UCD1A330MCL1GS

The UCD1A330MCL1GS is a chip-type aluminum electrolytic capacitor in a surface-mount can package from the UCD series. It delivers a 33 μF capacitance at a 10 V rating with low impedance characteristics, optimized for automated assembly on high-density PC boards.

Designed and qualified for demanding environments, this part targets automotive and industrial electronics that require a compact, robust SMD capacitor with a wide operating temperature range and AEC-Q200 qualification.

Key Features

• Capacitance & Voltage 
  33 μF nominal capacitance with a rated voltage of 10 V and a tolerance of -20% to +20%.
• Low Impedance Construction 
  Specified impedance of 700 mΩ and a tangent of loss angle (tan δ) of 0.19 (measured at 20°C, 120 Hz) for stable AC performance.
• Ripple Current Capability 
  Low-frequency ripple current 80 mA (120 Hz) and high-frequency ripple current 160 mA (10 kHz) to support power conditioning and decoupling tasks.
• Leakage Current 
  Low leakage current of 3.3 μA measured after rated voltage application, enabling reliable performance in bias-sensitive circuits.
• Temperature & Endurance 
  Operating temperature range from -55°C to +105°C with a rated endurance of 2000 hours at 105°C.
• Surface-Mount, Tape Packaging 
  Chip-type radial can in an SMD package (φ5 × 5.8 mm) supplied on embossed carrier taping suitable for automatic pick-and-place.
• Reliability & Compliance 
  AEC-Q200 qualified and RoHS compliant for regulated and automotive applications.
• Board Land & Package 
  Compact footprint with size dimensions L: 5.8 × D: 5 mm and recommended surface mount land size L: 5.3 × W: 5.3 mm.

Typical Applications

• Automotive Electronics 
  Use in automotive modules where AEC-Q200 qualification and a wide temperature range are required.
• High‑density PCB Power Rails 
  Surface-mount chip package and low impedance suit decoupling and local smoothing on tightly packed boards.
• Embedded and Industrial Electronics 
  Compact size and high ripple capability support power conditioning in compact embedded and industrial systems.

Unique Advantages

• Compact SMD Can Package 
  Small φ5 × 5.8 mm footprint lets designers save board area while retaining electrolytic capacitance.
• Automated Assembly Ready 
  Embossed carrier taping supports high-throughput surface-mount assembly processes.
• Wide Temperature Operation 
  -55°C to +105°C rating and 2000 h endurance at 105°C provide predictable behavior in temperature-stressed environments.
• Measurable Low Loss 
  tan δ = 0.19 at 20°C, 120 Hz and specified impedance of 700 mΩ contribute to stable AC performance and predictable heat generation.
• AEC-Q200 Qualification 
  Qualification for automotive-grade applications supports use in systems requiring industry-recognized reliability screening.
• Low Leakage Current 
  3.3 μA leakage current supports circuits sensitive to standby bias and minimizes parasitic drain.

Why Choose UCD1A330MCL1GS?

The UCD1A330MCL1GS combines a compact chip-type can package with low-impedance electrical characteristics and automotive-grade qualification. Its balance of capacitance, ripple handling, low leakage, and endurance at elevated temperature makes it well suited for designers specifying robust, space-efficient electrolytic decoupling in automotive and industrial systems.

Choose this part when you need a surface-mount aluminum electrolytic capacitor that integrates easily into automated production, meets AEC-Q200 expectations, and provides verifiable electrical parameters for reliable power conditioning across a wide temperature range.

If you would like a quote or have questions about availability and volume pricing for UCD1A330MCL1GS, please submit a request and our team will respond with the information you need.