UCD1A331MNL1GS

The UCD1A331MNL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor in a surface‑mount can package, optimized for high‑density PCB assembly and automated placement. With a 330 µF capacitance at 10 V, AEC‑Q200 qualification, and a -55 °C to 105 °C operating range, it addresses demanding environments where temperature endurance and ripple handling are required.

Key Features

• Electrical Performance — 330 µF capacitance at 10 V with a capacitance tolerance of -20% to +20% and a measured tanδ (DF) of 0.19 (20 °C, 120 Hz).
• Ripple Current Capacity — Low‑frequency ripple current of 300 mA (120 Hz) and high‑frequency ripple current of 600 mA (10 kHz), enabling effective ripple handling across switching and line‑frequency conditions.
• Reliability & Endurance — Rated for 5,000 hours at 105 °C with specified limits: capacitance change within ±30% of initial value, tanδ ≤ 200% of initial, and leakage current not exceeding initial specification after endurance testing.
• Temperature Range — Wide operating temperature from -55 °C to 105 °C for extended environmental tolerance.
• Automotive Qualification — AEC‑Q200 rating for use in applications requiring that qualification.
• Assembly & Footprint — Surface‑mount, chip‑type can (φ8 × 10L size) designed for high‑density PCBs and compatible with embossed carrier taping and automatic mounting machines.
• Leakage Current — Specified leakage current of 33 µA, supporting predictable bias behavior in power circuits.
• RoHS Compliant — Meets RoHS directive requirements for material compliance.

Typical Applications

• Automotive Electronics — AEC‑Q200 qualification and 105 °C endurance make this part suited for automotive modules that require surface‑mount decoupling and energy buffering under elevated temperature conditions.
• High‑Density PCB Power Filtering — Chip‑type can and compact φ8 × 10L footprint are designed for surface mounting on high‑density boards where board space and reliable power decoupling are critical.
• Switch‑Mode Power Supplies / DC‑DC Converters — Combined low impedance and specified ripple current at both low and high frequencies support smoothing and ripple management in switching power stages.
• Automated Assembly Lines — Supplied in embossed carrier taping for compatibility with automated pick‑and‑place equipment and high‑volume production workflows.

Unique Advantages

• Compact, high‑capacitance SMD package: 330 µF in a φ8 × 10L chip can minimizes board area while providing bulk capacitance for tight power budgets.
• Measured low loss at 10 V: tanδ of 0.19 (20 °C, 120 Hz) provides predictable AC loss behavior for power and decoupling designs.
• Dual-frequency ripple rating: Specified ripple currents at 120 Hz and 10 kHz let designers size capacitors for both line‑frequency and switching‑frequency stress.
• Long high‑temperature life: 5,000 hours at 105 °C supports durability in elevated ambient or internal‑heat applications.
• AEC‑Q200 qualified and RoHS compliant: Simplifies qualification paths for regulated markets while meeting material‑compliance requirements.
• Assembly‑friendly packaging: Embossed carrier tape format supports automated placement for efficient manufacturing.

Why Choose UCD1A331MNL1GS?

The UCD1A331MNL1GS delivers a balance of bulk capacitance, low impedance, and thermal endurance in a compact surface‑mount aluminum can. Its AEC‑Q200 qualification, RoHS compliance, and 5,000‑hour life at 105 °C make it a strong candidate for designs that demand reliable power filtering and ripple management in thermally challenging environments.

This part is ideal for engineers specifying compact SMD bulk capacitors on high‑density PCBs and for production environments relying on automated assembly. The clearly defined electrical and endurance specifications support predictable performance over long operating periods and streamline component selection for robust system designs.

Request a quote or submit an RFQ to receive pricing and availability information for the UCD1A331MNL1GS. Our sales team can provide lead‑time details and support for volume requirements.