UCD1C221MCL1GS

The UCD1C221MCL1GS is a surface-mount, chip-type aluminum electrolytic capacitor engineered for low impedance performance in compact SMD assemblies. With 220 µF capacitance at a 16 V rating and AEC-Q200 qualification, it targets applications that require reliable, high-density board mounting and controlled ripple handling in demanding temperature environments.

Key Features

• Capacitance & Voltage: 220 µF nominal capacitance with a 16 V rated voltage and a capacitance tolerance of ±20% (−20% to 20%).
• Low Loss / Low Impedance: Tangent of loss angle (tan δ) of 0.16 measured at 20°C, 120 Hz, providing defined dissipation characteristics for AC conditions.
• Ripple Current Capability: Specified ripple performance of 145 mA at 120 Hz (low frequency) and 290 mA at 10 kHz (high frequency), enabling effective smoothing and decoupling in relevant frequency ranges.
• Leakage Current: Low leakage current rated at 35.2 µA under standard test conditions.
• Temperature & Endurance: Operates across −55°C to 105°C with an endurance rating of 2000 hours at 105°C.
• Package & Mounting: Chip-type radial can designed for surface mount use (φ6.3 × 7.7 mm). Surface-mount land size: 6.6 × 6.6 mm.
• Assembly Ready: Supplied in embossed carrier taping compatible with automatic mounting machines for high-density PCB assembly.
• Compliance & Qualification: RoHS compliant and AEC-Q200 qualified as specified in the product data.
• Polarized Device: Polarized aluminum electrolytic construction for DC applications requiring polarity-aware capacitors.

Typical Applications

• Automotive electronics: Intended for use in automotive systems as indicated by the product application listing and AEC-Q200 qualification.
• High-density SMD assemblies: Designed for surface mounting on high-density PC boards where chip-type SMD packaging is required.
• Automated production environments: Supplied in embossed carrier tape for compatibility with automatic mounting machines and high-volume PCB assembly.

Unique Advantages

• Compact SMD form factor: φ6.3 × 7.7 mm chip package and specified surface-mount land size simplify integration into space-constrained board layouts.
• Defined ripple performance: Rated ripple currents at both 120 Hz and 10 kHz provide clear, verifiable limits for filtering and decoupling design targets.
• High-temperature endurance: Specified operation to 105°C and a 2000-hour endurance rating at 105°C support designs that require sustained performance at elevated temperatures.
• Qualification and compliance: AEC-Q200 qualification and RoHS compliance support regulated production and procurement requirements.
• Assembly-friendly packaging: Embossed carrier taping enables automated placement and consistent throughput in SMT production lines.
• Low leakage and controlled loss: Low leakage current and a specified tan δ give predictable behavior for DC bias and AC loss budgeting.

Why Choose UCD1C221MCL1GS?

UCD1C221MCL1GS combines a compact chip-style SMD package with clear electrical and thermal specifications—220 µF at 16 V, low tan δ, defined ripple currents, and an operating range of −55°C to 105°C—making it suited to boards requiring reliable electrolytic capacitance in tight spaces. Its embossed carrier tape packaging and surface-mount design support automated assembly, while AEC-Q200 qualification and RoHS compliance address industry and regulatory needs.

This part is appropriate for engineers and buyers seeking a verified, production-ready aluminum electrolytic SMD capacitor for applications that demand predictable ripple handling, temperature endurance, and compatibility with high-density PCB manufacturing.

If you would like pricing, availability, or a formal quote for UCD1C221MCL1GS, please request a quote or contact sales for further assistance.