, 120 Hz), enabling space-constrained board designs.
• Designed for AC stress: Specified ripple currents of 80 mA (120 Hz) and 160 mA (10 kHz) provide quantified performance under both low- and high-frequency ripple conditions.
• Controlled leakage: Leakage current limited to 3 µA supports predictable bias behavior in power rails and filtering applications.
• Wide operating temperature: Rated from −55 °C to 105 °C for use across a broad range of ambient conditions.
• Automotive-ready qualification: AEC‑Q200 rating and 2000-hour endurance at 105 °C support deployment in regulated automotive systems.
• Production-friendly packaging: Embossed carrier taping enables reliable pick-and-place integration in automated manufacturing lines.

Why Choose UCD1A270MCL1GS?

The UCD1A270MCL1GS positions itself as a compact, low-impedance aluminum electrolytic solution for demanding surface-mount designs. Its combination of 27 µF capacitance at 10 V, defined ripple ratings, low leakage and AEC‑Q200 qualification makes it a practical choice for engineers specifying reliable SMD capacitance in space-limited assemblies.

This part is suited to teams and designs that require predictable endurance at elevated temperature (2000 hours at 105 °C), automated assembly compatibility, and RoHS-compliant materials—providing long-term robustness and straightforward integration into production workflows.

If you would like pricing, availability or to request a quote for UCD1A270MCL1GS, please contact our sales team or submit a request and include part number UCD1A270MCL1GS and your quantity and delivery requirements.