UCD1C470MCL1GS

CAP ALUM 47UF ±20% 16V SMD
Part Description

47 µF 16 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 562 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUCD
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance47 µFECCNEAR99
ESRN/AHeight Seated (Max)6.8 mmHTS Code8532.22.0020
Impedance360 mOhmLead SpacingN/ALifetime @ Temp2000 h @ 105°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 105°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency240 mA @ 10 kHzRipple Current Low Frequency120 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension5.8 x 6.3 mmSurface Mount Land Size6.6 x 6.6 mm
Tolerance-20%~20%Voltage16 V

Overview of UCD1C470MCL1GS – Chip, Low‑Impedance SMD Aluminum Electrolytic Capacitor, 47 µF 16 V

The UCD1C470MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface‑mount use. It delivers 47 µF capacitance at a 16 V rating in a compact φ6.3 × 5.8 mm can, optimized for high‑density PCBs and automated assembly.

Engineered for reliability in demanding environments, this part is AEC‑Q200 qualified, RoHS compliant and rated for operation from −55 °C to +105 °C with an endurance specification of 2000 hours at 105 °C.

Key Features

  • Electrical Performance — 47 µF capacitance at 16 V with a tolerance of −20% to +20% and a measured tan δ (DF) of 0.16 at 20 °C, 120 Hz for predictable AC loss characteristics.
  • Low Impedance — Specified impedance 360 mΩ, supporting stable decoupling and bulk capacitance in compact power stages.
  • Ripple Handling — Low‑frequency ripple current 120 mA (120 Hz) and high‑frequency ripple current 240 mA (10 kHz) to address a range of switching and filtering demands.
  • Leakage and Reliability — Low leakage current of 7.52 µA after application of rated voltage (measurement conditions per part data) and endurance rated at 2000 hours at 105 °C.
  • Package & Mounting — Chip‑type surface mount can (φ6.3 × 5.8 mm) designed for automatic placement and supplied in embossed carrier taping for throughput‑friendly SMT assembly.
  • Environmental & Qualification — RoHS compliant and AEC‑Q200 qualified for electronic systems requiring documented component qualification.

Typical Applications

  • Automotive electronics — Suitable for electronic control modules and other in‑vehicle systems where AEC‑Q200 qualification and wide temperature operation are required.
  • High‑density PCB power decoupling — Chip‑type SMD form factor and low impedance make it appropriate for tight board layouts that require compact bulk capacitance.
  • Automated assembly lines — Supplied in embossed carrier tape and compatible with automatic mounting equipment to support high‑volume production workflows.

Unique Advantages

  • AEC‑Q200 Qualification: Provides documented component qualification suitable for automotive and other demanding applications.
  • Wide Temperature Range: Operates from −55 °C to +105 °C, supporting designs exposed to broad environmental conditions.
  • Compact, Assembly‑Friendly Package: φ6.3 × 5.8 mm chip can in embossed carrier taping simplifies placement on high‑density PCBs and automated lines.
  • Low Impedance and Controlled Loss: 360 mΩ impedance and tan δ 0.16 (20 °C, 120 Hz) help maintain power integrity in compact power circuits.
  • Rated Endurance: 2000 hours at 105 °C provides a defined lifecycle metric for thermal endurance planning.
  • Regulatory Compliance: RoHS compliant for use in regions and products that require restricted‑substance conformity.

Why Choose UCD1C470MCL1GS?

UCD1C470MCL1GS combines low impedance, compact SMD packaging and documented AEC‑Q200 qualification to meet the needs of high‑density, reliability‑focused electronic designs. Its temperature range and endurance rating provide designers with verifiable performance across demanding operating conditions.

This capacitor is well suited to engineers specifying dependable bulk and decoupling capacitance for automotive modules, compact power supplies and other assemblies where automated production and component qualification matter. Its embossed carrier taping and chip form factor help streamline placement and reduce BOM complexity in space‑constrained layouts.

Request a quote or submit an inquiry for pricing and availability to evaluate UCD1C470MCL1GS for your next design.

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    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


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