UCD1V470MCL1GS

The UCD1V470MCL1GS from Nichicon is a chip-type, low-impedance aluminum electrolytic capacitor in a compact surface-mount can. It provides 47 µF nominal capacitance at 35 V with a polarized design optimized for high-density PCB assembly and automated placement.

Built for demanding thermal and reliability requirements, this RoHS-compliant, AEC-Q200-rated device supports an operating temperature range of −55 °C to 105 °C and a rated endurance of 2000 hours at 105 °C, making it suitable for applications that require robust, repeatable performance.

Key Features

• Capacitance and Voltage: 47 µF nominal capacitance with a rated voltage of 35 V and tolerance of −20% to +20%.
• Low Impedance Chip Type: Designed as a low-impedance SMD can with specified impedance of 360 mΩ, supporting improved ripple handling in compact layouts.
• Loss Angle (tan δ): tan δ = 0.12 measured at 20 °C, 120 Hz, for predictable dissipation characteristics.
• Ripple Current Capability: Low-frequency ripple current 120 mA at 120 Hz and high-frequency ripple current 240 mA at 10 kHz.
• Leakage Current: Specified leakage current of 16.45 µA.
• Temperature and Endurance: Operating range −55 °C to 105 °C with 2000 hours endurance at 105 °C.
• Compact SMD Package: Can package φ6.3 × 5.8 mm (diameter × length), surface-mount land recommendation L: 6.6 × W: 6.6 mm.
• Assembly-Friendly Packaging: Supplied in embossed carrier taping for automated pick-and-place processing.
• Qualification and Compliance: AEC-Q200 rated and RoHS compliant.
• Polarized Device: Polar construction for conventional electrolytic capacitor applications.

Typical Applications

• Automotive Electronics: AEC-Q200 rating and wide temperature range make this capacitor suitable for automotive electronic modules requiring stable filtering and decoupling.
• High‑Density Surface‑Mount PCBs: Chip-type can and compact footprint are intended for dense board layouts where board real estate is limited.
• Automated Assembly Lines: Embossed carrier taping supports automated soldering and pick-and-place workflows for efficient manufacturing.

Unique Advantages

• Measurable Low Impedance: 360 mΩ impedance specification helps designers quantify ESR-related performance for ripple and transient response.
• Defined Loss Characteristics: tan δ = 0.12 at 20 °C, 120 Hz provides predictable dissipation for thermal and circuit calculations.
• Dual-Frequency Ripple Ratings: Explicit low- and high-frequency ripple current ratings (120 mA @120 Hz, 240 mA @10 kHz) simplify selection for mixed-frequency power systems.
• Automotive-Grade Qualification: AEC-Q200 rating indicates suitability for applications requiring component-level automotive qualification.
• Compact Footprint with Assembly Ready Packaging: φ6.3 × 5.8 mm can size with embossed carrier tape supports compact designs and efficient automated production.
• Robust Thermal Endurance: 2000 hours at 105 °C provides a clear endurance specification for thermal reliability planning.

Why Choose UCD1V470MCL1GS?

The UCD1V470MCL1GS positions itself as a compact, quantifiable solution for designers needing a surface-mount aluminum electrolytic capacitor with defined low-impedance behavior, measurable loss characteristics, and explicit ripple-current ratings. Its AEC-Q200 qualification, wide temperature range, and 2000‑hour endurance at 105 °C make it well suited for automotive-grade and other high-reliability designs implemented on dense PCBs.

Manufactured by Nichicon as part of the UCD series, this part delivers integration-friendly form factor and assembly-ready packaging to streamline production while providing verifiable electrical and thermal specifications for engineering and procurement teams.

To request a quote or submit a procurement inquiry for the UCD1V470MCL1GS, please contact sales with your quantity, required lead time, and application details.