UCD1V221MNS1GS

The UCD1V221MNS1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount assembly. It delivers 220 µF capacitance at a 35 V rating with a compact φ8 × 10 mm SMD can and is supplied on embossed carrier tape for automatic placement.

Engineered for demanding temperature and vibration environments, this part targets high-density board designs and applications that require defined ripple-current handling, extended high-temperature endurance, and AEC-Q200 qualification for automotive use.

Key Features

• Capacitance & tolerance: 220 µF with tolerance of −20% to +20% at 120 Hz, 20 °C.
• Rated voltage: 35 V working voltage suitable for mid-voltage power rails.
• Low-impedance chip construction: Chip-type SMD design with tanδ (DF) = 0.12 measured at 20 °C, 120 Hz for defined loss characteristics.
• Ripple current capability: 300 mA at 120 Hz (low frequency) and 600 mA at 10 kHz (high frequency) to support dynamic power demands.
• Leakage current: Specified leakage current of 77 µA.
• Thermal endurance: Rated operating range −55 °C to 105 °C with a lifetime/endurance of 5000 hours at 105 °C.
• Packaging & assembly: Surface-mount radial can (φ8 × 10 L) with embossed carrier taping and surface-mount land size 8.3 × 8.3 mm for automated placement.
• Reliability & compliance: AEC-Q200 rating and RoHS compliant; vibration resistant construction.
• Polarized device: Intended for applications requiring polarized aluminum electrolytic capacitors.

Typical Applications

• Automotive electronics: AEC-Q200 qualification and 5000-hour endurance at 105 °C make this capacitor suitable for automotive electronic modules requiring specified high-temperature performance.
• High-density surface-mount PCBs: Chip-type SMD form factor and embossed carrier taping enable placement on compact, automated assembly lines and dense board layouts.
• Power circuits with defined ripple requirements: Specified ripple current ratings (300 mA at 120 Hz, 600 mA at 10 kHz) support designs with known low- and high-frequency ripple loads.
• Vibration-prone environments: Vibration resistant construction for use where mechanical robustness is required.

Unique Advantages

• Compact low-impedance SMD package: Chip-type aluminum can in a φ8 × 10 mm footprint balances capacitance with space-saving surface-mount compatibility.
• Measured loss characteristics: tanδ = 0.12 at 20 °C, 120 Hz provides a quantifiable measure of dissipation for design validation.
• Defined ripple handling: Separate low- and high-frequency ripple current ratings give designers clear limits for both 120 Hz and 10 kHz operating conditions.
• High-temperature endurance: Rated for 5000 hours at 105 °C, supporting long-term operation in elevated-temperature assemblies.
• AEC-Q200 qualification and RoHS compliance: Adds a level of assurance for automotive development and regulatory environmental requirements.
• Assembly-ready packaging: Embossed carrier taping streamlines automated pick-and-place workflows.

Why Choose UCD1V221MNS1GS?

The UCD1V221MNS1GS combines low-impedance chip construction, clearly specified loss and ripple-current characteristics, and a compact SMD can to meet the needs of high-density, high-reliability designs. Its AEC-Q200 qualification, RoHS compliance, and 5000-hour endurance at 105 °C position it for applications that demand predictable electrical performance under thermal and mechanical stress.

This part is well suited for engineers designing automotive modules, compact power circuits, and vibration-prone assemblies where a documented combination of capacitance, voltage rating, ripple capability, and long-term thermal endurance are required.

Request a quote or submit a pricing and availability inquiry to receive lead-time and ordering information for UCD1V221MNS1GS.