UCD1C220MCL1GS

The UCD1C220MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mounting on high‑density PCBs. It delivers 22 µF capacitance at a 16 V rating in a compact φ5 × 5.8 mm radial can SMD package.

Designed for automated assembly (embossed carrier taping) and qualified to AEC‑Q200, this part targets robust electronic designs that require compact decoupling and smoothing solutions across a wide temperature range.

Key Features

• Capacitance & Voltage — 22 µF nominal capacitance with a rated voltage of 16 V and capacitance tolerance of −20% to +20%.
• Low‑Impedance Chip Type — Chip‑type construction with an impedance of 700 mΩ and tanδ of 0.16 (measured at 20°C, 120 Hz) for stable performance in power applications.
• Ripple Current Performance — Low‑frequency ripple current of 80 mA at 120 Hz and high‑frequency ripple current of 160 mA at 10 kHz to support transient and switching environments.
• Leakage Current — Specified leakage current of 3.52 µA for predictable standby and low‑loss behavior.
• Thermal & Endurance — Wide operating temperature range from −55°C to +105°C with an endurance rating of 2000 hours at 105°C.
• Surface Mount Package — Radial can SMD package (φ5 × 5.8 mm) with recommended land size 5.3 × 5.3 mm; supplied in embossed carrier taping for automated placement.
• Qualification & Compliance — AEC‑Q200 qualified and RoHS compliant, supporting regulated and reliability‑focused applications.

Typical Applications

• Automotive electronic modules — AEC‑Q200 qualification and −55°C to +105°C rating make this capacitor suitable for temperature‑stressed automotive assemblies.
• Compact power filtering — 22 µF in a φ5 × 5.8 mm SMD package provides localized decoupling and smoothing where PCB space is limited.
• High‑density PCB assemblies — Chip‑type construction and embossed carrier taping facilitate automated placement in dense board layouts.
• Thermally demanding designs — Endurance of 2000 hours at 105°C supports applications that must withstand elevated operating temperatures.

Unique Advantages

• AEC‑Q200 qualification: Built to meet automotive reliability expectations for use in regulated vehicle electronics and other demanding systems.
• Low impedance and controlled loss: 700 mΩ impedance and tanδ 0.16 (120 Hz, 20°C) help reduce voltage ripple and heat generation in power rails.
• Compact SMD radial can: φ5 × 5.8 mm package delivers 22 µF in a small footprint to free board space for other components.
• Robust thermal endurance: Rated for −55°C to +105°C and 2000 hours at 105°C, supporting long‑life operation in hot environments.
• Assembly‑friendly packaging: Supplied on embossed carrier tape for compatibility with automated pick‑and‑place processes and high‑volume production.
• Predictable leakage and ripple handling: Low leakage current (3.52 µA) and specified ripple currents (80 mA @120 Hz, 160 mA @10 kHz) enable reliable power management design margins.

Why Choose UCD1C220MCL1GS?

UCD1C220MCL1GS combines chip‑type low‑impedance performance with a compact SMD radial can and automotive‑grade qualification, making it a practical choice for engineers designing space‑constrained, thermally challenging, or reliability‑critical electronic systems. Its specification set—22 µF at 16 V, controlled loss tangent, defined ripple capabilities, and embossed carrier tape packaging—supports high‑density manufacturing and predictable in‑system behavior.

This part is well suited for designers and procurement teams targeting long‑life deployments where thermal endurance, automated assembly, and compliance with AEC‑Q200 and RoHS are required. Its measurable electrical characteristics simplify component selection and system qualification efforts.

Request a quote or contact sales to discuss availability, lead times, and volume pricing for UCD1C220MCL1GS.