UCD1V330MCL1GS

The UCD1V330MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It delivers 33 µF at a 35 V rating in a compact SMD radial-can package and is RoHS compliant.

Engineered for robust thermal range and qualification, this part supports operation from -55 °C to +105 °C, carries AEC-Q200 qualification, and is compatible with automated mounting using carrier tape for high-volume assembly environments.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance with a 35 V rated voltage, suitable for mid-voltage SMD applications.
• Low Impedance — Specified impedance of 360 mΩ to support low-loss performance in compact circuits.
• Temperature Range & Endurance — Rated for -55 °C to +105 °C operation with a specified lifetime of 2,000 hours at 105 °C.
• Ripple Current — Rated ripple current at 120 Hz is 120 mA and at 10 kHz is 240 mA, providing defined AC handling capability.
• Tolerance & Polarization — Capacitance tolerance of ±20% and polarized construction.
• Package & Mounting — Chip-type radial can SMD with body dimensions L: 5.8 × D: 6.3 mm and recommended surface-mount land size of 6.6 × 6.6 mm; designed for placement by automatic mounting machines fed with carrier tape.
• Electrical Loss Characteristics — Tangent of loss angle (tan δ) max 0.12 at 120 Hz and 20 °C for the 35 V rating (measurement basis: 120 Hz at 20 °C).
• Compliance & Qualification — AEC-Q200 qualified and compliant to RoHS directives (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Suitable for automotive electronic modules where AEC-Q200 qualification and a wide operating temperature range are required.
• High-Density Surface-Mount PCBs — Designed for surface mounting on compact, high-density boards and compatible with automated carrier-tape assembly.
• SMD Power and Control Modules — Compact radial-can SMD footprint supports integration into small power assemblies and control modules.

Unique Advantages

• Compact SMD Radial-Can Form Factor: Small 5.8 × 6.3 mm body and 6.6 × 6.6 mm recommended land allow dense placement on modern PCBs without sacrificing capacitance.
• Defined Thermal Endurance: Rated lifetime of 2,000 hours at 105 °C provides a measurable reliability metric for thermal design and qualification.
• Automated Assembly Ready: Constructed for carrier-tape feeding and automatic placement, simplifying high-volume manufacturing workflows.
• Automotive-Grade Qualification: AEC-Q200 qualification enables use in designs that require recognized component-level automotive screening.
• Clear AC Handling Specs: Published ripple-current ratings at 120 Hz and 10 kHz give designers concrete values for AC performance budgeting.
• RoHS Compliance: Conforms to RoHS directives, supporting regulatory compliance for many global markets.

Why Choose UCD1V330MCL1GS?

The UCD1V330MCL1GS combines a compact SMD radial-can package with low-impedance performance and defined thermal endurance, making it well suited for applications that demand reliable capacitance in constrained board space. Its AEC-Q200 qualification and wide operating temperature range position it for use in demanding environments where component-level automotive screening and long-term thermal stability are required.

This part is ideal for engineers and procurement teams designing compact power and control modules, high-density surface-mount boards, and automotive electronics that need documented performance parameters and assembly-ready packaging.

If you would like pricing or availability for UCD1V330MCL1GS, request a quote or contact sales with your quantity and application details to receive a formal quotation and lead-time information.