UCD1C470MCL6GS

The UCD1C470MCL6GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount assembly on high-density PCBs. With a rated capacitance of 47 µF and a 16 V rating, it is optimized for applications that require compact bulk capacitance with reliable ripple handling and extended temperature capability.

Qualified to AEC-Q200 and supplied in embossed carrier taping for automated placement, this Nichicon UCD series part targets demanding embedded and automotive electronics that require RoHS-compliant, production-ready SMD capacitors with a wide operating temperature range.

Key Features

• Capacitance and Voltage: 47 µF nominal capacitance with a rated voltage of 16 V and capacitance tolerance of ±20% (120 Hz, 20°C).
• Low Impedance Performance: Characteristic low impedance with an impedance value of 700 mΩ and a tan δ (DF) of 0.16 measured at 20°C, 120 Hz, supporting efficient AC performance in compact designs.
• Ripple Current Capability: Rated for 80 mA at 120 Hz (low frequency) and 160 mA at 10 kHz (high frequency), enabling effective ripple management on DC rails and switching nodes.
• Leakage Current: Low leakage current of 7.52 µA, suitable for energy-constrained and precision circuits.
• Temperature and Endurance: Operates across −55°C to +105°C with an endurance rating of 2000 hours at 105°C.
• Compact SMD Package: Chip-type radial can SMD package, size φ5 × 5.8 mm (length 5.8 mm, diameter 5 mm) and surface-mount land size 5.3 × 5.3 mm, supplied in embossed carrier tape for automated placement.
• Reliability and Compliance: AEC-Q200 qualified and RoHS compliant; production status: mass production.

Typical Applications

• Automotive electronics — AEC-Q200 qualification and a 16 V rating make this capacitor suitable for automotive control modules where compact, low-impedance bulk capacitance is required.
• High-density PCB designs — Chip-type SMD construction and embossed carrier taping support automated assembly on densely populated boards.
• Power filtering and decoupling — Low impedance, defined ripple current ratings, and low leakage current make it appropriate for smoothing and decoupling on local DC rails.

Unique Advantages

• Compact bulk capacitance: 47 µF in a φ5 × 5.8 mm SMD package delivers significant capacitance in a small footprint for space-constrained designs.
• Measurable low-impedance behavior: 700 mΩ impedance and a tan δ of 0.16 (120 Hz, 20°C) provide quantifiable AC performance for design validation.
• Engineered for ripple handling: Specified ripple currents at both low and high frequencies (80 mA @120 Hz, 160 mA @10 kHz) clarify performance in switching and linear supply environments.
• Wide operating range and endurance: −55°C to +105°C rating with 2000 hours endurance at 105°C supports long-term reliability in elevated-temperature applications.
• Automotive-grade qualification: AEC-Q200 rating offers a clear path for vehicle electronics and other demanding embedded systems.
• Production-ready packaging: Embossed carrier taping enables efficient automated placement and high-volume manufacturing.

Why Choose UCD1C470MCL6GS?

The UCD1C470MCL6GS combines compact SMD packaging with proven electrolytic performance—delivering 47 µF at 16 V with low impedance, defined ripple ratings, and low leakage current. Its wide temperature range and endurance at 105°C, together with AEC-Q200 qualification and RoHS compliance, make it well suited for engineers designing robust embedded and automotive systems that require reliable bulk capacitance in tight spaces.

As a mass-production Nichicon part in the UCD series, it offers predictable supply and form-factor compatibility for automated assembly workflows, helping accelerate time-to-production for both high-density consumer and vehicle electronics projects.

If you would like pricing or availability for UCD1C470MCL6GS, request a quote or submit your project requirements and a sales specialist will respond with options tailored to your production needs.