UCD1V471MNL6GS

The UCD1V471MNL6GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount assembly. With a nominal capacitance of 470 µF at 35 V, it targets high-density PCB applications and automated SMD production where compact size and reliable power filtering are required.

Manufactured to meet automotive-grade expectations with AEC-Q200 qualification and RoHS compliance, this part delivers a broad operating temperature range (−55 °C to +105 °C) and extended endurance (5,000 hours at 105 °C) for demanding environments.

Key Features

• Capacitance & Voltage — 470 µF nominal capacitance rated at 35 V for bulk decoupling and energy storage in compact SMD form.
• Low Impedance — Typical impedance of 80 mΩ and tan δ of 0.12 (measured at 20 °C, 120 Hz) to support low-loss performance in power circuits.
• Ripple Current Capability — Low-frequency ripple current 475 mA (120 Hz) and high-frequency ripple current 950 mA (10 kHz) to handle AC stress across frequency ranges.
• Leakage Current — Specified leakage current of 164.5 µA, enabling predictable standby and idle behavior in power systems.
• Temperature & Endurance — Rated for −55 °C to +105 °C with a lifetime/endurance of 5,000 hours at 105 °C for extended field operation.
• Surface-Mount Packaging — φ10 × 13.5 mm can in radial SMD format with embossed carrier taping for automatic placement on production lines.
• Qualification & Compliance — AEC-Q200 qualified and RoHS compliant for regulated and automotive-capable electronics.
• Polarized — Polarized aluminum electrolytic construction for correct orientation in DC circuits.

Typical Applications

• Automotive Systems — AEC-Q200 qualification and −55 °C to +105 °C range make it suitable for automotive electronic assemblies that require SMD electrolytic capacitors.
• High-Density PCBs — Designed for surface mounting on high-density PC boards and compatible with automatic mounting machines fed with carrier tape.
• Automated SMD Production — Embossed carrier taping and chip-type SMD format support high-throughput automated placement and reflow processes.

Unique Advantages

• Compact, high-capacitance SMD — 470 µF in a φ10 × 13.5 mm package provides substantial capacitance in a small board footprint.
• Predictable low-loss behavior — 80 mΩ impedance and tan δ = 0.12 at 120 Hz give designers measurable loss characteristics for power-domain budgeting.
• Robust ripple handling — Defined low- and high-frequency ripple currents (475 mA / 950 mA) enable use across a range of switching and line-frequency conditions.
• Extended high-temperature life — 5,000 hours at 105 °C supports reliability requirements in elevated-temperature environments.
• Automotive-capable qualification — AEC-Q200 rating provides documented qualification for applications with automotive-level expectations.
• Production-ready packaging — Embossed carrier taping simplifies integration into automated manufacturing lines.

Why Choose UCD1V471MNL6GS?

The UCD1V471MNL6GS balances high capacitance and low impedance in a compact SMD aluminum electrolytic package, backed by AEC-Q200 qualification and RoHS compliance. Its defined ripple current ratings, low leakage current, and long endurance at elevated temperature make it a reliable choice for designers targeting robust power filtering and energy storage on densely populated PCBs.

Produced by Nichicon and available in mass production, this part suits engineers and procurement teams building boards where predictable electrical behavior, automated assembly compatibility, and long-term field performance are priorities.

Request a quote or contact sales to discuss availability, lead times, and volume pricing for the UCD1V471MNL6GS.