UCD1C331MNL1GS

The UCD1C331MNL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount assembly on high-density PC boards. With a nominal capacitance of 330 µF at 16 V, AEC-Q200 qualification, and RoHS compliance, it targets automotive and other demanding electronics that require compact SMD power components.

Engineered for automated placement (embossed carrier taping) and continuous operation up to 105°C, this part balances capacitance, ripple capability, and long-term endurance for reliable SMD power decoupling and filtering in compact designs.

Key Features

• Capacitance & Voltage: 330 µF rated capacitance at 16 V for bulk energy storage in compact SMD form.
• Low-Impedance Chip Type: Designed as a chip-type, low-impedance aluminum electrolytic capacitor optimized for surface-mount use.
• Ripple Current Performance: Rated low-frequency ripple current 300 mA (120 Hz) and high-frequency ripple current 600 mA (100 kHz), supporting a range of switching and DC conditions.
• Thermal & Endurance: Operates from -55°C to 105°C with endurance specified as 5000 hours at 105°C for the applicable size class.
• Leakage & Dissipation: Leakage current specified at 52.8 µA and tan δ (DF) of 0.16 measured at 20°C, 120 Hz, supporting predictable loss characteristics.
• Package & Mounting: Surface-mount radial can (φ8 × 10 mm), supplied in embossed carrier taping for automated assembly; surface mount land size 8.3 × 8.3 mm.
• Qualification & Compliance: AEC-Q200 rated and RoHS compliant for regulated environments and automotive-focused applications.

Typical Applications

• Automotive Electronics: Suitable for automotive electronic modules where AEC-Q200 qualification is required and compact SMD capacitors are needed.
• High-Density SMD PCBs: Designed for surface mounting on high-density boards and compatible with automated placement from carrier tape.
• SMD Power Modules: Used in compact power modules and power conditioning circuits that require 330 µF capacitance and moderate ripple handling at both low and high frequencies.

Unique Advantages

• Compact high-capacitance SMD: 330 µF in a φ8 × 10 mm chip-type package enables higher capacitance in limited board area.
• Defined ripple performance: Separate low- and high-frequency ripple ratings (300 mA @120 Hz, 600 mA @100 kHz) provide predictable behavior across switching conditions.
• Long elevated-temperature life: 5000 hours endurance at 105°C for the applicable size class supports long-term reliability in high-temperature environments.
• Automated assembly ready: Embossed carrier taping format and SMD radial can package facilitate high-volume automated placement.
• Qualification and compliance: AEC-Q200 rating and RoHS compliance address regulated market requirements and material restrictions.
• Stable electrical characteristics: Specified tan δ (0.16 at 20°C, 120 Hz) and low leakage current (52.8 µA) help maintain predictable performance in designs.

Why Choose UCD1C331MNL1GS?

The UCD1C331MNL1GS combines a high-value 330 µF capacitance with low-impedance, compact SMD packaging and defined ripple and endurance specifications. Its AEC-Q200 rating and RoHS compliance make it appropriate for regulated, higher-reliability applications that require automated assembly and operation up to 105°C.

This part is well suited for engineers specifying compact, durable SMD electrolytic solutions where capacitance density, controlled loss characteristics, and established ripple/endurance ratings are required to meet application-level reliability targets.

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