UCD1C220MCL6GS

The UCD1C220MCL6GS from Nichicon is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount applications. It provides 22 µF nominal capacitance at a 16 V rating in a compact φ4 × 5.8 mm SMD can, and is supplied in embossed carrier taping for automated placement.

Engineered for reliability across a wide temperature range and qualified to AEC‑Q200, the UCD series component targets applications that require stable decoupling and bulk capacitance with controlled losses and defined ripple performance.

Key Features

• Capacitance and Voltage — 22 µF nominal capacitance with a 16 V rated voltage and tolerance of -20% to +20%.
• Low Impedance — Specified impedance of 1.35 Ω, optimized for reduced voltage ripple in power rails.
• Loss Characteristics — tanδ (DF) = 0.16 measured at 20 °C, 120 Hz, providing predictable AC loss behavior.
• Ripple Current Ratings — Low-frequency ripple current 45 mA at 120 Hz and high-frequency ripple current 90 mA at 10 kHz for mixed-frequency power applications.
• Leakage Current — Typical leakage current noted as 3.52 µA (datasheet reference condition: after rated voltage application).
• Endurance — Life rating of 2000 hours at 105 °C with specified post-test limits for capacitance change, tanδ, and leakage.
• Temperature Range — Operating from -55 °C to +105 °C to support wide environmental conditions.
• Compact SMD Package — Case size φ4 × 5.8 mm with recommended land pattern 4.3 × 4.3 mm, polarized SMD can for high-density PCB layouts.
• Manufacturing and Compliance — Supplied in embossed carrier taping for automatic mounting; RoHS compliant and AEC‑Q200 qualified.

Typical Applications

• Automotive electronics — AEC‑Q200 qualification and -55 °C to 105 °C temperature range make it suitable for automotive modules requiring SMD bulk or decoupling capacitance.
• Power supply decoupling — Low impedance (1.35 Ω), defined tanδ, and ripple current ratings provide reliable smoothing for local power rails and converters.
• Compact, high-density PCBs — Small φ4 × 5.8 mm SMD package and embossed carrier taping enable automated placement in space-constrained designs.

Unique Advantages

• AEC‑Q200 qualified — Enables use in designs that require industry-recognized stress qualification for electronic components.
• Measured performance data — Explicit impedance, tanδ, leakage, and ripple current specifications allow predictable selection and margining in power subsystems.
• Wide operating temperature and endurance — -55 °C to 105 °C range and 2000 hours at 105 °C endurance support long-term stability in thermally demanding environments.
• SMD-ready packaging — Embossed carrier taping and a compact can footprint streamline automated assembly and reduce BOM complexity for surface-mount designs.
• RoHS compliant — Meets regulatory material requirements for restricted substances.

Why Choose UCD1C220MCL6GS?

The UCD1C220MCL6GS delivers a focused combination of compact SMD form factor, defined low-impedance performance, and endurance for applications that need stable 22 µF bulk or decoupling capacitance at 16 V. Its measured electrical characteristics and AEC‑Q200 qualification make it a practical choice where predictable ripple handling and thermal stability are required.

This part is well suited for engineers and procurement teams specifying surface-mount capacitors for dense PCBs, automotive-grade modules, and other designs that require automated assembly, RoHS compliance, and documented performance under defined test conditions.

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