UCD1C331MNS1GS
| Part Description |
330 µF 16 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,479 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 330 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 1.1 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 5000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 600 mA @ 10 kHz | Ripple Current Low Frequency | 300 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 10 x 8 mm | Surface Mount Land Size | 8.3 x 8.3 mm | ||
| Tolerance | -20%~20% | Voltage | 16 V |
Overview of UCD1C331MNS1GS – Aluminum Electrolytic Chip Capacitor, 330 µF, 16 V
The UCD1C331MNS1GS is a chip type aluminum electrolytic capacitor engineered for surface-mount assembly. It delivers 330 µF capacitance at 16 V in a compact φ8 × 10 mm SMD can, optimized for high‑density PCBs and automatic placement from embossed carrier tape.
Designed for robust operation up to 105°C and AEC‑Q200 qualification, this low‑impedance capacitor addresses demanding environments that require extended endurance, vibration resistance and reliable ripple handling.
Key Features
- Electrical Performance 330 µF capacitance at 16 V with capacitance tolerance of −20% to +20%; tangent of loss angle (tanδ) 0.16 measured at 20°C, 120 Hz.
- Ripple Current Capability Rated low-frequency ripple current 300 mA (120 Hz) and high-frequency ripple current 600 mA (10 kHz) to support transient and switching loads.
- Leakage Current Leakage current specified at 52.8 µA, measured after rated voltage application conditions.
- High-Temperature Endurance Life rating of 5000 hours at 105°C under rated voltage, providing predictable long-term performance at elevated temperatures.
- Reliability & Qualification AEC‑Q200 rating and RoHS compliance indicate suitability for regulated and reliability-sensitive designs.
- Compact SMD Package Chip-type radial can SMD in φ8 × 10L size (L: 1.0 cm, D: 0.8 cm) with surface-mount land recommendation of 8.3 × 8.3 mm; supplied in embossed carrier taping for automatic mounting.
- Mechanical Robustness Vibration resistant construction suitable for assemblies subject to mechanical stress.
Typical Applications
- Automotive electronic systems — Matches AEC‑Q200 qualification, 16 V rating and 105°C endurance for use in vehicle electronics where regulated qualification and long life are required.
- SMD high-density assemblies — Chip-type radial can and embossed carrier taping support automatic placement on compact, densely populated PCBs.
- Power module and converter boards — 330 µF capacitance combined with rated ripple currents supports energy storage and ripple management in compact power circuits.
Unique Advantages
- Low-impedance performance: Tangent of loss angle of 0.16 (16 V, 120 Hz, 20°C) and specified ripple currents deliver effective impedance control for transient and switching environments.
- Long endurance at elevated temperature: Rated for 5000 hours at 105°C under rated voltage, enabling reliable operation in high-temperature applications.
- AEC‑Q200 qualified and RoHS compliant: Provides qualification and environmental compliance required for regulated and rugged designs.
- Automatic-assembly ready: Embossed carrier taping and surface-mount can style simplify PCB assembly and reduce manual handling.
- Vibration resistant: Mechanical design supports use in environments with mechanical stress or vibration.
- Compact footprint: φ8 × 10 mm chip package fits space-constrained boards while providing 330 µF of capacitance at 16 V.
Why Choose UCD1C331MNS1GS?
UCD1C331MNS1GS combines a compact chip‑type aluminum electrolytic design with low impedance characteristics, rated ripple currents, and long endurance at 105°C. Its AEC‑Q200 qualification, vibration resistance and embossed carrier taping make it a practical choice for reliable, high‑density assemblies.
This part is suited to engineers designing electronics that require a balance of capacitance, thermal endurance and automated assembly compatibility—particularly where regulated qualification and predictable long-term behavior are priorities.
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Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016