UCD1C221MCS1GS

The UCD1C221MCS1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface‑mount applications. It delivers 220 µF at 16 V in a compact SMD can (φ6.3 × 7.7 mm) and is intended for high‑density PC boards and automated assembly.

Built for demanding temperature and endurance conditions, this part supports an operating range of −55 °C to +105 °C, carries AEC‑Q200 qualification, and is supplied on embossed carrier tape for pick‑and‑place compatibility.

Key Features

• Capacitance & Voltage — 220 µF nominal capacitance at a rated voltage of 16 V with a tolerance of −20% to +20%.
• Low‑impedance Performance — Specified tangent of loss angle (tan δ) of 0.16 measured at 20 °C, 120 Hz, and designated low impedance construction suitable for smoothing and ripple management.
• Ripple Current Ratings — Low‑frequency ripple current 145 mA (120 Hz) and high‑frequency ripple current 290 mA (10 kHz), enabling handling of AC ripple across a broad frequency range.
• Leakage Current — Leakage current specified at 35.2 µA, supporting stable long‑term performance under rated voltage conditions.
• Thermal & Endurance — Operating temperature range −55 °C to +105 °C with endurance specified as 2000 hours at 105 °C.
• Package & Mounting — Chip type radial can in SMD package (φ6.3 × 7.7 mm); surface‑mount land size 6.6 × 6.6 mm; packaged in embossed carrier tape for automated placement.
• Reliability & Qualifications — AEC‑Q200 rated and RoHS compliant; the series specification includes recovery after soldering heat and shelf‑life endurance tests.
• Vibration Resistance — Vibration‑resistant construction for improved mechanical robustness during operation and assembly.

Typical Applications

• Automotive Electronics — AEC‑Q200 qualification and −55 °C to +105 °C operating range make this capacitor suitable for automotive electronic modules.
• High‑Density PCB Designs — Chip type SMD can and embossed carrier tape packaging support automated placement on compact, high‑density boards.
• Power Supply Filtering — Low impedance and specified ripple current ratings at 120 Hz and 10 kHz provide reliable smoothing and ripple handling in power modules.

Unique Advantages

• Compact, space‑saving form factor: 220 µF in a φ6.3 × 7.7 mm SMD can reduces board area compared with larger radial capacitors.
• Designed for automated assembly: Embossed carrier tape packaging enables straightforward integration into pick‑and‑place production lines.
• Temperature and endurance capability: Rated for −55 °C to +105 °C and 2000 hours at 105 °C, supporting long‑term operation in elevated temperature environments.
• Automotive readiness: AEC‑Q200 rating supports use in automotive electronic applications requiring industry qualification.
• Measured performance metrics: Specified tan δ, ripple currents, and leakage current values give clear, verifiable parameters for design validation.
• RoHS compliant: Meets environmental requirements for lead‑free designs.

Why Choose UCD1C221MCS1GS?

The UCD1C221MCS1GS combines low‑impedance performance, compact SMD packaging, and automotive‑grade qualification to meet the needs of designers building robust, space‑constrained power systems. Its specified ripple handling, leakage, and endurance characteristics make it a practical choice where thermal endurance and automated assembly are priorities.

This capacitor is well suited to engineers specifying components for automotive modules, high‑density power supplies, and other applications that require verifiable electrical performance and mechanical robustness over extended operating temperatures.

If you would like pricing, lead‑time information, or assistance integrating UCD1C221MCS1GS into your design, request a quote or contact sales to discuss availability and sample options.